SE390631B - Alkaliskt vattenhaltigt kopparbeleggningsbad - Google Patents

Alkaliskt vattenhaltigt kopparbeleggningsbad

Info

Publication number
SE390631B
SE390631B SE7313397A SE7313397A SE390631B SE 390631 B SE390631 B SE 390631B SE 7313397 A SE7313397 A SE 7313397A SE 7313397 A SE7313397 A SE 7313397A SE 390631 B SE390631 B SE 390631B
Authority
SE
Sweden
Prior art keywords
coating bath
copper coating
automatic copper
alkaline automatic
alkaline
Prior art date
Application number
SE7313397A
Other languages
English (en)
Swedish (sv)
Inventor
A Molenaar
J Boven
Den Meerakker J E A M Van
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE390631B publication Critical patent/SE390631B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SE7313397A 1972-10-05 1973-10-02 Alkaliskt vattenhaltigt kopparbeleggningsbad SE390631B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (nl) 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper.

Publications (1)

Publication Number Publication Date
SE390631B true SE390631B (sv) 1977-01-03

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7313397A SE390631B (sv) 1972-10-05 1973-10-02 Alkaliskt vattenhaltigt kopparbeleggningsbad

Country Status (12)

Country Link
US (1) US3843373A (xx)
JP (1) JPS5435584B2 (xx)
AT (1) AT321052B (xx)
BE (1) BE805636A (xx)
CA (1) CA990006A (xx)
CH (1) CH591565A5 (xx)
DE (1) DE2346616C3 (xx)
FR (1) FR2202168B1 (xx)
GB (1) GB1400120A (xx)
IT (1) IT996763B (xx)
NL (1) NL171176C (xx)
SE (1) SE390631B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1982002063A1 (en) * 1980-12-09 1982-06-24 Showronek Jerzy Method for chemical copper plating and bath to perform the method

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
JPS6094196U (ja) * 1983-12-06 1985-06-27 シャープ株式会社 洗濯機
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1982002063A1 (en) * 1980-12-09 1982-06-24 Showronek Jerzy Method for chemical copper plating and bath to perform the method

Also Published As

Publication number Publication date
NL171176C (nl) 1983-02-16
FR2202168B1 (xx) 1976-10-01
JPS5435584B2 (xx) 1979-11-02
BE805636A (fr) 1974-04-03
DE2346616B2 (de) 1977-11-24
GB1400120A (en) 1975-07-16
NL7213464A (xx) 1974-04-09
JPS4973338A (xx) 1974-07-16
US3843373A (en) 1974-10-22
AT321052B (de) 1975-03-10
CA990006A (en) 1976-06-01
DE2346616A1 (de) 1974-04-11
IT996763B (it) 1975-12-10
CH591565A5 (xx) 1977-09-30
DE2346616C3 (de) 1978-07-13
NL171176B (nl) 1982-09-16
FR2202168A1 (xx) 1974-05-03

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