CA990006A - Bath for the electroless deposition of ductile copper - Google Patents

Bath for the electroless deposition of ductile copper

Info

Publication number
CA990006A
CA990006A CA182,389A CA182389A CA990006A CA 990006 A CA990006 A CA 990006A CA 182389 A CA182389 A CA 182389A CA 990006 A CA990006 A CA 990006A
Authority
CA
Canada
Prior art keywords
bath
electroless deposition
ductile copper
ductile
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA182,389A
Other versions
CA182389S (en
Inventor
Arian Molenaar
Jan Boven
Johannes E.A.M. Van Den Meerakker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA990006A publication Critical patent/CA990006A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
CA182,389A 1972-10-05 1973-10-02 Bath for the electroless deposition of ductile copper Expired CA990006A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (en) 1972-10-05 1972-10-05 BATH FOR STREAMLESS SALES OF PENDANT COPPER.

Publications (1)

Publication Number Publication Date
CA990006A true CA990006A (en) 1976-06-01

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
CA182,389A Expired CA990006A (en) 1972-10-05 1973-10-02 Bath for the electroless deposition of ductile copper

Country Status (12)

Country Link
US (1) US3843373A (en)
JP (1) JPS5435584B2 (en)
AT (1) AT321052B (en)
BE (1) BE805636A (en)
CA (1) CA990006A (en)
CH (1) CH591565A5 (en)
DE (1) DE2346616C3 (en)
FR (1) FR2202168B1 (en)
GB (1) GB1400120A (en)
IT (1) IT996763B (en)
NL (1) NL171176C (en)
SE (1) SE390631B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
SE441530B (en) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M SET AND BATH TO CARRY OUT POWERLESS PREPARATION
JPS6094196U (en) * 1983-12-06 1985-06-27 シャープ株式会社 washing machine
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Also Published As

Publication number Publication date
JPS5435584B2 (en) 1979-11-02
US3843373A (en) 1974-10-22
DE2346616B2 (en) 1977-11-24
DE2346616C3 (en) 1978-07-13
NL171176C (en) 1983-02-16
FR2202168A1 (en) 1974-05-03
JPS4973338A (en) 1974-07-16
BE805636A (en) 1974-04-03
AT321052B (en) 1975-03-10
DE2346616A1 (en) 1974-04-11
IT996763B (en) 1975-12-10
FR2202168B1 (en) 1976-10-01
NL171176B (en) 1982-09-16
SE390631B (en) 1977-01-03
NL7213464A (en) 1974-04-09
CH591565A5 (en) 1977-09-30
GB1400120A (en) 1975-07-16

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