FR2981200B1 - Cellule monolithique de circuit integre et notamment cellule de commutation monolithique - Google Patents
Cellule monolithique de circuit integre et notamment cellule de commutation monolithiqueInfo
- Publication number
- FR2981200B1 FR2981200B1 FR1159137A FR1159137A FR2981200B1 FR 2981200 B1 FR2981200 B1 FR 2981200B1 FR 1159137 A FR1159137 A FR 1159137A FR 1159137 A FR1159137 A FR 1159137A FR 2981200 B1 FR2981200 B1 FR 2981200B1
- Authority
- FR
- France
- Prior art keywords
- monolithic
- cell
- integrated circuit
- switch
- switch cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0814—Diodes only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823487—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0817—Thyristors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
- H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Rectifiers (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1159137A FR2981200B1 (fr) | 2011-10-10 | 2011-10-10 | Cellule monolithique de circuit integre et notamment cellule de commutation monolithique |
EP12781377.2A EP2766932A1 (fr) | 2011-10-10 | 2012-10-09 | Cellule monolithique de circuit integre et notamment cellule de commutation monolithique |
CN201280049682.4A CN104011861B (zh) | 2011-10-10 | 2012-10-09 | 集成电路的单块单元并且尤其是单块转换单元 |
JP2014533973A JP2014534622A (ja) | 2011-10-10 | 2012-10-09 | 集積回路のためのモノリシックセルおよび特にモノリシック転流セル |
US14/353,805 US10199376B2 (en) | 2011-10-10 | 2012-10-09 | Monolithic cell for an integrated circuit and especially a monolithic switching cell |
PCT/FR2012/052288 WO2013054033A1 (fr) | 2011-10-10 | 2012-10-09 | Cellule monolithique de circuit integre et notamment cellule de commutation monolithique |
JP2017208349A JP2018032871A (ja) | 2011-10-10 | 2017-10-27 | 集積回路のためのモノリシックセルおよび特にモノリシック転流セル |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1159137A FR2981200B1 (fr) | 2011-10-10 | 2011-10-10 | Cellule monolithique de circuit integre et notamment cellule de commutation monolithique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2981200A1 FR2981200A1 (fr) | 2013-04-12 |
FR2981200B1 true FR2981200B1 (fr) | 2017-01-13 |
Family
ID=47143158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1159137A Expired - Fee Related FR2981200B1 (fr) | 2011-10-10 | 2011-10-10 | Cellule monolithique de circuit integre et notamment cellule de commutation monolithique |
Country Status (6)
Country | Link |
---|---|
US (1) | US10199376B2 (fr) |
EP (1) | EP2766932A1 (fr) |
JP (2) | JP2014534622A (fr) |
CN (1) | CN104011861B (fr) |
FR (1) | FR2981200B1 (fr) |
WO (1) | WO2013054033A1 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014209690B4 (de) * | 2014-05-21 | 2020-02-20 | Robert Bosch Gmbh | Kommutierungszelle |
WO2016094718A1 (fr) | 2014-12-10 | 2016-06-16 | Texas Instruments Incorporated | Transistor de puissance à effet de champ (fet), pré-amplificateur de tension, dispositif de commande et intégration de résistances de détection |
FR3050571A1 (fr) * | 2016-04-20 | 2017-10-27 | Centre Nat Rech Scient | Convertisseur electronique de puissance utilisant deux puces multi-poles de puissance a substrats complementaires n et p. |
US20210013793A1 (en) * | 2016-08-26 | 2021-01-14 | Delta Electronics (Shanghai) Co., Ltd | Power chip and bridge circuit |
FR3060849B1 (fr) | 2016-12-21 | 2021-04-30 | Centre Nat Rech Scient | Puce(s) multipole(s) de puissance integrant de maniere monolithique des cellules de decoupage asymetriques et module(s) de puissance multi-phase utilisant la ou plusieurs desdites puces multipole(s) |
US10461021B2 (en) * | 2017-02-28 | 2019-10-29 | Deere & Company | Electronic assembly with enhanced thermal dissipation |
CN108074966A (zh) * | 2017-12-27 | 2018-05-25 | 电子科技大学 | 恒流器件及其制造方法 |
JP7070303B2 (ja) * | 2018-10-04 | 2022-05-18 | 三菱電機株式会社 | 半導体装置 |
US10991680B2 (en) * | 2019-09-18 | 2021-04-27 | Alpha And Omega Semiconductor (Cayman), Ltd. | Common source land grid array package |
CN112713145A (zh) | 2019-10-24 | 2021-04-27 | 华为技术有限公司 | 一种开关半导体器件及其制备方法、固态移相器 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5127985B2 (fr) * | 1971-10-01 | 1976-08-16 | ||
US4278985A (en) * | 1980-04-14 | 1981-07-14 | Gte Laboratories Incorporated | Monolithic integrated circuit structure incorporating Schottky contact diode bridge rectifier |
JPH07114279B2 (ja) * | 1988-01-06 | 1995-12-06 | 株式会社東芝 | 半導体装置 |
US5381026A (en) * | 1990-09-17 | 1995-01-10 | Kabushiki Kaisha Toshiba | Insulated-gate thyristor |
JPH04297071A (ja) * | 1990-10-05 | 1992-10-21 | Fuji Electric Co Ltd | 半導体装置 |
JPH05343662A (ja) * | 1992-06-04 | 1993-12-24 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPH0832060A (ja) * | 1994-07-13 | 1996-02-02 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
FR2729008B1 (fr) * | 1994-12-30 | 1997-03-21 | Sgs Thomson Microelectronics | Circuit integre de puissance |
US6180966B1 (en) * | 1997-03-25 | 2001-01-30 | Hitachi, Ltd. | Trench gate type semiconductor device with current sensing cell |
GB9722780D0 (en) * | 1997-10-28 | 1997-12-24 | Nada Electronics Ltd | AC to DC conversion arrangement |
JP4156258B2 (ja) * | 2002-03-28 | 2008-09-24 | 本田技研工業株式会社 | 共振型インバータ |
JP4757449B2 (ja) * | 2004-01-29 | 2011-08-24 | 三菱電機株式会社 | 半導体装置 |
JP2006173296A (ja) * | 2004-12-15 | 2006-06-29 | Yaskawa Electric Corp | 半導体装置とその製造方法 |
US8026572B2 (en) * | 2006-12-06 | 2011-09-27 | Denso Corporation | Semiconductor device and method for manufacturing same |
JP5217348B2 (ja) * | 2006-12-06 | 2013-06-19 | 株式会社デンソー | 半導体装置 |
JP5320679B2 (ja) * | 2007-02-28 | 2013-10-23 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JP2008235788A (ja) * | 2007-03-23 | 2008-10-02 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2008311300A (ja) * | 2007-06-12 | 2008-12-25 | Toyota Motor Corp | パワー半導体装置、パワー半導体装置の製造方法、およびモータ駆動装置 |
CN100592532C (zh) * | 2007-08-28 | 2010-02-24 | 电子科技大学 | 具有“u”字形漂移区的半导体器件 |
US8203181B2 (en) * | 2008-09-30 | 2012-06-19 | Infineon Technologies Austria Ag | Trench MOSFET semiconductor device and manufacturing method therefor |
JP5250895B2 (ja) * | 2009-01-22 | 2013-07-31 | 三菱電機株式会社 | 半導体装置 |
US8058670B2 (en) * | 2009-06-04 | 2011-11-15 | Force—MOS Technology Corporation | Insulated gate bipolar transistor (IGBT) with monolithic deep body clamp diode to prevent latch-up |
FR2947949B1 (fr) * | 2009-07-08 | 2012-03-02 | Centre Nat Rech Scient | Module electronique de puissance |
DE102011079747A1 (de) * | 2010-07-27 | 2012-02-02 | Denso Corporation | Halbleitervorrichtung mit Schaltelement und Freilaufdiode, sowie Steuerverfahren hierfür |
-
2011
- 2011-10-10 FR FR1159137A patent/FR2981200B1/fr not_active Expired - Fee Related
-
2012
- 2012-10-09 CN CN201280049682.4A patent/CN104011861B/zh not_active Expired - Fee Related
- 2012-10-09 WO PCT/FR2012/052288 patent/WO2013054033A1/fr active Application Filing
- 2012-10-09 JP JP2014533973A patent/JP2014534622A/ja active Pending
- 2012-10-09 EP EP12781377.2A patent/EP2766932A1/fr not_active Withdrawn
- 2012-10-09 US US14/353,805 patent/US10199376B2/en not_active Expired - Fee Related
-
2017
- 2017-10-27 JP JP2017208349A patent/JP2018032871A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20140299916A1 (en) | 2014-10-09 |
CN104011861A (zh) | 2014-08-27 |
JP2014534622A (ja) | 2014-12-18 |
CN104011861B (zh) | 2017-10-10 |
FR2981200A1 (fr) | 2013-04-12 |
EP2766932A1 (fr) | 2014-08-20 |
JP2018032871A (ja) | 2018-03-01 |
WO2013054033A1 (fr) | 2013-04-18 |
US10199376B2 (en) | 2019-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
ST | Notification of lapse |
Effective date: 20200914 |