SE387664B - Sett och bad for att genomfora stromlos kopparpletering - Google Patents
Sett och bad for att genomfora stromlos kopparpleteringInfo
- Publication number
- SE387664B SE387664B SE7300440A SE7300440A SE387664B SE 387664 B SE387664 B SE 387664B SE 7300440 A SE7300440 A SE 7300440A SE 7300440 A SE7300440 A SE 7300440A SE 387664 B SE387664 B SE 387664B
- Authority
- SE
- Sweden
- Prior art keywords
- stromless
- bath
- way
- carry out
- copper plating
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21845972A | 1972-01-17 | 1972-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE387664B true SE387664B (sv) | 1976-09-13 |
Family
ID=22815208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7300440A SE387664B (sv) | 1972-01-17 | 1973-01-12 | Sett och bad for att genomfora stromlos kopparpletering |
Country Status (23)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL164906C (nl) * | 1975-08-19 | 1981-02-16 | Philips Nv | Werkwijze voor de bereiding van een waterig alkalische verkoperbad. |
| US4666858A (en) * | 1984-10-22 | 1987-05-19 | International Business Machines Corporation | Determination of amount of anionic material in a liquid sample |
| US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
| EP2639335B1 (en) | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
| CN103225092A (zh) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | 一种塑料镀铜 |
| JP6176841B2 (ja) * | 2013-07-19 | 2017-08-09 | ローム・アンド・ハース電子材料株式会社 | 無電解銅めっき液 |
| US10060034B2 (en) | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
| US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10294569B2 (en) | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1192021B (de) * | 1963-01-12 | 1965-04-29 | Dehydag Gmbh | Galvanische Baeder |
| US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
| US3635758A (en) * | 1969-08-04 | 1972-01-18 | Photocircuits Corp | Electroless metal deposition |
-
0
- BE BE794048D patent/BE794048A/xx not_active IP Right Cessation
-
1972
- 1972-01-17 US US00218459A patent/US3790392A/en not_active Expired - Lifetime
-
1973
- 1973-01-05 AU AU50768/73A patent/AU464729B2/en not_active Expired
- 1973-01-08 AT AT13573A patent/AT320372B/de not_active IP Right Cessation
- 1973-01-08 DE DE2300748A patent/DE2300748C3/de not_active Expired
- 1973-01-11 NO NO123/73A patent/NO135188C/no unknown
- 1973-01-12 SE SE7300440A patent/SE387664B/xx unknown
- 1973-01-15 CH CH52373A patent/CH599981A5/xx not_active IP Right Cessation
- 1973-01-15 GB GB207373A patent/GB1414896A/en not_active Expired
- 1973-01-15 LU LU66834A patent/LU66834A1/xx unknown
- 1973-01-15 FR FR7301315A patent/FR2168364B1/fr not_active Expired
- 1973-01-16 FI FI117/73A patent/FI54500C/fi active
- 1973-01-16 ES ES410652A patent/ES410652A1/es not_active Expired
- 1973-01-16 DD DD168260A patent/DD107490A5/xx unknown
- 1973-01-16 DK DK23573A patent/DK143948C/da not_active IP Right Cessation
- 1973-01-16 IT IT67057/73A patent/IT980460B/it active
- 1973-01-16 NL NLAANVRAGE7300599,A patent/NL177330C/xx not_active IP Right Cessation
- 1973-01-16 ZA ZA730328A patent/ZA73328B/xx unknown
- 1973-01-17 RO RO7373524A patent/RO69172A/ro unknown
- 1973-01-17 JP JP774073A patent/JPS5519983B2/ja not_active Expired
- 1973-01-17 IL IL41331A patent/IL41331A/xx unknown
- 1973-01-17 PL PL1973160307A patent/PL94000B1/pl unknown
-
1976
- 1976-10-14 HK HK650/76*UA patent/HK65076A/xx unknown
Also Published As
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