GB1118536A - Improvements in or relating to semiconductor devices - Google Patents
Improvements in or relating to semiconductor devicesInfo
- Publication number
- GB1118536A GB1118536A GB4383066A GB4383066A GB1118536A GB 1118536 A GB1118536 A GB 1118536A GB 4383066 A GB4383066 A GB 4383066A GB 4383066 A GB4383066 A GB 4383066A GB 1118536 A GB1118536 A GB 1118536A
- Authority
- GB
- United Kingdom
- Prior art keywords
- relating
- semiconductor devices
- semiconductor
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Generation Of Surge Voltage And Current (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4383066A GB1118536A (en) | 1966-09-30 | 1966-09-30 | Improvements in or relating to semiconductor devices |
ES345578A ES345578A1 (en) | 1966-09-30 | 1967-09-29 | Improvements in or relating to semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4383066A GB1118536A (en) | 1966-09-30 | 1966-09-30 | Improvements in or relating to semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1118536A true GB1118536A (en) | 1968-07-03 |
Family
ID=10430493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4383066A Expired GB1118536A (en) | 1966-09-30 | 1966-09-30 | Improvements in or relating to semiconductor devices |
Country Status (2)
Country | Link |
---|---|
ES (1) | ES345578A1 (en) |
GB (1) | GB1118536A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2012548A1 (en) * | 1968-07-09 | 1970-03-20 | Rca Corp | |
FR2021690A1 (en) * | 1968-10-28 | 1970-07-24 | Lucas Industries Ltd | |
FR2091936A1 (en) * | 1970-05-19 | 1971-01-21 | Gen Electric | |
EP0032801A2 (en) * | 1980-01-22 | 1981-07-29 | Kabushiki Kaisha Toshiba | Method of dicing a semiconductor wafer |
US4804641A (en) * | 1985-09-30 | 1989-02-14 | Siemens Aktiengesellschaft | Method for limiting chippage when sawing a semiconductor wafer |
US4814296A (en) * | 1987-08-28 | 1989-03-21 | Xerox Corporation | Method of fabricating image sensor dies for use in assembling arrays |
-
1966
- 1966-09-30 GB GB4383066A patent/GB1118536A/en not_active Expired
-
1967
- 1967-09-29 ES ES345578A patent/ES345578A1/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2012548A1 (en) * | 1968-07-09 | 1970-03-20 | Rca Corp | |
FR2021690A1 (en) * | 1968-10-28 | 1970-07-24 | Lucas Industries Ltd | |
FR2091936A1 (en) * | 1970-05-19 | 1971-01-21 | Gen Electric | |
EP0032801A2 (en) * | 1980-01-22 | 1981-07-29 | Kabushiki Kaisha Toshiba | Method of dicing a semiconductor wafer |
EP0032801A3 (en) * | 1980-01-22 | 1982-11-03 | Kabushiki Kaisha Toshiba | Method of dicing a semiconductor wafer |
US4610079A (en) * | 1980-01-22 | 1986-09-09 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of dicing a semiconductor wafer |
US4804641A (en) * | 1985-09-30 | 1989-02-14 | Siemens Aktiengesellschaft | Method for limiting chippage when sawing a semiconductor wafer |
US4814296A (en) * | 1987-08-28 | 1989-03-21 | Xerox Corporation | Method of fabricating image sensor dies for use in assembling arrays |
Also Published As
Publication number | Publication date |
---|---|
ES345578A1 (en) | 1968-11-16 |
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