CA942433A - Alumina palladium composite - Google Patents

Alumina palladium composite

Info

Publication number
CA942433A
CA942433A CA085,064A CA85064A CA942433A CA 942433 A CA942433 A CA 942433A CA 85064 A CA85064 A CA 85064A CA 942433 A CA942433 A CA 942433A
Authority
CA
Canada
Prior art keywords
palladium composite
alumina palladium
alumina
composite
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA085,064A
Other languages
English (en)
Inventor
Joseph T. Bailey
Paul R. Theobald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of CA942433A publication Critical patent/CA942433A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
CA085,064A 1969-06-10 1970-06-09 Alumina palladium composite Expired CA942433A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83191169A 1969-06-10 1969-06-10
US83480369A 1969-06-19 1969-06-19

Publications (1)

Publication Number Publication Date
CA942433A true CA942433A (en) 1974-02-19

Family

ID=27125475

Family Applications (1)

Application Number Title Priority Date Filing Date
CA085,064A Expired CA942433A (en) 1969-06-10 1970-06-09 Alumina palladium composite

Country Status (4)

Country Link
CA (1) CA942433A (https=)
DE (1) DE2028605A1 (https=)
FR (1) FR2049170B2 (https=)
GB (1) GB1313537A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2531302A1 (fr) * 1982-07-30 1984-02-03 Xerox Corp Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit
JP3210503B2 (ja) * 1993-09-30 2001-09-17 株式会社東芝 マルチチップモジュールおよびその製造方法
US11665830B2 (en) 2017-06-28 2023-05-30 Honda Motor Co., Ltd. Method of making smart functional leather
US10742061B2 (en) 2017-06-28 2020-08-11 Honda Motor Co., Ltd. Smart functional leather for recharging a portable electronic device
US10682952B2 (en) 2017-06-28 2020-06-16 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US10953793B2 (en) 2017-06-28 2021-03-23 Honda Motor Co., Ltd. Haptic function leather component and method of making the same
US10272836B2 (en) 2017-06-28 2019-04-30 Honda Motor Co., Ltd. Smart functional leather for steering wheel and dash board
US11751337B2 (en) 2019-04-26 2023-09-05 Honda Motor Co., Ltd. Wireless power of in-mold electronics and the application within a vehicle

Also Published As

Publication number Publication date
FR2049170B2 (https=) 1973-02-02
DE2028605A1 (https=) 1970-12-17
FR2049170A2 (https=) 1971-03-26
GB1313537A (en) 1973-04-11

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