FR2872344B1 - Substrat de reseau de transistors a couches minces et procede de fabrication de celui-ci - Google Patents

Substrat de reseau de transistors a couches minces et procede de fabrication de celui-ci

Info

Publication number
FR2872344B1
FR2872344B1 FR0506050A FR0506050A FR2872344B1 FR 2872344 B1 FR2872344 B1 FR 2872344B1 FR 0506050 A FR0506050 A FR 0506050A FR 0506050 A FR0506050 A FR 0506050A FR 2872344 B1 FR2872344 B1 FR 2872344B1
Authority
FR
France
Prior art keywords
electrode
channel
semiconductor layer
gate
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0506050A
Other languages
English (en)
Other versions
FR2872344A1 (fr
Inventor
Young Seok Choi
Byung Yong Ahn
Hong Woo Yu
Ki Sul Cho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Display Co Ltd
Original Assignee
LG Philips LCD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Philips LCD Co Ltd filed Critical LG Philips LCD Co Ltd
Publication of FR2872344A1 publication Critical patent/FR2872344A1/fr
Application granted granted Critical
Publication of FR2872344B1 publication Critical patent/FR2872344B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
    • G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/13629—Multilayer wirings

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Chemical & Material Sciences (AREA)
FR0506050A 2004-06-25 2005-06-15 Substrat de reseau de transistors a couches minces et procede de fabrication de celui-ci Expired - Fee Related FR2872344B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040048259A KR101126396B1 (ko) 2004-06-25 2004-06-25 박막트랜지스터 어레이 기판 및 그 제조방법

Publications (2)

Publication Number Publication Date
FR2872344A1 FR2872344A1 (fr) 2005-12-30
FR2872344B1 true FR2872344B1 (fr) 2008-08-15

Family

ID=34858889

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0506050A Expired - Fee Related FR2872344B1 (fr) 2004-06-25 2005-06-15 Substrat de reseau de transistors a couches minces et procede de fabrication de celui-ci

Country Status (7)

Country Link
US (2) US7586123B2 (fr)
JP (1) JP4527615B2 (fr)
KR (1) KR101126396B1 (fr)
CN (1) CN100388104C (fr)
DE (1) DE102005027445B4 (fr)
FR (1) FR2872344B1 (fr)
GB (1) GB2415542B (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101050300B1 (ko) * 2004-07-30 2011-07-19 엘지디스플레이 주식회사 액정 표시 장치용 어레이 기판 및 그 제조 방법
KR101350609B1 (ko) * 2005-12-30 2014-01-10 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판 및 그 제조 방법
KR101221261B1 (ko) * 2006-02-15 2013-01-11 엘지디스플레이 주식회사 액정 표시 장치용 어레이 기판 및 그 제조 방법
KR101243395B1 (ko) * 2006-04-27 2013-03-13 엘지디스플레이 주식회사 유기 박막 트랜지스터 어레이 기판 및 그 제조 방법
KR101245225B1 (ko) * 2006-06-22 2013-03-19 엘지디스플레이 주식회사 박막트랜지스터 기판 및 그 제조 방법
KR101227408B1 (ko) * 2006-06-28 2013-01-29 엘지디스플레이 주식회사 액정표시장치용 어레이 기판 및 그 제조방법
KR101238233B1 (ko) * 2006-06-30 2013-03-04 엘지디스플레이 주식회사 박막트랜지스터와 그 제조방법
KR101284697B1 (ko) * 2006-06-30 2013-07-23 엘지디스플레이 주식회사 액정표시장치용 어레이 기판과 그 제조방법
KR101282404B1 (ko) 2006-09-05 2013-07-04 삼성디스플레이 주식회사 액정 표시 장치의 제조 방법
KR20080060861A (ko) 2006-12-27 2008-07-02 엘지디스플레이 주식회사 박막 트랜지스터 기판 및 이의 제조 방법
KR101386284B1 (ko) * 2006-12-29 2014-04-17 엘지디스플레이 주식회사 오믹 저항 측정용 패턴 및 이를 이용한 박막 트랜지스터기판과 그 제조방법
TWI405017B (zh) * 2008-12-18 2013-08-11 Lg Display Co Ltd 顯示裝置之陣列基板及其製造方法
JP5395566B2 (ja) * 2009-08-20 2014-01-22 パナソニック液晶ディスプレイ株式会社 表示装置及びその製造方法
KR101549267B1 (ko) * 2009-10-14 2015-09-11 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판의 제조방법
CN102243404B (zh) * 2010-05-14 2016-05-11 北京京东方光电科技有限公司 阵列基板及其制造方法
JP5950638B2 (ja) * 2012-03-12 2016-07-13 三菱電機株式会社 配線構造及びそれを備える薄膜トランジスタアレイ基板並びに表示装置
KR101960379B1 (ko) * 2012-07-11 2019-03-20 엘지디스플레이 주식회사 박막 트랜지스터 기판 및 이의 제조 방법
CN102881596A (zh) * 2012-09-26 2013-01-16 深圳市华星光电技术有限公司 薄膜晶体管主动装置的制作方法及制作的薄膜晶体管主动装置
KR102207063B1 (ko) * 2012-12-12 2021-01-25 엘지디스플레이 주식회사 박막 트랜지스터, 박막 트랜지스터 제조 방법 및 박막 트랜지스터를 포함하는 표시 장치
CN103280447B (zh) * 2013-04-25 2015-12-09 京东方科技集团股份有限公司 电路板、其制作方法以及显示装置
KR102130139B1 (ko) * 2013-07-30 2020-07-03 엘지디스플레이 주식회사 산화물 반도체를 이용한 박막 트랜지스터 기판을 포함하는 유기발광 다이오드 표시장치 및 그 제조 방법
KR20150137214A (ko) * 2014-05-28 2015-12-09 삼성디스플레이 주식회사 유기발광 디스플레이 장치 및 그 제조방법
CN105336751B (zh) * 2014-06-23 2018-06-22 上海箩箕技术有限公司 光电传感器及其制造方法
CN104716147B (zh) * 2015-04-01 2018-05-08 京东方科技集团股份有限公司 一种tft阵列基板及其制备方法、显示装置
CN106298523B (zh) * 2015-05-22 2019-12-17 鸿富锦精密工业（深圳）有限公司 薄膜晶体管、薄膜晶体管的制造方法及阵列基板的制造方法
US11189736B2 (en) * 2015-07-24 2021-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102424445B1 (ko) * 2016-05-03 2022-07-22 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
CN106229298B (zh) * 2016-08-17 2018-12-11 武汉华星光电技术有限公司 一种阵列基板及其制作方法
KR102464131B1 (ko) * 2017-06-30 2022-11-04 엘지디스플레이 주식회사 전계발광 표시장치

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5474941A (en) * 1990-12-28 1995-12-12 Sharp Kabushiki Kaisha Method for producing an active matrix substrate
EP0493113B1 (fr) 1990-12-28 1997-03-19 Sharp Kabushiki Kaisha Un procédé de fabrication d'un transistor à couche mince et d'un substrat à matrice active pour dispositifs de visualisation à cristaux liquides
US5302987A (en) * 1991-05-15 1994-04-12 Sharp Kabushiki Kaisha Active matrix substrate including connecting electrode with extended portion
JPH07131030A (ja) 1993-11-05 1995-05-19 Sony Corp 表示用薄膜半導体装置及びその製造方法
JP2738289B2 (ja) 1993-12-30 1998-04-08 日本電気株式会社 液晶表示装置の製造方法
JP3238020B2 (ja) * 1994-09-16 2001-12-10 株式会社東芝 アクティブマトリクス表示装置の製造方法
JPH08228011A (ja) 1994-12-14 1996-09-03 Toshiba Corp 半導体装置およびその製造方法
JP3213196B2 (ja) * 1995-03-08 2001-10-02 日本アイ・ビー・エム株式会社 配線材料、金属配線層の形成方法
JPH08264790A (ja) 1995-03-22 1996-10-11 Toshiba Corp 薄膜電解効果トランジスタ及び液晶表示装置
KR100204071B1 (ko) 1995-08-29 1999-06-15 구자홍 박막트랜지스터-액정표시장치 및 제조방법
US6268895B1 (en) * 1995-10-27 2001-07-31 Sharp Kabushiki Kaisha Liquid crystal display device having light shield in periphery of display
US6333518B1 (en) 1997-08-26 2001-12-25 Lg Electronics Inc. Thin-film transistor and method of making same
KR100580398B1 (ko) * 1999-01-21 2006-05-15 삼성전자주식회사 액정 표시 장치용 박막 트랜지스터 기판 및 그 제조 방법
CN1195243C (zh) * 1999-09-30 2005-03-30 三星电子株式会社 用于液晶显示器的薄膜晶体管阵列屏板及其制造方法
US6403980B1 (en) 1999-11-05 2002-06-11 Samsung Electronics Co., Ltd. Thin film transistor array panel for liquid crystal display
JP4700160B2 (ja) * 2000-03-13 2011-06-15 株式会社半導体エネルギー研究所 半導体装置
US6500701B2 (en) * 2000-04-28 2002-12-31 Casio Computer Co., Ltd. Method of manufacturing thin film transistor panel having protective film of channel region
JP4785229B2 (ja) * 2000-05-09 2011-10-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001332740A (ja) * 2000-05-24 2001-11-30 Toshiba Corp アレイ基板の製造方法
TW499605B (en) 2000-10-27 2002-08-21 Acer Display Tech Inc Manufacture method of thin film transistor flat panel display
TW490857B (en) * 2001-02-05 2002-06-11 Samsung Electronics Co Ltd Thin film transistor array substrate for liquid crystal display and method of fabricating same
US7071037B2 (en) 2001-03-06 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2002337101A (ja) 2001-05-15 2002-11-27 Makita Corp ジグソー
KR100507283B1 (ko) * 2002-03-12 2005-08-09 비오이 하이디스 테크놀로지 주식회사 박막트랜지스터 액정표시장치의 제조방법
KR100499371B1 (ko) * 2002-04-17 2005-07-04 엘지.필립스 엘시디 주식회사 박막 트랜지스터 어레이 기판 및 그 제조 방법
KR100476366B1 (ko) * 2002-04-17 2005-03-16 엘지.필립스 엘시디 주식회사 박막 트랜지스터 어레이 기판 및 그 제조 방법
US7118943B2 (en) * 2002-04-22 2006-10-10 Seiko Epson Corporation Production method of a thin film device, production method of a transistor, electro-optical apparatus and electronic equipment
KR100887671B1 (ko) * 2002-12-23 2009-03-11 엘지디스플레이 주식회사 액정표시장치용 어레이기판과 그 제조방법
KR100682358B1 (ko) 2003-11-10 2007-02-15 엘지.필립스 엘시디 주식회사 액정 표시 패널 및 제조 방법

Also Published As

Publication number Publication date
FR2872344A1 (fr) 2005-12-30
JP4527615B2 (ja) 2010-08-18
US20100001278A1 (en) 2010-01-07
JP2006013513A (ja) 2006-01-12
GB2415542B (en) 2008-12-10
US7960199B2 (en) 2011-06-14
CN1713057A (zh) 2005-12-28
GB2415542A (en) 2005-12-28
GB0512103D0 (en) 2005-07-20
CN100388104C (zh) 2008-05-14
DE102005027445A1 (de) 2006-02-16
DE102005027445B4 (de) 2012-10-25
KR101126396B1 (ko) 2012-03-28
KR20050122654A (ko) 2005-12-29
US20050285195A1 (en) 2005-12-29
US7586123B2 (en) 2009-09-08

Similar Documents

Publication Publication Date Title
FR2872344B1 (fr) Substrat de reseau de transistors a couches minces et procede de fabrication de celui-ci
FR2880475B1 (fr) Substrat de matrice de transistors en couche mince et son procede de fabrication
FR2854732B1 (fr) Substrat de matrice de transistor a couche mince et procede de fabrication de celui-ci
GB0327848D0 (en) Array substrate having color filter ion thin film transistor structure for lcd device and method of fabricating the same
TW200629544A (en) Field effect transistor (FET) having wire channels and method of fabricating the same
TW200614855A (en) Organic thin film transistor array and manufacturing method thereof
WO2005086237A3 (fr) Transistor ldmos
TW200703735A (en) Organic thin film transistor array panel and method of manufacturing the same
TW200618311A (en) Thin film transistor array panel and method for manufacturing the same
TW200802885A (en) Thin film transistor, method for fabricating the same and display device
TW200725913A (en) Array substrate for liquid crystal display device and manufacturing method thereof
WO2006034189A3 (fr) Pfet en silicium en vrac a mobilite elevee
WO2003058723A1 (fr) Transistor a film mince organique et son procede de fabrication
EP1434282A3 (fr) Couche de protection pour un transistor organique à couche mince
TW200629563A (en) Thin film transistor array panel and method for manufacturing the same
TW200734780A (en) Display device and manufacturing method therefor
TW200727492A (en) Organic thin film transistor array panel
TW200641496A (en) Organic thin film transistor array panel and method of manufacturing the same
SE0303106D0 (sv) Ldmos transistor device, integrated circuit, and fabrication method thereof
SG132641A1 (en) Method of manufacturing a semiconductor structure
TW200711145A (en) Organic thin film transistor array panel and method for manufacturing the same
TW200505274A (en) Electro-luminescence device including a thin film transistor and method of fabricating an electro-luminescence device
TW200709430A (en) Method for forming a thin-film transistor
TW200715563A (en) Semiconductor device and method for manufacturing the same
TW200730981A (en) Thin film transistor array panel for liquid crystal display and manufacturing method thereof

Legal Events

Date Code Title Description
CD Change of name or company name
PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

ST Notification of lapse

Effective date: 20210206