GB1347936A - Plating copper on aluminium - Google Patents
Plating copper on aluminiumInfo
- Publication number
- GB1347936A GB1347936A GB1657372A GB1657372A GB1347936A GB 1347936 A GB1347936 A GB 1347936A GB 1657372 A GB1657372 A GB 1657372A GB 1657372 A GB1657372 A GB 1657372A GB 1347936 A GB1347936 A GB 1347936A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plating
- ions
- complex
- plated
- electro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 title abstract 8
- 238000007747 plating Methods 0.000 title abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 239000004411 aluminium Substances 0.000 title abstract 2
- 229910052782 aluminium Inorganic materials 0.000 title abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 150000001412 amines Chemical class 0.000 abstract 3
- 150000002500 ions Chemical class 0.000 abstract 3
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 abstract 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 abstract 2
- 229910021529 ammonia Inorganic materials 0.000 abstract 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 abstract 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 abstract 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 1
- 229910017855 NH 4 F Inorganic materials 0.000 abstract 1
- 229910002651 NO3 Inorganic materials 0.000 abstract 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000908 ammonium hydroxide Substances 0.000 abstract 1
- 238000005282 brightening Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 abstract 1
- 239000004312 hexamethylene tetramine Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE110362 | 1971-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1347936A true GB1347936A (en) | 1974-02-27 |
Family
ID=3841568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1657372A Expired GB1347936A (en) | 1971-11-10 | 1972-04-11 | Plating copper on aluminium |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3775264A (enrdf_load_stackoverflow) |
| CA (1) | CA1001581A (enrdf_load_stackoverflow) |
| DE (1) | DE2249037A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2159239B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1347936A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994008276A1 (en) * | 1992-09-28 | 1994-04-14 | Ducoa L.P. | Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide |
| CN103225091A (zh) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | 一种铝材镀铜液 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4086146A (en) * | 1975-11-12 | 1978-04-25 | W. R. Grace & Co. | Water treating process |
| TW562878B (en) * | 2000-06-30 | 2003-11-21 | Ebara Corp | Copper-plating liquid, plating method and plating apparatus |
| FR2818294A1 (fr) * | 2000-12-15 | 2002-06-21 | Thomson Csf | Revetement metallique conducteur anticorrosion, procede de fabrication dudit revetement, et produit utilise dans ledit procede |
| CN102212855B (zh) * | 2011-05-20 | 2012-07-11 | 湘潭大学 | 一种具有高耐腐蚀性能的可锡焊铝带及其制备工艺 |
| FR3053352A1 (fr) | 2016-07-04 | 2018-01-05 | Airbus Safran Launchers Sas | Composition de protection anticorrosion |
| US11664134B2 (en) * | 2019-04-26 | 2023-05-30 | Sumitomo Electric Industries, Ltd. | Aluminum base wire, stranded wire, and method for manufacturing aluminum base wire |
| CN111769300B (zh) * | 2020-02-28 | 2023-06-30 | 上海市机电设计研究院有限公司 | 全钒液流电池用铝基镀铜集流板的制备方法 |
| TWI800244B (zh) * | 2022-01-28 | 2023-04-21 | 奇鋐科技股份有限公司 | 具有熱管之散熱器總成 |
| CN118316266A (zh) * | 2023-01-06 | 2024-07-09 | 通用汽车环球科技运作有限责任公司 | 中空铜电导体 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2195454A (en) * | 1939-01-07 | 1940-04-02 | Louis Weisberg Inc | Electrodeposition of copper |
| US2872346A (en) * | 1956-05-21 | 1959-02-03 | Miller Adolph | Metal plating bath |
| NL100908C (enrdf_load_stackoverflow) * | 1956-10-22 | |||
| SU116447A1 (ru) * | 1958-06-11 | 1958-11-30 | А.М. Ямпольский | Способ нанесени медных покрытий электролизом нецианистых электролитов |
| NL267368A (enrdf_load_stackoverflow) * | 1960-07-23 | |||
| US3280736A (en) * | 1964-06-08 | 1966-10-25 | Metalgamica S A | Multi-metal planographic printing plates |
| CA898183A (en) * | 1970-05-25 | 1972-04-18 | R. Bharucha Nanabhai | Method of plating copper on aluminum |
-
1972
- 1972-02-15 CA CA134,787A patent/CA1001581A/en not_active Expired
- 1972-03-09 US US00233361A patent/US3775264A/en not_active Expired - Lifetime
- 1972-04-11 GB GB1657372A patent/GB1347936A/en not_active Expired
- 1972-04-25 FR FR7214666A patent/FR2159239B1/fr not_active Expired
- 1972-10-06 DE DE2249037A patent/DE2249037A1/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994008276A1 (en) * | 1992-09-28 | 1994-04-14 | Ducoa L.P. | Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide |
| CN103225091A (zh) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | 一种铝材镀铜液 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2159239A1 (enrdf_load_stackoverflow) | 1973-06-22 |
| CA1001581A (en) | 1976-12-14 |
| US3775264A (en) | 1973-11-27 |
| DE2249037A1 (de) | 1973-05-17 |
| FR2159239B1 (enrdf_load_stackoverflow) | 1977-06-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLE | Entries relating assignments, transmissions, licences in the register of patents | ||
| PCNP | Patent ceased through non-payment of renewal fee |