GB1162163A - Metallic Member for Semiconductor Devices - Google Patents

Metallic Member for Semiconductor Devices

Info

Publication number
GB1162163A
GB1162163A GB36890/66A GB3689066A GB1162163A GB 1162163 A GB1162163 A GB 1162163A GB 36890/66 A GB36890/66 A GB 36890/66A GB 3689066 A GB3689066 A GB 3689066A GB 1162163 A GB1162163 A GB 1162163A
Authority
GB
United Kingdom
Prior art keywords
strip
die
leads
platform
side member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB36890/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB1162163A publication Critical patent/GB1162163A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/035—Opposed plunger
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB36890/66A 1965-10-22 1966-08-17 Metallic Member for Semiconductor Devices Expired GB1162163A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50155065A 1965-10-22 1965-10-22
US504402A US3391426A (en) 1965-10-22 1965-10-24 Molding apparatus
US69239667A 1967-12-21 1967-12-21

Publications (1)

Publication Number Publication Date
GB1162163A true GB1162163A (en) 1969-08-20

Family

ID=27414177

Family Applications (2)

Application Number Title Priority Date Filing Date
GB36890/66A Expired GB1162163A (en) 1965-10-22 1966-08-17 Metallic Member for Semiconductor Devices
GB42663/66A Expired GB1166603A (en) 1965-10-22 1966-09-23 Moulding Apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB42663/66A Expired GB1166603A (en) 1965-10-22 1966-09-23 Moulding Apparatus

Country Status (4)

Country Link
US (2) US3391426A (https=)
DE (1) DE1564354C3 (https=)
GB (2) GB1162163A (https=)
NL (2) NL154873B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0923129A1 (en) * 1997-12-11 1999-06-16 Siemens Aktiengesellschaft A lead frame for electronic semi-conductor devices
CN110993580A (zh) * 2018-10-02 2020-04-10 英飞凌科技奥地利有限公司 用于裸片接合的多夹结构

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539675A (en) * 1965-10-22 1970-11-10 Motorola Inc Method for encapsulating semiconductor devices
US3571920A (en) * 1965-12-16 1971-03-23 Berg Electronics Inc Method for transistor manufacture
US3471900A (en) * 1967-05-24 1969-10-14 Trw Inc Mold for encapsulating electrical components
US3490141A (en) * 1967-10-02 1970-01-20 Motorola Inc High voltage rectifier stack and method for making same
US3530541A (en) * 1968-06-13 1970-09-29 Trw Inc Mold for encapsulating electrical components
GB1271833A (en) * 1968-07-10 1972-04-26 Hitachi Ltd Improvements in or relating to encapsulation processes
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3691654A (en) * 1969-05-29 1972-09-19 Gen Electric Metal foil lead manufacture
US3963822A (en) * 1969-09-12 1976-06-15 Noma Lites Canada Limited Method of molding electrical lamp sockets
US3694902A (en) * 1970-08-31 1972-10-03 Bell Telephone Labor Inc Electroluminescent display apparatus
US3718969A (en) * 1970-09-21 1973-03-06 Motorola Inc Plastic encapsulated semiconductor assemblies
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
NL7018378A (https=) * 1970-12-17 1972-06-20
US3808673A (en) * 1971-03-17 1974-05-07 Monsanto Co Opto-isolator devices and method for the fabrication thereof
US3719969A (en) * 1971-04-21 1973-03-13 Goodrich Co B F Plastic encapsulated semiconductor assemblies
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US3729817A (en) * 1971-09-30 1973-05-01 Bourns Inc Method of making rotatable element potentiometer
US3795049A (en) * 1972-02-22 1974-03-05 Trw Inc Method of making a printed circuit edge connector
US3869789A (en) * 1974-05-31 1975-03-11 Spectrol Electronics Corp Method of manufacturing variable resistance device
US4170444A (en) * 1975-11-19 1979-10-09 Bactomatic, Inc. Mold for making impedance measuring module
US4084312A (en) * 1976-01-07 1978-04-18 Motorola, Inc. Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies
JPS5326670A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Manufacture of semiconductor device
FR2368868A7 (fr) * 1976-10-21 1978-05-19 Ates Componenti Elettron Dispositif a semi conducteurs en forme de boitier
US4231628A (en) * 1978-12-14 1980-11-04 Amp Incorporated Electrical connector receptacles
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JPS57178352A (en) * 1981-04-28 1982-11-02 Matsushita Electronics Corp Manufacture of resin sealing type semiconductor device and lead frame employed thereon
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device
JPH01150512A (ja) * 1987-12-09 1989-06-13 Honda Motor Co Ltd 可撓性回路体を備えた樹脂発泡体の成形方法
DE10110138A1 (de) * 2001-03-02 2002-09-05 Schwarzbich Joerg Verfahren zur Herstellung einer Lordosenstütze

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2158044A (en) * 1929-05-18 1939-05-09 Hygrade Sylvanla Corp Method of making contactor bases for electric lamps, tubes, and the like
US2120502A (en) * 1936-01-08 1938-06-14 Fnf Ltd Mold for parts of knitting machinery
US2252054A (en) * 1939-10-05 1941-08-12 American Fork & Hoe Co Fishing rod handle
US2306732A (en) * 1941-05-08 1942-12-29 Bell Telephone Labor Inc Molding fixture
US2369291A (en) * 1942-09-29 1945-02-13 Western Electric Co Molding
US2465656A (en) * 1945-01-03 1949-03-29 Louis H Morin Method of forming die castings on mountings or carrier members
US2500546A (en) * 1946-03-20 1950-03-14 Whitney Blake Co Apparatus for molding terminals on electric conductors
US2479350A (en) * 1947-10-03 1949-08-16 Jr John C Haggart Apparatus for molding reflector devices
DE1077790B (de) * 1955-03-10 1960-03-17 Texas Instruments Inc AEtzverfahren zur Herstellung von Halbleiteranordnungen
US3004298A (en) * 1957-02-11 1961-10-17 Federal Mogul Bower Bearings Method for making fluid seals
US3092893A (en) * 1958-02-13 1963-06-11 Texas Instruments Inc Fabrication of semiconductor devices
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
US3063097A (en) * 1959-12-04 1962-11-13 Chicago Rawhide Mfg Co Apparatus for forming seals
US3175028A (en) * 1960-10-27 1965-03-23 Waldes Kohinoor Inc Slide fastener manufacture
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3207832A (en) * 1962-10-18 1965-09-21 Western Electric Co Method of making plastic article having metallic insert
US3307221A (en) * 1963-11-12 1967-03-07 Thiokol Chemical Corp Mold for making insulated rocket motor nozzles
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
DE1292755B (de) * 1964-03-26 1969-04-17 Siemens Ag Verfahren zum serienmaessigen Sockeln und Gehaeuseeinbau von Halbleiterbauelementen
DE1439349B2 (de) 1964-03-26 1971-02-25 Siemens AG, 1000 Berlin u 8000 München Verfahren zur serienfertigung von halbleiterbauelementen
US3315316A (en) * 1965-03-05 1967-04-25 Victor Mfg & Gasket Co Apparatus for molding fluid seal elements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0923129A1 (en) * 1997-12-11 1999-06-16 Siemens Aktiengesellschaft A lead frame for electronic semi-conductor devices
CN110993580A (zh) * 2018-10-02 2020-04-10 英飞凌科技奥地利有限公司 用于裸片接合的多夹结构

Also Published As

Publication number Publication date
US3431092A (en) 1969-03-04
NL154873B (nl) 1977-10-17
NL6612902A (https=) 1967-04-24
GB1166603A (en) 1969-10-08
US3391426A (en) 1968-07-09
DE1564354B2 (de) 1975-01-09
DE1604640A1 (de) 1970-12-03
DE1604640B2 (de) 1975-09-18
DE1564354C3 (de) 1982-04-29
NL151659B (nl) 1976-12-15
NL6614974A (https=) 1967-04-25
DE1564354A1 (de) 1969-09-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLE Entries relating assignments, transmissions, licences in the register of patents
PE Patent expired