JPS5435584B2 - - Google Patents

Info

Publication number
JPS5435584B2
JPS5435584B2 JP11023573A JP11023573A JPS5435584B2 JP S5435584 B2 JPS5435584 B2 JP S5435584B2 JP 11023573 A JP11023573 A JP 11023573A JP 11023573 A JP11023573 A JP 11023573A JP S5435584 B2 JPS5435584 B2 JP S5435584B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11023573A
Other versions
JPS4973338A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4973338A publication Critical patent/JPS4973338A/ja
Publication of JPS5435584B2 publication Critical patent/JPS5435584B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP11023573A 1972-10-05 1973-10-02 Expired JPS5435584B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (nl) 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper.

Publications (2)

Publication Number Publication Date
JPS4973338A JPS4973338A (ja) 1974-07-16
JPS5435584B2 true JPS5435584B2 (ja) 1979-11-02

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11023573A Expired JPS5435584B2 (ja) 1972-10-05 1973-10-02

Country Status (12)

Country Link
US (1) US3843373A (ja)
JP (1) JPS5435584B2 (ja)
AT (1) AT321052B (ja)
BE (1) BE805636A (ja)
CA (1) CA990006A (ja)
CH (1) CH591565A5 (ja)
DE (1) DE2346616C3 (ja)
FR (1) FR2202168B1 (ja)
GB (1) GB1400120A (ja)
IT (1) IT996763B (ja)
NL (1) NL171176C (ja)
SE (1) SE390631B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238704Y2 (ja) * 1983-12-06 1990-10-18
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
SE441530B (sv) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M Sett och bad for att utfora stromlos forkoppring
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238704Y2 (ja) * 1983-12-06 1990-10-18
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus

Also Published As

Publication number Publication date
BE805636A (fr) 1974-04-03
IT996763B (it) 1975-12-10
GB1400120A (en) 1975-07-16
DE2346616B2 (de) 1977-11-24
NL171176C (nl) 1983-02-16
US3843373A (en) 1974-10-22
NL171176B (nl) 1982-09-16
FR2202168A1 (ja) 1974-05-03
JPS4973338A (ja) 1974-07-16
DE2346616A1 (de) 1974-04-11
NL7213464A (ja) 1974-04-09
AT321052B (de) 1975-03-10
SE390631B (sv) 1977-01-03
CA990006A (en) 1976-06-01
FR2202168B1 (ja) 1976-10-01
CH591565A5 (ja) 1977-09-30
DE2346616C3 (de) 1978-07-13

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