ES410652A1 - Procedimiento para la deposicon no electrolitica de cobre. - Google Patents

Procedimiento para la deposicon no electrolitica de cobre.

Info

Publication number
ES410652A1
ES410652A1 ES410652A ES410652A ES410652A1 ES 410652 A1 ES410652 A1 ES 410652A1 ES 410652 A ES410652 A ES 410652A ES 410652 A ES410652 A ES 410652A ES 410652 A1 ES410652 A1 ES 410652A1
Authority
ES
Spain
Prior art keywords
copper plating
electroless copper
autodecomposition
organothiophosphate
brightener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES410652A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynachem Corp
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of ES410652A1 publication Critical patent/ES410652A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
ES410652A 1972-01-17 1973-01-16 Procedimiento para la deposicon no electrolitica de cobre. Expired ES410652A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21845972A 1972-01-17 1972-01-17

Publications (1)

Publication Number Publication Date
ES410652A1 true ES410652A1 (es) 1976-01-01

Family

ID=22815208

Family Applications (1)

Application Number Title Priority Date Filing Date
ES410652A Expired ES410652A1 (es) 1972-01-17 1973-01-16 Procedimiento para la deposicon no electrolitica de cobre.

Country Status (23)

Country Link
US (1) US3790392A (enrdf_load_stackoverflow)
JP (1) JPS5519983B2 (enrdf_load_stackoverflow)
AT (1) AT320372B (enrdf_load_stackoverflow)
AU (1) AU464729B2 (enrdf_load_stackoverflow)
BE (1) BE794048A (enrdf_load_stackoverflow)
CH (1) CH599981A5 (enrdf_load_stackoverflow)
DD (1) DD107490A5 (enrdf_load_stackoverflow)
DE (1) DE2300748C3 (enrdf_load_stackoverflow)
DK (1) DK143948C (enrdf_load_stackoverflow)
ES (1) ES410652A1 (enrdf_load_stackoverflow)
FI (1) FI54500C (enrdf_load_stackoverflow)
FR (1) FR2168364B1 (enrdf_load_stackoverflow)
GB (1) GB1414896A (enrdf_load_stackoverflow)
HK (1) HK65076A (enrdf_load_stackoverflow)
IL (1) IL41331A (enrdf_load_stackoverflow)
IT (1) IT980460B (enrdf_load_stackoverflow)
LU (1) LU66834A1 (enrdf_load_stackoverflow)
NL (1) NL177330C (enrdf_load_stackoverflow)
NO (1) NO135188C (enrdf_load_stackoverflow)
PL (1) PL94000B1 (enrdf_load_stackoverflow)
RO (1) RO69172A (enrdf_load_stackoverflow)
SE (1) SE387664B (enrdf_load_stackoverflow)
ZA (1) ZA73328B (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164906C (nl) * 1975-08-19 1981-02-16 Philips Nv Werkwijze voor de bereiding van een waterig alkalische verkoperbad.
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
EP2639335B1 (en) 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
CN103225092A (zh) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 一种塑料镀铜
JP6176841B2 (ja) * 2013-07-19 2017-08-09 ローム・アンド・ハース電子材料株式会社 無電解銅めっき液
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192021B (de) * 1963-01-12 1965-04-29 Dehydag Gmbh Galvanische Baeder
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition

Also Published As

Publication number Publication date
PL94000B1 (enrdf_load_stackoverflow) 1977-07-30
US3790392A (en) 1974-02-05
LU66834A1 (enrdf_load_stackoverflow) 1973-03-19
SE387664B (sv) 1976-09-13
NL177330B (nl) 1985-04-01
JPS4999934A (enrdf_load_stackoverflow) 1974-09-20
NL177330C (nl) 1985-09-02
DK143948C (da) 1982-04-19
DE2300748C3 (de) 1975-10-30
FI54500B (fi) 1978-08-31
DD107490A5 (enrdf_load_stackoverflow) 1974-08-05
FI54500C (fi) 1978-12-11
NO135188B (enrdf_load_stackoverflow) 1976-11-15
AT320372B (de) 1975-02-10
GB1414896A (en) 1975-11-19
DE2300748B2 (de) 1975-03-13
IT980460B (it) 1974-09-30
JPS5519983B2 (enrdf_load_stackoverflow) 1980-05-30
NL7300599A (enrdf_load_stackoverflow) 1973-07-19
AU5076873A (en) 1974-07-11
NO135188C (enrdf_load_stackoverflow) 1977-02-23
FR2168364A1 (enrdf_load_stackoverflow) 1973-08-31
FR2168364B1 (enrdf_load_stackoverflow) 1975-03-28
IL41331A (en) 1975-11-25
DK143948B (da) 1981-11-02
HK65076A (en) 1976-10-22
AU464729B2 (en) 1975-09-04
ZA73328B (en) 1973-10-31
BE794048A (fr) 1973-07-16
RO69172A (ro) 1980-01-15
CH599981A5 (enrdf_load_stackoverflow) 1978-06-15
DE2300748A1 (de) 1973-07-26
IL41331A0 (en) 1973-03-30

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