GB1414896A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- GB1414896A GB1414896A GB207373A GB207373A GB1414896A GB 1414896 A GB1414896 A GB 1414896A GB 207373 A GB207373 A GB 207373A GB 207373 A GB207373 A GB 207373A GB 1414896 A GB1414896 A GB 1414896A
- Authority
- GB
- United Kingdom
- Prior art keywords
- alkyl
- salts
- mole
- aryl
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 150000003839 salts Chemical class 0.000 abstract 6
- 125000000217 alkyl group Chemical group 0.000 abstract 3
- 125000003118 aryl group Chemical group 0.000 abstract 3
- -1 substituent halogen Chemical class 0.000 abstract 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 abstract 2
- 239000003381 stabilizer Substances 0.000 abstract 2
- KTLIZDDPOZZHCD-UHFFFAOYSA-N 3-(2-aminoethylamino)propan-1-ol Chemical compound NCCNCCCO KTLIZDDPOZZHCD-UHFFFAOYSA-N 0.000 abstract 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 229910002651 NO3 Inorganic materials 0.000 abstract 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 abstract 1
- 229910019142 PO4 Inorganic materials 0.000 abstract 1
- 101150003085 Pdcl gene Proteins 0.000 abstract 1
- ATTZFSUZZUNHBP-UHFFFAOYSA-N Piperonyl sulfoxide Chemical compound CCCCCCCCS(=O)C(C)CC1=CC=C2OCOC2=C1 ATTZFSUZZUNHBP-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical group O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 abstract 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 abstract 1
- IENXJNLJEDMNTE-UHFFFAOYSA-N acetic acid;ethane-1,2-diamine Chemical class CC(O)=O.NCCN IENXJNLJEDMNTE-UHFFFAOYSA-N 0.000 abstract 1
- 238000013019 agitation Methods 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000004414 alkyl thio group Chemical group 0.000 abstract 1
- 125000003368 amide group Chemical group 0.000 abstract 1
- 125000004104 aryloxy group Chemical group 0.000 abstract 1
- 229910052794 bromium Inorganic materials 0.000 abstract 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 125000001841 imino group Chemical group [H]N=* 0.000 abstract 1
- 229910052740 iodine Inorganic materials 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical class OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 abstract 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 1
- 239000010452 phosphate Substances 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 125000000714 pyrimidinyl group Chemical group 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 125000000547 substituted alkyl group Chemical group 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 150000003892 tartrate salts Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21845972A | 1972-01-17 | 1972-01-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1414896A true GB1414896A (en) | 1975-11-19 |
Family
ID=22815208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB207373A Expired GB1414896A (en) | 1972-01-17 | 1973-01-15 | Electroless copper plating |
Country Status (23)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103225092A (zh) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | 一种塑料镀铜 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL164906C (nl) * | 1975-08-19 | 1981-02-16 | Philips Nv | Werkwijze voor de bereiding van een waterig alkalische verkoperbad. |
US4666858A (en) * | 1984-10-22 | 1987-05-19 | International Business Machines Corporation | Determination of amount of anionic material in a liquid sample |
US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
EP2639335B1 (en) | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
JP6176841B2 (ja) * | 2013-07-19 | 2017-08-09 | ローム・アンド・ハース電子材料株式会社 | 無電解銅めっき液 |
US10060034B2 (en) | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
US10294569B2 (en) | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1192021B (de) * | 1963-01-12 | 1965-04-29 | Dehydag Gmbh | Galvanische Baeder |
US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
US3635758A (en) * | 1969-08-04 | 1972-01-18 | Photocircuits Corp | Electroless metal deposition |
-
0
- BE BE794048D patent/BE794048A/xx not_active IP Right Cessation
-
1972
- 1972-01-17 US US00218459A patent/US3790392A/en not_active Expired - Lifetime
-
1973
- 1973-01-05 AU AU50768/73A patent/AU464729B2/en not_active Expired
- 1973-01-08 AT AT13573A patent/AT320372B/de not_active IP Right Cessation
- 1973-01-08 DE DE2300748A patent/DE2300748C3/de not_active Expired
- 1973-01-11 NO NO123/73A patent/NO135188C/no unknown
- 1973-01-12 SE SE7300440A patent/SE387664B/xx unknown
- 1973-01-15 FR FR7301315A patent/FR2168364B1/fr not_active Expired
- 1973-01-15 GB GB207373A patent/GB1414896A/en not_active Expired
- 1973-01-15 LU LU66834A patent/LU66834A1/xx unknown
- 1973-01-15 CH CH52373A patent/CH599981A5/xx not_active IP Right Cessation
- 1973-01-16 DK DK23573A patent/DK143948C/da not_active IP Right Cessation
- 1973-01-16 ZA ZA730328A patent/ZA73328B/xx unknown
- 1973-01-16 FI FI117/73A patent/FI54500C/fi active
- 1973-01-16 ES ES410652A patent/ES410652A1/es not_active Expired
- 1973-01-16 IT IT67057/73A patent/IT980460B/it active
- 1973-01-16 DD DD168260A patent/DD107490A5/xx unknown
- 1973-01-16 NL NLAANVRAGE7300599,A patent/NL177330C/xx not_active IP Right Cessation
- 1973-01-17 PL PL1973160307A patent/PL94000B1/pl unknown
- 1973-01-17 IL IL41331A patent/IL41331A/xx unknown
- 1973-01-17 RO RO7373524A patent/RO69172A/ro unknown
- 1973-01-17 JP JP774073A patent/JPS5519983B2/ja not_active Expired
-
1976
- 1976-10-14 HK HK650/76*UA patent/HK65076A/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103225092A (zh) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | 一种塑料镀铜 |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0630991A4 (enrdf_load_stackoverflow) | ||
US3075855A (en) | Copper plating process and solutions | |
GB718574A (en) | Bath for the deposit of gold alloys by electroplating | |
GB1414896A (en) | Electroless copper plating | |
GB1310610A (en) | Electro-less nickel plating compositions | |
TW342415B (en) | A process for the deposition of metallic copper on a catalytically activated surface by disproportionation a composition thereof | |
US3637474A (en) | Electrodeposition of palladium | |
JPS54121127A (en) | Photographic processing composition | |
GB1286941A (en) | Chemical reduction copper plating | |
GB1327291A (en) | Non-poisonous zinc-plating baths | |
ES8202068A1 (es) | Un procedimiento para formar un deposito falvanico de zinc sobre un sustrato conductor. | |
DK0754249T3 (da) | Anvendelse af en forbindelse | |
GB1454576A (en) | Electrodeposition of zinc | |
GB1400120A (en) | Electroless deposition of copper | |
ES362632A1 (es) | Un procedimiento de eliminacion del cromo hexavalente en las soluciones electroliticas de cromo trivalente que no contienen iones sulfatos. | |
GB1128306A (en) | Improvements in and relating to chemical copper-plating | |
GB1203131A (en) | Stabilized alkaline coppering liquids for the current-less deposition of copper | |
GB1051383A (enrdf_load_stackoverflow) | ||
GB1168370A (en) | Improvements in and relating to plating Processes | |
GB1305468A (enrdf_load_stackoverflow) | ||
GB1521364A (en) | Electroless copper plating bath | |
GB1425298A (en) | Electroless deposition of copper | |
GB694893A (en) | Copper electro-deposition | |
JPS5770286A (en) | Plating bath composition and plating method | |
JPS5647526A (en) | Nickel removing process |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |