NL171176B - BATH FOR STREAMLESS SALES OF PENDANT COPPER. - Google Patents

BATH FOR STREAMLESS SALES OF PENDANT COPPER.

Info

Publication number
NL171176B
NL171176B NLAANVRAGE7213464,A NL7213464A NL171176B NL 171176 B NL171176 B NL 171176B NL 7213464 A NL7213464 A NL 7213464A NL 171176 B NL171176 B NL 171176B
Authority
NL
Netherlands
Prior art keywords
streamless
pendant
sales
bath
copper
Prior art date
Application number
NLAANVRAGE7213464,A
Other languages
Dutch (nl)
Other versions
NL7213464A (en
NL171176C (en
Inventor
Arian Molenaar
Jan Boven
Johannes Engelbertus Meerakker
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NLAANVRAGE7213464,A priority Critical patent/NL171176C/en
Priority to DE2346616A priority patent/DE2346616C3/en
Priority to US00400880A priority patent/US3843373A/en
Priority to SE7313397A priority patent/SE390631B/en
Priority to AT840773A priority patent/AT321052B/en
Priority to CA182,389A priority patent/CA990006A/en
Priority to CH1407373A priority patent/CH591565A5/xx
Priority to JP11023573A priority patent/JPS5435584B2/ja
Priority to GB4593673A priority patent/GB1400120A/en
Priority to IT69892/73A priority patent/IT996763B/en
Priority to BE136320A priority patent/BE805636A/en
Priority to FR7335326A priority patent/FR2202168B1/fr
Publication of NL7213464A publication Critical patent/NL7213464A/xx
Publication of NL171176B publication Critical patent/NL171176B/en
Application granted granted Critical
Publication of NL171176C publication Critical patent/NL171176C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
NLAANVRAGE7213464,A 1972-10-05 1972-10-05 BATH FOR STREAMLESS SALES OF PENDANT COPPER. NL171176C (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (en) 1972-10-05 1972-10-05 BATH FOR STREAMLESS SALES OF PENDANT COPPER.
DE2346616A DE2346616C3 (en) 1972-10-05 1973-09-15 Bath for the electroless deposition of ductile copper
US00400880A US3843373A (en) 1972-10-05 1973-09-26 Bath for the electroless deposition of ductile copper
AT840773A AT321052B (en) 1972-10-05 1973-10-02 Alkaline, aqueous bath for the electroless deposition of ductile copper
CA182,389A CA990006A (en) 1972-10-05 1973-10-02 Bath for the electroless deposition of ductile copper
CH1407373A CH591565A5 (en) 1972-10-05 1973-10-02
SE7313397A SE390631B (en) 1972-10-05 1973-10-02 ALKALINE AUTOMATIC COPPER COATING BATH
JP11023573A JPS5435584B2 (en) 1972-10-05 1973-10-02
GB4593673A GB1400120A (en) 1972-10-05 1973-10-02 Electroless deposition of copper
IT69892/73A IT996763B (en) 1972-10-05 1973-10-02 BATHROOM FOR THE DEPOSITION OF DUCTILE COPPER WITHOUT THE USE OF ELECTRIC CITA
BE136320A BE805636A (en) 1972-10-05 1973-10-03 FLEXIBLE COPPER CURRENT-FREE DEPOSIT BATH
FR7335326A FR2202168B1 (en) 1972-10-05 1973-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (en) 1972-10-05 1972-10-05 BATH FOR STREAMLESS SALES OF PENDANT COPPER.

Publications (3)

Publication Number Publication Date
NL7213464A NL7213464A (en) 1974-04-09
NL171176B true NL171176B (en) 1982-09-16
NL171176C NL171176C (en) 1983-02-16

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7213464,A NL171176C (en) 1972-10-05 1972-10-05 BATH FOR STREAMLESS SALES OF PENDANT COPPER.

Country Status (12)

Country Link
US (1) US3843373A (en)
JP (1) JPS5435584B2 (en)
AT (1) AT321052B (en)
BE (1) BE805636A (en)
CA (1) CA990006A (en)
CH (1) CH591565A5 (en)
DE (1) DE2346616C3 (en)
FR (1) FR2202168B1 (en)
GB (1) GB1400120A (en)
IT (1) IT996763B (en)
NL (1) NL171176C (en)
SE (1) SE390631B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
SE441530B (en) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M SET AND BATH TO CARRY OUT POWERLESS PREPARATION
JPS6094196U (en) * 1983-12-06 1985-06-27 シャープ株式会社 washing machine
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Also Published As

Publication number Publication date
BE805636A (en) 1974-04-03
US3843373A (en) 1974-10-22
CH591565A5 (en) 1977-09-30
FR2202168A1 (en) 1974-05-03
DE2346616C3 (en) 1978-07-13
NL7213464A (en) 1974-04-09
JPS5435584B2 (en) 1979-11-02
JPS4973338A (en) 1974-07-16
DE2346616A1 (en) 1974-04-11
AT321052B (en) 1975-03-10
CA990006A (en) 1976-06-01
IT996763B (en) 1975-12-10
GB1400120A (en) 1975-07-16
NL171176C (en) 1983-02-16
SE390631B (en) 1977-01-03
DE2346616B2 (en) 1977-11-24
FR2202168B1 (en) 1976-10-01

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee