IT996763B - BATHROOM FOR THE DEPOSITION OF DUCTILE COPPER WITHOUT THE USE OF ELECTRIC CITA - Google Patents

BATHROOM FOR THE DEPOSITION OF DUCTILE COPPER WITHOUT THE USE OF ELECTRIC CITA

Info

Publication number
IT996763B
IT996763B IT69892/73A IT6989273A IT996763B IT 996763 B IT996763 B IT 996763B IT 69892/73 A IT69892/73 A IT 69892/73A IT 6989273 A IT6989273 A IT 6989273A IT 996763 B IT996763 B IT 996763B
Authority
IT
Italy
Prior art keywords
cita
bathroom
deposition
electric
ductile copper
Prior art date
Application number
IT69892/73A
Other languages
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT996763B publication Critical patent/IT996763B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IT69892/73A 1972-10-05 1973-10-02 BATHROOM FOR THE DEPOSITION OF DUCTILE COPPER WITHOUT THE USE OF ELECTRIC CITA IT996763B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (en) 1972-10-05 1972-10-05 BATH FOR STREAMLESS SALES OF PENDANT COPPER.

Publications (1)

Publication Number Publication Date
IT996763B true IT996763B (en) 1975-12-10

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
IT69892/73A IT996763B (en) 1972-10-05 1973-10-02 BATHROOM FOR THE DEPOSITION OF DUCTILE COPPER WITHOUT THE USE OF ELECTRIC CITA

Country Status (12)

Country Link
US (1) US3843373A (en)
JP (1) JPS5435584B2 (en)
AT (1) AT321052B (en)
BE (1) BE805636A (en)
CA (1) CA990006A (en)
CH (1) CH591565A5 (en)
DE (1) DE2346616C3 (en)
FR (1) FR2202168B1 (en)
GB (1) GB1400120A (en)
IT (1) IT996763B (en)
NL (1) NL171176C (en)
SE (1) SE390631B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
SE441530B (en) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M SET AND BATH TO CARRY OUT POWERLESS PREPARATION
JPS6094196U (en) * 1983-12-06 1985-06-27 シャープ株式会社 washing machine
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Also Published As

Publication number Publication date
BE805636A (en) 1974-04-03
US3843373A (en) 1974-10-22
CH591565A5 (en) 1977-09-30
FR2202168A1 (en) 1974-05-03
NL171176B (en) 1982-09-16
DE2346616C3 (en) 1978-07-13
NL7213464A (en) 1974-04-09
JPS5435584B2 (en) 1979-11-02
JPS4973338A (en) 1974-07-16
DE2346616A1 (en) 1974-04-11
AT321052B (en) 1975-03-10
CA990006A (en) 1976-06-01
GB1400120A (en) 1975-07-16
NL171176C (en) 1983-02-16
SE390631B (en) 1977-01-03
DE2346616B2 (en) 1977-11-24
FR2202168B1 (en) 1976-10-01

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