GB1054514A - - Google Patents

Info

Publication number
GB1054514A
GB1054514A GB1054514DA GB1054514A GB 1054514 A GB1054514 A GB 1054514A GB 1054514D A GB1054514D A GB 1054514DA GB 1054514 A GB1054514 A GB 1054514A
Authority
GB
United Kingdom
Prior art keywords
transistors
semi
covered
conductor
insulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of GB1054514A publication Critical patent/GB1054514A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H10B20/10—ROM devices comprising bipolar components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/232—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising connection or disconnection of parts of a device in response to a measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
GB1054514D 1963-04-05 Expired GB1054514A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DET0023794 1963-04-05
DET0024580 1963-08-27

Publications (1)

Publication Number Publication Date
GB1054514A true GB1054514A (enExample) 1900-01-01

Family

ID=25999711

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1054514D Expired GB1054514A (enExample) 1963-04-05

Country Status (4)

Country Link
US (1) US3543102A (enExample)
DE (2) DE1439626A1 (enExample)
GB (1) GB1054514A (enExample)
NL (1) NL6403583A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1563879A (enExample) * 1968-02-09 1969-04-18
US3699403A (en) * 1970-10-23 1972-10-17 Rca Corp Fusible semiconductor device including means for reducing the required fusing current
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
US3761787A (en) * 1971-09-01 1973-09-25 Motorola Inc Method and apparatus for adjusting transistor current
US3821045A (en) * 1972-07-17 1974-06-28 Hughes Aircraft Co Multilayer silicon wafer production methods
US3895977A (en) * 1973-12-20 1975-07-22 Harris Corp Method of fabricating a bipolar transistor
GB1445479A (en) * 1974-01-22 1976-08-11 Raytheon Co Electrical fuses
US4306246A (en) * 1976-09-29 1981-12-15 Motorola, Inc. Method for trimming active semiconductor devices
JPS6019150B2 (ja) * 1979-10-05 1985-05-14 株式会社日立製作所 半導体装置の製造方法
JP2593471B2 (ja) * 1987-03-11 1997-03-26 株式会社東芝 半導体装置
JPH0821807B2 (ja) * 1993-04-07 1996-03-04 日本電気株式会社 マイクロ波回路モジュールの製造装置
FR2741475B1 (fr) * 1995-11-17 2000-05-12 Commissariat Energie Atomique Procede de fabrication d'un dispositif de micro-electronique comportant sur un substrat une pluralite d'elements interconnectes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2655625A (en) * 1952-04-26 1953-10-13 Bell Telephone Labor Inc Semiconductor circuit element
US2721822A (en) * 1953-07-22 1955-10-25 Pritikin Nathan Method for producing printed circuit
US2994834A (en) * 1956-02-29 1961-08-01 Baldwin Piano Co Transistor amplifiers
NL233303A (enExample) * 1957-11-30
US3029366A (en) * 1959-04-22 1962-04-10 Sprague Electric Co Multiple semiconductor assembly
NL262767A (enExample) * 1960-04-01
US3219748A (en) * 1961-12-04 1965-11-23 Motorola Inc Semiconductor device with cold welded package and method of sealing the same
US3317653A (en) * 1965-05-07 1967-05-02 Cts Corp Electrical component and method of making the same

Also Published As

Publication number Publication date
DE1439648B2 (de) 1971-02-11
NL6403583A (enExample) 1964-10-06
DE1439626A1 (de) 1968-10-31
DE1439648A1 (de) 1969-03-20
US3543102A (en) 1970-11-24

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