DE2028605A1 - - Google Patents

Info

Publication number
DE2028605A1
DE2028605A1 DE19702028605 DE2028605A DE2028605A1 DE 2028605 A1 DE2028605 A1 DE 2028605A1 DE 19702028605 DE19702028605 DE 19702028605 DE 2028605 A DE2028605 A DE 2028605A DE 2028605 A1 DE2028605 A1 DE 2028605A1
Authority
DE
Germany
Prior art keywords
palladium
ceramic
carrier plate
coating
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702028605
Other languages
German (de)
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE2028605A1 publication Critical patent/DE2028605A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Compositions Of Oxide Ceramics (AREA)
DE19702028605 1969-06-10 1970-06-10 Pending DE2028605A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83191169A 1969-06-10 1969-06-10
US83480369A 1969-06-19 1969-06-19

Publications (1)

Publication Number Publication Date
DE2028605A1 true DE2028605A1 (https=) 1970-12-17

Family

ID=27125475

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702028605 Pending DE2028605A1 (https=) 1969-06-10 1970-06-10

Country Status (4)

Country Link
CA (1) CA942433A (https=)
DE (1) DE2028605A1 (https=)
FR (1) FR2049170B2 (https=)
GB (1) GB1313537A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0646963A1 (en) * 1993-09-30 1995-04-05 Kabushiki Kaisha Toshiba Multi-chip module and manufacturing method thereof

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2531302A1 (fr) * 1982-07-30 1984-02-03 Xerox Corp Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit
US11665830B2 (en) 2017-06-28 2023-05-30 Honda Motor Co., Ltd. Method of making smart functional leather
US10742061B2 (en) 2017-06-28 2020-08-11 Honda Motor Co., Ltd. Smart functional leather for recharging a portable electronic device
US10682952B2 (en) 2017-06-28 2020-06-16 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US10953793B2 (en) 2017-06-28 2021-03-23 Honda Motor Co., Ltd. Haptic function leather component and method of making the same
US10272836B2 (en) 2017-06-28 2019-04-30 Honda Motor Co., Ltd. Smart functional leather for steering wheel and dash board
US11751337B2 (en) 2019-04-26 2023-09-05 Honda Motor Co., Ltd. Wireless power of in-mold electronics and the application within a vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0646963A1 (en) * 1993-09-30 1995-04-05 Kabushiki Kaisha Toshiba Multi-chip module and manufacturing method thereof

Also Published As

Publication number Publication date
FR2049170B2 (https=) 1973-02-02
CA942433A (en) 1974-02-19
FR2049170A2 (https=) 1971-03-26
GB1313537A (en) 1973-04-11

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