CS168552B2 - - Google Patents

Info

Publication number
CS168552B2
CS168552B2 CS1478*[A CS147869A CS168552B2 CS 168552 B2 CS168552 B2 CS 168552B2 CS 147869 A CS147869 A CS 147869A CS 168552 B2 CS168552 B2 CS 168552B2
Authority
CS
Czechoslovakia
Application number
CS1478*[A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CS168552B2 publication Critical patent/CS168552B2/cs

Links

Classifications

    • H10P14/6922—
    • H10P14/6342—
    • H10P14/6516—
    • H10P54/00—
    • H10P72/7402—
    • H10P95/00—
    • H10W74/131—
    • H10P72/7416—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate
CS1478*[A 1968-10-28 1969-10-25 CS168552B2 (cs)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB5103568 1968-10-28
GB24991/69A GB1285708A (en) 1968-10-28 1968-10-28 Semi-conductor devices

Publications (1)

Publication Number Publication Date
CS168552B2 true CS168552B2 (cs) 1976-06-29

Family

ID=26257416

Family Applications (1)

Application Number Title Priority Date Filing Date
CS1478*[A CS168552B2 (cs) 1968-10-28 1969-10-25

Country Status (12)

Country Link
US (1) US3756872A (cs)
AT (1) AT310253B (cs)
BE (1) BE740836A (cs)
CH (1) CH522955A (cs)
CS (1) CS168552B2 (cs)
DE (1) DE1954265A1 (cs)
DK (1) DK135071B (cs)
ES (2) ES373341A1 (cs)
FR (1) FR2021690B1 (cs)
GB (1) GB1285708A (cs)
NL (1) NL154868B (cs)
SE (2) SE363930B (cs)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1335201A (en) * 1970-05-21 1973-10-24 Lucas Industries Ltd Method of manufacturing semi-conductor devices
FR2100997B1 (cs) * 1970-08-04 1973-12-21 Silec Semi Conducteurs
JPS5527463B2 (cs) * 1973-02-28 1980-07-21
IT1059086B (it) * 1976-04-14 1982-05-31 Ates Componenti Elettron Procedimento per la passivazione di dispositivi a semiconduttore di potenza ad alta tensione inversa
DE2929339A1 (de) * 1978-07-24 1980-02-14 Citizen Watch Co Ltd Halbleiteranordnung
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
DE3621796A1 (de) * 1986-06-30 1988-01-07 Siemens Ag Verfahren zur verbesserung der nebensprechdaempfung bei einer optisch-elektronischen sensoranordnung
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
DE19604405C2 (de) * 1996-02-07 2002-10-10 Micronas Gmbh Verfahren zum Vereinzeln von in einem Körper enthaltenen elektronischen Elementen
FR2782843B1 (fr) * 1998-08-25 2000-09-29 Commissariat Energie Atomique Procede d'isolation physique de regions d'une plaque de substrat
DE10055763A1 (de) * 2000-11-10 2002-05-23 Infineon Technologies Ag Verfahren zur Herstellung einer hochtemperaturfesten Verbindung zwischen zwei Wafern
DE10158307A1 (de) * 2001-11-28 2003-02-20 Infineon Technologies Ag Verfahren zum Anschließen von Schaltungseinheiten auf Wafer-Skale-Ebene durch Dehnen einer Folie
TWI232560B (en) * 2002-04-23 2005-05-11 Sanyo Electric Co Semiconductor device and its manufacture
TWI229435B (en) * 2002-06-18 2005-03-11 Sanyo Electric Co Manufacture of semiconductor device
TWI227550B (en) * 2002-10-30 2005-02-01 Sanyo Electric Co Semiconductor device manufacturing method
JP4401181B2 (ja) * 2003-08-06 2010-01-20 三洋電機株式会社 半導体装置及びその製造方法
JP4018096B2 (ja) * 2004-10-05 2007-12-05 松下電器産業株式会社 半導体ウェハの分割方法、及び半導体素子の製造方法
TWI324800B (en) * 2005-12-28 2010-05-11 Sanyo Electric Co Method for manufacturing semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3260634A (en) * 1961-02-17 1966-07-12 Motorola Inc Method of etching a semiconductor wafer to provide tapered dice
FR1486041A (fr) * 1965-07-07 1967-06-23 Westinghouse Electric Corp Dispositif de protection des jonctions d'un dispositif semi-conducteur
GB1118536A (en) * 1966-09-30 1968-07-03 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices

Also Published As

Publication number Publication date
GB1285708A (en) 1972-08-16
ES373341A1 (es) 1972-05-16
SE363930B (cs) 1974-02-04
FR2021690A1 (cs) 1970-07-24
DE1954265A1 (de) 1970-05-27
NL6916239A (cs) 1970-05-01
DK135071B (da) 1977-02-28
DK135071C (cs) 1977-08-01
BE740836A (cs) 1970-04-01
CH522955A (de) 1972-05-15
ES399979A1 (es) 1975-06-16
SE376684B (cs) 1975-06-02
AT310253B (de) 1973-09-25
US3756872A (en) 1973-09-04
FR2021690B1 (cs) 1974-05-03
NL154868B (nl) 1977-10-17

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