ES315147A1 - Metodo de depositar electroliticamente un chapeado de una aleacion de estaño y bismuto. - Google Patents
Metodo de depositar electroliticamente un chapeado de una aleacion de estaño y bismuto.Info
- Publication number
- ES315147A1 ES315147A1 ES0315147A ES315147A ES315147A1 ES 315147 A1 ES315147 A1 ES 315147A1 ES 0315147 A ES0315147 A ES 0315147A ES 315147 A ES315147 A ES 315147A ES 315147 A1 ES315147 A1 ES 315147A1
- Authority
- ES
- Spain
- Prior art keywords
- translation
- machine
- legally binding
- google translate
- bismuto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0053—Details of the reactor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00049—Controlling or regulating processes
- B01J2219/00182—Controlling or regulating processes controlling the level of reactants in the reactor vessel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00049—Controlling or regulating processes
- B01J2219/00186—Controlling or regulating processes controlling the composition of the reactive mixture
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38189564A | 1964-07-10 | 1964-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES315147A1 true ES315147A1 (es) | 1966-08-01 |
Family
ID=23506782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES0315147A Expired ES315147A1 (es) | 1964-07-10 | 1965-07-09 | Metodo de depositar electroliticamente un chapeado de una aleacion de estaño y bismuto. |
Country Status (6)
Country | Link |
---|---|
US (1) | US3522155A (es) |
DE (1) | DE1496913C3 (es) |
ES (1) | ES315147A1 (es) |
GB (1) | GB1051927A (es) |
NL (1) | NL151448B (es) |
SE (1) | SE306863B (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2071199A5 (es) * | 1969-12-19 | 1971-09-17 | Ibm France | |
US4162205A (en) * | 1978-10-19 | 1979-07-24 | Vulcan Materials Company | Method of electroplating tin and alkaline electroplating bath therefor |
US4252618A (en) * | 1980-02-11 | 1981-02-24 | Pitt Metals & Chemicals, Inc. | Method of electroplating tin and alkaline electroplating bath therefor |
US5450784A (en) * | 1993-09-28 | 1995-09-19 | Detroit Diesel Corporation | Electroplated piston skirt for improved scuff resistance |
US6740221B2 (en) | 2001-03-15 | 2004-05-25 | Applied Materials Inc. | Method of forming copper interconnects |
WO2003063067A1 (en) * | 2002-01-24 | 2003-07-31 | Chatterbox Systems, Inc. | Method and system for locating positions in printed texts and delivering multimedia information |
WO2003085713A1 (en) * | 2002-04-03 | 2003-10-16 | Applied Materials, Inc. | Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects |
JP4275656B2 (ja) | 2005-09-02 | 2009-06-10 | 住友金属工業株式会社 | 鋼管用ねじ継手 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL54999C (es) * | 1938-03-07 | |||
US2318592A (en) * | 1940-02-24 | 1943-05-11 | Du Pont | Electrodeposition |
US2424472A (en) * | 1942-08-12 | 1947-07-22 | Metal & Thermit Corp | Tin plating from potassium stannate baths |
-
0
- GB GB1051927D patent/GB1051927A/en active Active
-
1964
- 1964-07-10 US US381895A patent/US3522155A/en not_active Expired - Lifetime
-
1965
- 1965-07-07 SE SE8987/65A patent/SE306863B/xx unknown
- 1965-07-09 ES ES0315147A patent/ES315147A1/es not_active Expired
- 1965-07-09 NL NL656508910A patent/NL151448B/xx not_active IP Right Cessation
- 1965-07-09 DE DE1496913A patent/DE1496913C3/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL151448B (nl) | 1976-11-15 |
DE1496913A1 (de) | 1969-08-14 |
GB1051927A (es) | |
DE1496913B2 (de) | 1973-03-22 |
US3522155A (en) | 1970-07-28 |
DE1496913C3 (de) | 1973-10-25 |
NL6508910A (es) | 1966-01-11 |
SE306863B (es) | 1968-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES434856A1 (es) | Perfeccionamientos en la produccion de banos acidos acuososde electro-deposicion de estano. | |
ES266074A1 (es) | Un procedimiento para el revestimiento ineléctrico de cobre | |
ES315147A1 (es) | Metodo de depositar electroliticamente un chapeado de una aleacion de estaño y bismuto. | |
ES323939A1 (es) | Un procedimiento para producir un contacto electrico que tiene un recubrimiento de paladio ductil. | |
GB902319A (en) | Improvements in plated circuit board | |
GB923579A (en) | Improvements relating to the electroplating of aluminum and alloys thereof | |
ES255382A1 (es) | Metodo para depositar niquel directamente sobre objetos metalicos | |
GB1141284A (en) | Improvements in acid tin electroplating solutions | |
ES275734A1 (es) | Procedimiento de obtención de una aleación de oro brillante | |
ES330345A1 (es) | Procedimiento para la galvanoplastia de estaño. | |
GB880786A (en) | Improvements in or relating to nickel plating | |
GB847949A (en) | Process for replenishing the content of alloy metals in electrolytic baths for the deposition of gold alloys | |
ES290234A1 (es) | Procedimiento electrolítico para depositar aleaciones brillantes de plata-oro | |
ES393818A1 (es) | Un procedimiento para el deposito electrolitico de estano brillante. | |
ES277182A1 (es) | Procedimiento de revestimiento galvanico de aleaciones de hierro | |
GB738018A (en) | Immersion tin plating from stannate solutions | |
ES250793A1 (es) | PERFECCIONAMIENTOS EN BANOS PARA EL REVESTIMIENTO GALVáNICO | |
AU250594B2 (en) | A plating bath for bright copper incorporating cobalt | |
ES341508A1 (es) | Procedimiento para el niquelado quimico. | |
ES304297A1 (es) | Procedimiento para el revestimiento de superficies de cinc y de sus aleaciones | |
AU263785B2 (en) | An electrolyzer forthe purpose of electrolytically depositing metals from solutions oftheir salts | |
AU1180861A (en) | A plating bath for bright copper incorporating cobalt | |
CA565834A (en) | Electroless nickel plating bath control | |
ES334363A3 (es) | Un metodo para revestir superficies metalicas. | |
CA611274A (en) | Electroplating bath for producing metal electroplates |