CA947458A - Electroless deposition of ductile copper - Google Patents

Electroless deposition of ductile copper

Info

Publication number
CA947458A
CA947458A CA095,339A CA95339A CA947458A CA 947458 A CA947458 A CA 947458A CA 95339 A CA95339 A CA 95339A CA 947458 A CA947458 A CA 947458A
Authority
CA
Canada
Prior art keywords
electroless deposition
ductile copper
ductile
copper
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA095,339A
Other versions
CA95339S (en
Inventor
Hendrik Jonker
Eise B. Geertsema
Arian Molenaar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA947458A publication Critical patent/CA947458A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA095,339A 1969-10-16 1970-10-13 Electroless deposition of ductile copper Expired CA947458A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6915718A NL6915718A (en) 1969-10-16 1969-10-16

Publications (1)

Publication Number Publication Date
CA947458A true CA947458A (en) 1974-05-21

Family

ID=19808149

Family Applications (1)

Application Number Title Priority Date Filing Date
CA095,339A Expired CA947458A (en) 1969-10-16 1970-10-13 Electroless deposition of ductile copper

Country Status (11)

Country Link
US (1) US3804638A (en)
AT (1) AT311145B (en)
AU (1) AU2101370A (en)
BE (1) BE757573A (en)
CA (1) CA947458A (en)
CH (1) CH550255A (en)
DE (1) DE2049061C3 (en)
FR (1) FR2065996A5 (en)
GB (1) GB1330332A (en)
HK (1) HK49576A (en)
NL (1) NL6915718A (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (en) * 1975-03-14 1981-06-25
US4171225A (en) 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating
IT1157006B (en) * 1982-03-09 1987-02-11 Alfachimici Spa STABILIZING MIXTURE FOR A CHEMICAL COPPER BATH
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
EP0132594B1 (en) * 1983-07-25 1988-09-07 Hitachi, Ltd. Electroless copper plating solution
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) * 2003-07-23 2005-01-27 Jon Bengston Stabilizer for electroless copper plating solution
US7534298B2 (en) * 2003-09-19 2009-05-19 Applied Materials, Inc. Apparatus and method of detecting the electroless deposition endpoint
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) * 2004-09-17 2006-03-23 Applied Materials, Inc Patterned wafer thickness detection system
ES2622411T3 (en) * 2005-06-10 2017-07-06 Enthone, Inc. Procedure for direct metallization of non-conductive substrates
JP6388910B2 (en) * 2013-03-27 2018-09-12 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ Electroless copper plating solution
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (en) * 2019-08-15 2019-11-26 深南电路股份有限公司 The processing method and processing unit of printed wiring board waste water
CN113388829A (en) * 2021-06-11 2021-09-14 惠州金晟新电子科技有限公司 Electroless copper plating solution and method for plating copper on substrate by using electroless copper plating solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US3300335A (en) * 1963-11-20 1967-01-24 Dow Chemical Co Electroless metal plating with foam
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating
US3515563A (en) * 1967-12-28 1970-06-02 Photocircuits Corp Autocatalytic metal plating solutions

Also Published As

Publication number Publication date
US3804638A (en) 1974-04-16
HK49576A (en) 1976-08-06
GB1330332A (en) 1973-09-19
DE2049061A1 (en) 1971-04-29
BE757573A (en) 1971-04-15
DE2049061C3 (en) 1981-04-30
AU2101370A (en) 1972-04-20
NL6915718A (en) 1971-04-20
DE2049061B2 (en) 1980-07-24
FR2065996A5 (en) 1971-08-06
CH550255A (en) 1974-06-14
AT311145B (en) 1973-10-25

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