GB1214894A - Method of providing metal layers by electrodeposition - Google Patents

Method of providing metal layers by electrodeposition

Info

Publication number
GB1214894A
GB1214894A GB29464/68A GB2946468A GB1214894A GB 1214894 A GB1214894 A GB 1214894A GB 29464/68 A GB29464/68 A GB 29464/68A GB 2946468 A GB2946468 A GB 2946468A GB 1214894 A GB1214894 A GB 1214894A
Authority
GB
United Kingdom
Prior art keywords
envelope
metal parts
nickel
frame
electrodeposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB29464/68A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1214894A publication Critical patent/GB1214894A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/421Shapes or dispositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/456Materials
    • H10W70/457Materials of metallic layers on leadframes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
GB29464/68A 1967-06-23 1968-06-20 Method of providing metal layers by electrodeposition Expired GB1214894A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6708747A NL6708747A (enExample) 1967-06-23 1967-06-23

Publications (1)

Publication Number Publication Date
GB1214894A true GB1214894A (en) 1970-12-09

Family

ID=19800519

Family Applications (1)

Application Number Title Priority Date Filing Date
GB29464/68A Expired GB1214894A (en) 1967-06-23 1968-06-20 Method of providing metal layers by electrodeposition

Country Status (7)

Country Link
BE (1) BE717008A (enExample)
CH (1) CH522741A (enExample)
DE (1) DE1771404A1 (enExample)
FR (1) FR1573339A (enExample)
GB (1) GB1214894A (enExample)
NL (1) NL6708747A (enExample)
SE (1) SE335040B (enExample)

Also Published As

Publication number Publication date
SE335040B (enExample) 1971-05-10
DE1771404A1 (de) 1972-04-06
NL6708747A (enExample) 1968-12-24
BE717008A (enExample) 1968-12-23
FR1573339A (enExample) 1969-07-04
CH522741A (de) 1972-06-30

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