GB1313537A - Alumina palladium composite - Google Patents

Alumina palladium composite

Info

Publication number
GB1313537A
GB1313537A GB2820770A GB2820770A GB1313537A GB 1313537 A GB1313537 A GB 1313537A GB 2820770 A GB2820770 A GB 2820770A GB 2820770 A GB2820770 A GB 2820770A GB 1313537 A GB1313537 A GB 1313537A
Authority
GB
United Kingdom
Prior art keywords
substrate
palladium
gold
connector
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2820770A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of GB1313537A publication Critical patent/GB1313537A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Compositions Of Oxide Ceramics (AREA)
GB2820770A 1969-06-10 1970-06-10 Alumina palladium composite Expired GB1313537A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83191169A 1969-06-10 1969-06-10
US83480369A 1969-06-19 1969-06-19

Publications (1)

Publication Number Publication Date
GB1313537A true GB1313537A (en) 1973-04-11

Family

ID=27125475

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2820770A Expired GB1313537A (en) 1969-06-10 1970-06-10 Alumina palladium composite

Country Status (4)

Country Link
CA (1) CA942433A (https=)
DE (1) DE2028605A1 (https=)
FR (1) FR2049170B2 (https=)
GB (1) GB1313537A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124830A (en) * 1982-07-30 1984-02-22 Xerox Corp Electrical circuit assembly
US10682952B2 (en) 2017-06-28 2020-06-16 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US10742061B2 (en) 2017-06-28 2020-08-11 Honda Motor Co., Ltd. Smart functional leather for recharging a portable electronic device
US10946797B2 (en) 2017-06-28 2021-03-16 Honda Motor Co., Ltd. Smart functional leather for steering wheel and dash board
US10953793B2 (en) 2017-06-28 2021-03-23 Honda Motor Co., Ltd. Haptic function leather component and method of making the same
US11665830B2 (en) 2017-06-28 2023-05-30 Honda Motor Co., Ltd. Method of making smart functional leather
US11751337B2 (en) 2019-04-26 2023-09-05 Honda Motor Co., Ltd. Wireless power of in-mold electronics and the application within a vehicle

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3210503B2 (ja) * 1993-09-30 2001-09-17 株式会社東芝 マルチチップモジュールおよびその製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124830A (en) * 1982-07-30 1984-02-22 Xerox Corp Electrical circuit assembly
US10682952B2 (en) 2017-06-28 2020-06-16 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US10742061B2 (en) 2017-06-28 2020-08-11 Honda Motor Co., Ltd. Smart functional leather for recharging a portable electronic device
US10946797B2 (en) 2017-06-28 2021-03-16 Honda Motor Co., Ltd. Smart functional leather for steering wheel and dash board
US10953793B2 (en) 2017-06-28 2021-03-23 Honda Motor Co., Ltd. Haptic function leather component and method of making the same
US11027647B2 (en) 2017-06-28 2021-06-08 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US11665830B2 (en) 2017-06-28 2023-05-30 Honda Motor Co., Ltd. Method of making smart functional leather
US11827143B2 (en) 2017-06-28 2023-11-28 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US11751337B2 (en) 2019-04-26 2023-09-05 Honda Motor Co., Ltd. Wireless power of in-mold electronics and the application within a vehicle

Also Published As

Publication number Publication date
FR2049170B2 (https=) 1973-02-02
CA942433A (en) 1974-02-19
DE2028605A1 (https=) 1970-12-17
FR2049170A2 (https=) 1971-03-26

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee