IT1010903B - Bagno acquoso di ramatura senza passaggio di corrente - Google Patents

Bagno acquoso di ramatura senza passaggio di corrente

Info

Publication number
IT1010903B
IT1010903B IT4263674A IT4263674A IT1010903B IT 1010903 B IT1010903 B IT 1010903B IT 4263674 A IT4263674 A IT 4263674A IT 4263674 A IT4263674 A IT 4263674A IT 1010903 B IT1010903 B IT 1010903B
Authority
IT
Italy
Prior art keywords
current passage
waterproof bathroom
bathroom
waterproof
passage
Prior art date
Application number
IT4263674A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT1010903B publication Critical patent/IT1010903B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IT4263674A 1973-04-04 1974-04-03 Bagno acquoso di ramatura senza passaggio di corrente IT1010903B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (zh) 1973-04-04 1973-04-04

Publications (1)

Publication Number Publication Date
IT1010903B true IT1010903B (it) 1977-01-20

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
IT4263674A IT1010903B (it) 1973-04-04 1974-04-03 Bagno acquoso di ramatura senza passaggio di corrente

Country Status (11)

Country Link
JP (1) JPS5334102B2 (zh)
AT (1) AT326970B (zh)
BE (1) BE813195A (zh)
CA (1) CA1021103A (zh)
CH (1) CH606473A5 (zh)
DE (1) DE2414650C3 (zh)
FR (1) FR2224555B1 (zh)
GB (1) GB1425298A (zh)
IT (1) IT1010903B (zh)
NL (1) NL7304650A (zh)
SE (1) SE392737B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (nl) * 1974-02-22 1975-08-26 Philips Nv Universele verkoperingsoplossing.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
DE10214859B4 (de) 2002-04-04 2004-04-08 Chemetall Gmbh Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür
JP6030848B2 (ja) * 2012-05-07 2016-11-24 上村工業株式会社 無電解銅めっき浴及び無電解銅めっき方法

Also Published As

Publication number Publication date
DE2414650C3 (de) 1978-11-16
DE2414650B2 (de) 1978-03-16
ATA266674A (de) 1975-03-15
BE813195A (fr) 1974-10-02
DE2414650A1 (de) 1974-10-17
FR2224555A1 (zh) 1974-10-31
CA1021103A (en) 1977-11-22
GB1425298A (en) 1976-02-18
SE392737B (sv) 1977-04-18
CH606473A5 (zh) 1978-10-31
NL7304650A (zh) 1974-10-08
AT326970B (de) 1976-01-12
JPS5334102B2 (zh) 1978-09-19
FR2224555B1 (zh) 1976-12-17
JPS49129638A (zh) 1974-12-12

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