GB1449350A - Laminate for printed circuit board - Google Patents

Laminate for printed circuit board

Info

Publication number
GB1449350A
GB1449350A GB2162774A GB2162774A GB1449350A GB 1449350 A GB1449350 A GB 1449350A GB 2162774 A GB2162774 A GB 2162774A GB 2162774 A GB2162774 A GB 2162774A GB 1449350 A GB1449350 A GB 1449350A
Authority
GB
United Kingdom
Prior art keywords
electro
plating
foil
thick
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2162774A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELECTROFOILS Ltd
Original Assignee
ELECTROFOILS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELECTROFOILS Ltd filed Critical ELECTROFOILS Ltd
Priority to GB2162774A priority Critical patent/GB1449350A/en
Publication of GB1449350A publication Critical patent/GB1449350A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1449350 Electro-depositing copper for printed circuits ELECTROFOILS Ltd 12 May 1975 [15 May 1974] 21627/74 Heading C7B [Also in Divisions B5 and H1] A laminate e.g. 10 to 700 Á thick for making a printed circuit board comprises an Al foil e.g. 25 Á thick to at least the upper surface of which is applied by electro-plating a Cu layer e.g. 3 Á thick, the lower surface being treated chemically or mechanically to improve its adhesion to a dielectric base. Preferably a further Cu layer e.g. 3 Á thick, provided with a nodularized or dendritic outer surface of high surface area to improve adhesion, is applied by electro-plating to the lower surface of the foil. Prior to electro-plating, the Al foil may be cleaned in a non-silicated soak at 60‹C, etched in a NaOH based solution, rinsed, then immersed in a sodium zincate (230-250 g/l NaOH and 60-70 g/l ZnO) solution to apply an intermediate layer of Zn to one of both surfaces of the foil. Electro-plating may be carried out at 30 ASF in a solution cor,- taining 22-28 g/l Cu24, 150-250 g/l P 2 O 7 <SP>4-</SP>, 5-10 g/l NO 3 <SP>-</SP> and 1-3 g/l ammonia at pH 8.6- 9.2. The side of the Cu-Al-Cu sandwich provided with a dendritic surface is laminated to the base, e.g. an epoxy glass cloth substrate in a hydraulic press at 160‹C, to make a printed circuit board.
GB2162774A 1974-05-15 1974-05-15 Laminate for printed circuit board Expired GB1449350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2162774A GB1449350A (en) 1974-05-15 1974-05-15 Laminate for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2162774A GB1449350A (en) 1974-05-15 1974-05-15 Laminate for printed circuit board

Publications (1)

Publication Number Publication Date
GB1449350A true GB1449350A (en) 1976-09-15

Family

ID=10166116

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2162774A Expired GB1449350A (en) 1974-05-15 1974-05-15 Laminate for printed circuit board

Country Status (1)

Country Link
GB (1) GB1449350A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2197134A (en) * 1986-10-03 1988-05-11 Junkosha Co Ltd Printed circuit board substrates
EP1204304A2 (en) * 2000-11-01 2002-05-08 Visteon Global Technologies, Inc. Etched tri-layer metal bonding layer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2197134A (en) * 1986-10-03 1988-05-11 Junkosha Co Ltd Printed circuit board substrates
EP1204304A2 (en) * 2000-11-01 2002-05-08 Visteon Global Technologies, Inc. Etched tri-layer metal bonding layer
EP1204304A3 (en) * 2000-11-01 2002-12-11 Visteon Global Technologies, Inc. Etched tri-layer metal bonding layer

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Legal Events

Date Code Title Description
414F Notice of opposition given (sect. 14/1949)
414A Case decided by the comptroller ** specification amended (sect. 14/1949)
SPA Amended specification published
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee