DE1439626A1 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE1439626A1
DE1439626A1 DE19631439626 DE1439626A DE1439626A1 DE 1439626 A1 DE1439626 A1 DE 1439626A1 DE 19631439626 DE19631439626 DE 19631439626 DE 1439626 A DE1439626 A DE 1439626A DE 1439626 A1 DE1439626 A1 DE 1439626A1
Authority
DE
Germany
Prior art keywords
semiconductor component
component according
decoupling
individual systems
systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19631439626
Other languages
German (de)
English (en)
Inventor
Gerstner Dr-Ing Dieter
Walter Klossika
Dahlberg Dr Rer Nat Reinhard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of DE1439626A1 publication Critical patent/DE1439626A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H10B20/10—ROM devices comprising bipolar components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/232—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising connection or disconnection of parts of a device in response to a measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE19631439626 1963-04-05 1963-04-05 Halbleiterbauelement Pending DE1439626A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DET0023794 1963-04-05
DET0024580 1963-08-27

Publications (1)

Publication Number Publication Date
DE1439626A1 true DE1439626A1 (de) 1968-10-31

Family

ID=25999711

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19631439626 Pending DE1439626A1 (de) 1963-04-05 1963-04-05 Halbleiterbauelement
DE19631439648 Withdrawn DE1439648B2 (de) 1963-04-05 1963-08-27 Verfahren zum Herstellen eines Halb leiterbauelementes

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19631439648 Withdrawn DE1439648B2 (de) 1963-04-05 1963-08-27 Verfahren zum Herstellen eines Halb leiterbauelementes

Country Status (4)

Country Link
US (1) US3543102A (enExample)
DE (2) DE1439626A1 (enExample)
GB (1) GB1054514A (enExample)
NL (1) NL6403583A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502452A1 (de) * 1974-01-22 1975-07-24 Raytheon Co Schmelzsicherungseinrichtung und verfahren zu ihrer herstellung
EP0622840A3 (en) * 1993-04-07 1995-03-22 Nippon Electric Co Apparatus and method for the assembly and testing of monolithically integrated microwave circuit modules (MMIC).

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1563879A (enExample) * 1968-02-09 1969-04-18
US3699403A (en) * 1970-10-23 1972-10-17 Rca Corp Fusible semiconductor device including means for reducing the required fusing current
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
US3761787A (en) * 1971-09-01 1973-09-25 Motorola Inc Method and apparatus for adjusting transistor current
US3821045A (en) * 1972-07-17 1974-06-28 Hughes Aircraft Co Multilayer silicon wafer production methods
US3895977A (en) * 1973-12-20 1975-07-22 Harris Corp Method of fabricating a bipolar transistor
US4306246A (en) * 1976-09-29 1981-12-15 Motorola, Inc. Method for trimming active semiconductor devices
JPS6019150B2 (ja) * 1979-10-05 1985-05-14 株式会社日立製作所 半導体装置の製造方法
JP2593471B2 (ja) * 1987-03-11 1997-03-26 株式会社東芝 半導体装置
FR2741475B1 (fr) * 1995-11-17 2000-05-12 Commissariat Energie Atomique Procede de fabrication d'un dispositif de micro-electronique comportant sur un substrat une pluralite d'elements interconnectes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2655625A (en) * 1952-04-26 1953-10-13 Bell Telephone Labor Inc Semiconductor circuit element
US2721822A (en) * 1953-07-22 1955-10-25 Pritikin Nathan Method for producing printed circuit
US2994834A (en) * 1956-02-29 1961-08-01 Baldwin Piano Co Transistor amplifiers
NL233303A (enExample) * 1957-11-30
US3029366A (en) * 1959-04-22 1962-04-10 Sprague Electric Co Multiple semiconductor assembly
NL262767A (enExample) * 1960-04-01
US3219748A (en) * 1961-12-04 1965-11-23 Motorola Inc Semiconductor device with cold welded package and method of sealing the same
US3317653A (en) * 1965-05-07 1967-05-02 Cts Corp Electrical component and method of making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502452A1 (de) * 1974-01-22 1975-07-24 Raytheon Co Schmelzsicherungseinrichtung und verfahren zu ihrer herstellung
EP0622840A3 (en) * 1993-04-07 1995-03-22 Nippon Electric Co Apparatus and method for the assembly and testing of monolithically integrated microwave circuit modules (MMIC).

Also Published As

Publication number Publication date
DE1439648B2 (de) 1971-02-11
NL6403583A (enExample) 1964-10-06
GB1054514A (enExample) 1900-01-01
DE1439648A1 (de) 1969-03-20
US3543102A (en) 1970-11-24

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971