AT321052B - Alkalisches wässeriges Bad zum stromlosen Abscheiden von duktilem Kupfer - Google Patents

Alkalisches wässeriges Bad zum stromlosen Abscheiden von duktilem Kupfer

Info

Publication number
AT321052B
AT321052B AT840773A AT840773A AT321052B AT 321052 B AT321052 B AT 321052B AT 840773 A AT840773 A AT 840773A AT 840773 A AT840773 A AT 840773A AT 321052 B AT321052 B AT 321052B
Authority
AT
Austria
Prior art keywords
alkaline
electroless deposition
aqueous bath
ductile copper
ductile
Prior art date
Application number
AT840773A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT321052B publication Critical patent/AT321052B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AT840773A 1972-10-05 1973-10-02 Alkalisches wässeriges Bad zum stromlosen Abscheiden von duktilem Kupfer AT321052B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (nl) 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper.

Publications (1)

Publication Number Publication Date
AT321052B true AT321052B (de) 1975-03-10

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
AT840773A AT321052B (de) 1972-10-05 1973-10-02 Alkalisches wässeriges Bad zum stromlosen Abscheiden von duktilem Kupfer

Country Status (12)

Country Link
US (1) US3843373A (de)
JP (1) JPS5435584B2 (de)
AT (1) AT321052B (de)
BE (1) BE805636A (de)
CA (1) CA990006A (de)
CH (1) CH591565A5 (de)
DE (1) DE2346616C3 (de)
FR (1) FR2202168B1 (de)
GB (1) GB1400120A (de)
IT (1) IT996763B (de)
NL (1) NL171176C (de)
SE (1) SE390631B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
SE441530B (sv) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M Sett och bad for att utfora stromlos forkoppring
JPS6094196U (ja) * 1983-12-06 1985-06-27 シャープ株式会社 洗濯機
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Also Published As

Publication number Publication date
SE390631B (sv) 1977-01-03
DE2346616B2 (de) 1977-11-24
FR2202168B1 (de) 1976-10-01
US3843373A (en) 1974-10-22
CA990006A (en) 1976-06-01
NL171176C (nl) 1983-02-16
BE805636A (fr) 1974-04-03
DE2346616A1 (de) 1974-04-11
GB1400120A (en) 1975-07-16
FR2202168A1 (de) 1974-05-03
DE2346616C3 (de) 1978-07-13
JPS5435584B2 (de) 1979-11-02
NL7213464A (de) 1974-04-09
JPS4973338A (de) 1974-07-16
NL171176B (nl) 1982-09-16
IT996763B (it) 1975-12-10
CH591565A5 (de) 1977-09-30

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Legal Events

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ELJ Ceased due to non-payment of the annual fee