GB1285708A - Semi-conductor devices - Google Patents

Semi-conductor devices

Info

Publication number
GB1285708A
GB1285708A GB24991/69A GB2499169A GB1285708A GB 1285708 A GB1285708 A GB 1285708A GB 24991/69 A GB24991/69 A GB 24991/69A GB 2499169 A GB2499169 A GB 2499169A GB 1285708 A GB1285708 A GB 1285708A
Authority
GB
United Kingdom
Prior art keywords
wafer
devices
wax
channels
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24991/69A
Other languages
English (en)
Inventor
Dennis George Goodman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB24991/69A priority Critical patent/GB1285708A/en
Priority to GB8941/72A priority patent/GB1285709A/en
Priority to US00863984A priority patent/US3756872A/en
Priority to CH1540669A priority patent/CH522955A/de
Priority to CH232572A priority patent/CH557091A/de
Priority to SE7204684A priority patent/SE376684B/xx
Priority to SE14326/69A priority patent/SE363930B/xx
Priority to AT993069A priority patent/AT310253B/de
Priority to FR6936022A priority patent/FR2021690B1/fr
Priority to ES373341A priority patent/ES373341A1/es
Priority to CS1478*[A priority patent/CS168552B2/cs
Priority to BE740836D priority patent/BE740836A/xx
Priority to DK566969AA priority patent/DK135071B/da
Priority to NL696916239A priority patent/NL154868B/xx
Priority to DE19691954265 priority patent/DE1954265A1/de
Priority to ES399979A priority patent/ES399979A1/es
Publication of GB1285708A publication Critical patent/GB1285708A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Weting (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
GB24991/69A 1968-10-28 1968-10-28 Semi-conductor devices Expired GB1285708A (en)

Priority Applications (16)

Application Number Priority Date Filing Date Title
GB24991/69A GB1285708A (en) 1968-10-28 1968-10-28 Semi-conductor devices
GB8941/72A GB1285709A (en) 1968-10-28 1968-10-28 A method of manufacturing semi-conductor devices
US00863984A US3756872A (en) 1968-10-28 1969-10-06 Method of making non-planar semiconductor devices
CH1540669A CH522955A (de) 1968-10-28 1969-10-14 Verfahren zur Herstellung einer Halbleitervorrichtung sowie nach dem Verfahren hergestellte Halbleitervorrichtung
CH232572A CH557091A (de) 1968-10-28 1969-10-14 Verfahren zur herstellung von halbleitervorrichtungen.
SE7204684A SE376684B (cg-RX-API-DMAC10.html) 1968-10-28 1969-10-20
SE14326/69A SE363930B (cg-RX-API-DMAC10.html) 1968-10-28 1969-10-20
AT993069A AT310253B (de) 1968-10-28 1969-10-21 Verfahren zur Herstellung von Halbleitern, insbesondere Halbleiterdioden
FR6936022A FR2021690B1 (cg-RX-API-DMAC10.html) 1968-10-28 1969-10-21
ES373341A ES373341A1 (es) 1968-10-28 1969-10-25 Metodo de fabricacion de dispositivos semiconductores.
CS1478*[A CS168552B2 (cg-RX-API-DMAC10.html) 1968-10-28 1969-10-25
BE740836D BE740836A (cg-RX-API-DMAC10.html) 1968-10-28 1969-10-27
DK566969AA DK135071B (da) 1968-10-28 1969-10-27 Fremgangsmåde til fremstilling af halvlederelementer.
NL696916239A NL154868B (nl) 1968-10-28 1969-10-28 Werkwijze voor het vervaardigen van halfgeleiderinrichtingen en halfgeleiderinrichtingen volgens deze werkwijze verkregen.
DE19691954265 DE1954265A1 (de) 1968-10-28 1969-10-28 Halbleiter-Bauelement und Verfahren zur Herstellung desselben
ES399979A ES399979A1 (es) 1968-10-28 1972-02-09 Procedimiento de fabricacion de dispositivos semiconducto- res.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB5103568 1968-10-28
GB24991/69A GB1285708A (en) 1968-10-28 1968-10-28 Semi-conductor devices

Publications (1)

Publication Number Publication Date
GB1285708A true GB1285708A (en) 1972-08-16

Family

ID=26257416

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24991/69A Expired GB1285708A (en) 1968-10-28 1968-10-28 Semi-conductor devices

Country Status (12)

Country Link
US (1) US3756872A (cg-RX-API-DMAC10.html)
AT (1) AT310253B (cg-RX-API-DMAC10.html)
BE (1) BE740836A (cg-RX-API-DMAC10.html)
CH (1) CH522955A (cg-RX-API-DMAC10.html)
CS (1) CS168552B2 (cg-RX-API-DMAC10.html)
DE (1) DE1954265A1 (cg-RX-API-DMAC10.html)
DK (1) DK135071B (cg-RX-API-DMAC10.html)
ES (2) ES373341A1 (cg-RX-API-DMAC10.html)
FR (1) FR2021690B1 (cg-RX-API-DMAC10.html)
GB (1) GB1285708A (cg-RX-API-DMAC10.html)
NL (1) NL154868B (cg-RX-API-DMAC10.html)
SE (2) SE363930B (cg-RX-API-DMAC10.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1335201A (en) * 1970-05-21 1973-10-24 Lucas Industries Ltd Method of manufacturing semi-conductor devices
FR2100997B1 (cg-RX-API-DMAC10.html) * 1970-08-04 1973-12-21 Silec Semi Conducteurs
JPS5527463B2 (cg-RX-API-DMAC10.html) * 1973-02-28 1980-07-21
IT1059086B (it) * 1976-04-14 1982-05-31 Ates Componenti Elettron Procedimento per la passivazione di dispositivi a semiconduttore di potenza ad alta tensione inversa
DE2929339A1 (de) * 1978-07-24 1980-02-14 Citizen Watch Co Ltd Halbleiteranordnung
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
DE3621796A1 (de) * 1986-06-30 1988-01-07 Siemens Ag Verfahren zur verbesserung der nebensprechdaempfung bei einer optisch-elektronischen sensoranordnung
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
DE19604405C2 (de) * 1996-02-07 2002-10-10 Micronas Gmbh Verfahren zum Vereinzeln von in einem Körper enthaltenen elektronischen Elementen
FR2782843B1 (fr) * 1998-08-25 2000-09-29 Commissariat Energie Atomique Procede d'isolation physique de regions d'une plaque de substrat
DE10055763A1 (de) * 2000-11-10 2002-05-23 Infineon Technologies Ag Verfahren zur Herstellung einer hochtemperaturfesten Verbindung zwischen zwei Wafern
DE10158307A1 (de) * 2001-11-28 2003-02-20 Infineon Technologies Ag Verfahren zum Anschließen von Schaltungseinheiten auf Wafer-Skale-Ebene durch Dehnen einer Folie
TWI232560B (en) * 2002-04-23 2005-05-11 Sanyo Electric Co Semiconductor device and its manufacture
TWI229435B (en) * 2002-06-18 2005-03-11 Sanyo Electric Co Manufacture of semiconductor device
TWI227550B (en) * 2002-10-30 2005-02-01 Sanyo Electric Co Semiconductor device manufacturing method
JP4401181B2 (ja) * 2003-08-06 2010-01-20 三洋電機株式会社 半導体装置及びその製造方法
JP4018096B2 (ja) * 2004-10-05 2007-12-05 松下電器産業株式会社 半導体ウェハの分割方法、及び半導体素子の製造方法
TWI324800B (en) * 2005-12-28 2010-05-11 Sanyo Electric Co Method for manufacturing semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3260634A (en) * 1961-02-17 1966-07-12 Motorola Inc Method of etching a semiconductor wafer to provide tapered dice
FR1486041A (fr) * 1965-07-07 1967-06-23 Westinghouse Electric Corp Dispositif de protection des jonctions d'un dispositif semi-conducteur
GB1118536A (en) * 1966-09-30 1968-07-03 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices

Also Published As

Publication number Publication date
BE740836A (cg-RX-API-DMAC10.html) 1970-04-01
SE363930B (cg-RX-API-DMAC10.html) 1974-02-04
FR2021690A1 (cg-RX-API-DMAC10.html) 1970-07-24
ES373341A1 (es) 1972-05-16
NL6916239A (cg-RX-API-DMAC10.html) 1970-05-01
CH522955A (de) 1972-05-15
NL154868B (nl) 1977-10-17
SE376684B (cg-RX-API-DMAC10.html) 1975-06-02
FR2021690B1 (cg-RX-API-DMAC10.html) 1974-05-03
ES399979A1 (es) 1975-06-16
DK135071B (da) 1977-02-28
DE1954265A1 (de) 1970-05-27
AT310253B (de) 1973-09-25
CS168552B2 (cg-RX-API-DMAC10.html) 1976-06-29
US3756872A (en) 1973-09-04
DK135071C (cg-RX-API-DMAC10.html) 1977-08-01

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee