GB1414896A - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
GB1414896A
GB1414896A GB207373A GB207373A GB1414896A GB 1414896 A GB1414896 A GB 1414896A GB 207373 A GB207373 A GB 207373A GB 207373 A GB207373 A GB 207373A GB 1414896 A GB1414896 A GB 1414896A
Authority
GB
United Kingdom
Prior art keywords
alkyl
salts
mole
aryl
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB207373A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynachem Corp
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of GB1414896A publication Critical patent/GB1414896A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
GB207373A 1972-01-17 1973-01-15 Electroless copper plating Expired GB1414896A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21845972A 1972-01-17 1972-01-17

Publications (1)

Publication Number Publication Date
GB1414896A true GB1414896A (en) 1975-11-19

Family

ID=22815208

Family Applications (1)

Application Number Title Priority Date Filing Date
GB207373A Expired GB1414896A (en) 1972-01-17 1973-01-15 Electroless copper plating

Country Status (23)

Country Link
US (1) US3790392A (enrdf_load_stackoverflow)
JP (1) JPS5519983B2 (enrdf_load_stackoverflow)
AT (1) AT320372B (enrdf_load_stackoverflow)
AU (1) AU464729B2 (enrdf_load_stackoverflow)
BE (1) BE794048A (enrdf_load_stackoverflow)
CH (1) CH599981A5 (enrdf_load_stackoverflow)
DD (1) DD107490A5 (enrdf_load_stackoverflow)
DE (1) DE2300748C3 (enrdf_load_stackoverflow)
DK (1) DK143948C (enrdf_load_stackoverflow)
ES (1) ES410652A1 (enrdf_load_stackoverflow)
FI (1) FI54500C (enrdf_load_stackoverflow)
FR (1) FR2168364B1 (enrdf_load_stackoverflow)
GB (1) GB1414896A (enrdf_load_stackoverflow)
HK (1) HK65076A (enrdf_load_stackoverflow)
IL (1) IL41331A (enrdf_load_stackoverflow)
IT (1) IT980460B (enrdf_load_stackoverflow)
LU (1) LU66834A1 (enrdf_load_stackoverflow)
NL (1) NL177330C (enrdf_load_stackoverflow)
NO (1) NO135188C (enrdf_load_stackoverflow)
PL (1) PL94000B1 (enrdf_load_stackoverflow)
RO (1) RO69172A (enrdf_load_stackoverflow)
SE (1) SE387664B (enrdf_load_stackoverflow)
ZA (1) ZA73328B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103225092A (zh) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 一种塑料镀铜

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164906C (nl) * 1975-08-19 1981-02-16 Philips Nv Werkwijze voor de bereiding van een waterig alkalische verkoperbad.
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
EP2639335B1 (en) 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
JP6176841B2 (ja) * 2013-07-19 2017-08-09 ローム・アンド・ハース電子材料株式会社 無電解銅めっき液
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192021B (de) * 1963-01-12 1965-04-29 Dehydag Gmbh Galvanische Baeder
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103225092A (zh) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 一种塑料镀铜

Also Published As

Publication number Publication date
FR2168364B1 (enrdf_load_stackoverflow) 1975-03-28
CH599981A5 (enrdf_load_stackoverflow) 1978-06-15
NO135188C (enrdf_load_stackoverflow) 1977-02-23
US3790392A (en) 1974-02-05
DD107490A5 (enrdf_load_stackoverflow) 1974-08-05
DE2300748B2 (de) 1975-03-13
IL41331A (en) 1975-11-25
IT980460B (it) 1974-09-30
DE2300748A1 (de) 1973-07-26
DK143948B (da) 1981-11-02
FI54500C (fi) 1978-12-11
AU5076873A (en) 1974-07-11
ZA73328B (en) 1973-10-31
AT320372B (de) 1975-02-10
LU66834A1 (enrdf_load_stackoverflow) 1973-03-19
IL41331A0 (en) 1973-03-30
AU464729B2 (en) 1975-09-04
NL177330B (nl) 1985-04-01
JPS5519983B2 (enrdf_load_stackoverflow) 1980-05-30
ES410652A1 (es) 1976-01-01
NL177330C (nl) 1985-09-02
NO135188B (enrdf_load_stackoverflow) 1976-11-15
NL7300599A (enrdf_load_stackoverflow) 1973-07-19
JPS4999934A (enrdf_load_stackoverflow) 1974-09-20
FI54500B (fi) 1978-08-31
DE2300748C3 (de) 1975-10-30
FR2168364A1 (enrdf_load_stackoverflow) 1973-08-31
DK143948C (da) 1982-04-19
BE794048A (fr) 1973-07-16
RO69172A (ro) 1980-01-15
SE387664B (sv) 1976-09-13
HK65076A (en) 1976-10-22
PL94000B1 (enrdf_load_stackoverflow) 1977-07-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee