GB1288992A - - Google Patents

Info

Publication number
GB1288992A
GB1288992A GB1288992DA GB1288992A GB 1288992 A GB1288992 A GB 1288992A GB 1288992D A GB1288992D A GB 1288992DA GB 1288992 A GB1288992 A GB 1288992A
Authority
GB
United Kingdom
Prior art keywords
copper
layer
electroplated
coating
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1288992A publication Critical patent/GB1288992A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
GB1288992D 1970-06-22 1970-06-22 Expired GB1288992A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3013870 1970-06-22

Publications (1)

Publication Number Publication Date
GB1288992A true GB1288992A (enExample) 1972-09-13

Family

ID=10302926

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1288992D Expired GB1288992A (enExample) 1970-06-22 1970-06-22

Country Status (1)

Country Link
GB (1) GB1288992A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2407639A1 (fr) * 1977-10-28 1979-05-25 Blaupunkt Werke Gmbh Procede et dispositif pour la fabrication de circuits imprimes
GB2305299A (en) * 1995-09-12 1997-04-02 Irish Circuits Ltd Printed circuit board production process
EP0936639A3 (en) * 1998-02-10 1999-09-29 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
EP1091024A4 (en) * 1998-04-30 2006-03-22 Ebara Corp METHOD AND DEVICE FOR COATING SUBSTRATES
EP1923488A3 (en) * 1998-09-14 2009-05-27 Ibiden Co., Ltd. A process for manufacturing a multilayer printed circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2407639A1 (fr) * 1977-10-28 1979-05-25 Blaupunkt Werke Gmbh Procede et dispositif pour la fabrication de circuits imprimes
GB2305299A (en) * 1995-09-12 1997-04-02 Irish Circuits Ltd Printed circuit board production process
EP0936639A3 (en) * 1998-02-10 1999-09-29 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
US6007758A (en) * 1998-02-10 1999-12-28 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
EP1091024A4 (en) * 1998-04-30 2006-03-22 Ebara Corp METHOD AND DEVICE FOR COATING SUBSTRATES
EP1923488A3 (en) * 1998-09-14 2009-05-27 Ibiden Co., Ltd. A process for manufacturing a multilayer printed circuit board
US7691189B2 (en) 1998-09-14 2010-04-06 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US7827680B2 (en) 1998-09-14 2010-11-09 Ibiden Co., Ltd. Electroplating process of electroplating an elecrically conductive sustrate
US8065794B2 (en) 1998-09-14 2011-11-29 Ibiden Co., Ltd. Printed wiring board and its manufacturing method

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee