FR2828766B1 - Circuit integre comprenant des elements actifs et au moins un element passif, notamment des cellules memoire dram et procede de fabrication - Google Patents
Circuit integre comprenant des elements actifs et au moins un element passif, notamment des cellules memoire dram et procede de fabricationInfo
- Publication number
- FR2828766B1 FR2828766B1 FR0110866A FR0110866A FR2828766B1 FR 2828766 B1 FR2828766 B1 FR 2828766B1 FR 0110866 A FR0110866 A FR 0110866A FR 0110866 A FR0110866 A FR 0110866A FR 2828766 B1 FR2828766 B1 FR 2828766B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- integrated circuit
- memory cells
- active elements
- passive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/485—Bit line contacts
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0110866A FR2828766B1 (fr) | 2001-08-16 | 2001-08-16 | Circuit integre comprenant des elements actifs et au moins un element passif, notamment des cellules memoire dram et procede de fabrication |
US09/955,926 US6958505B2 (en) | 2001-08-16 | 2001-09-18 | Integrated circuit including active components and at least one passive component associated fabrication method |
PCT/FR2002/002886 WO2003017361A1 (fr) | 2001-08-16 | 2002-08-14 | Circuit integre comprenant des cellules memoire dram et procede de fabrication |
JP2003522166A JP2005500694A (ja) | 2001-08-16 | 2002-08-14 | 集積回路および集積回路を製造する方法 |
EP02794817A EP1425794A1 (fr) | 2001-08-16 | 2002-08-14 | Circuit integre comprenant des cellules memoire dram et procede de fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0110866A FR2828766B1 (fr) | 2001-08-16 | 2001-08-16 | Circuit integre comprenant des elements actifs et au moins un element passif, notamment des cellules memoire dram et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2828766A1 FR2828766A1 (fr) | 2003-02-21 |
FR2828766B1 true FR2828766B1 (fr) | 2004-01-16 |
Family
ID=8866567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0110866A Expired - Fee Related FR2828766B1 (fr) | 2001-08-16 | 2001-08-16 | Circuit integre comprenant des elements actifs et au moins un element passif, notamment des cellules memoire dram et procede de fabrication |
Country Status (5)
Country | Link |
---|---|
US (1) | US6958505B2 (fr) |
EP (1) | EP1425794A1 (fr) |
JP (1) | JP2005500694A (fr) |
FR (1) | FR2828766B1 (fr) |
WO (1) | WO2003017361A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7268409B2 (en) * | 2004-05-21 | 2007-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spiral inductor with electrically controllable resistivity of silicon substrate layer |
US7602027B2 (en) * | 2006-12-29 | 2009-10-13 | Semiconductor Components Industries, L.L.C. | Semiconductor component and method of manufacture |
WO2008087498A1 (fr) * | 2007-01-17 | 2008-07-24 | Stmicroelectronics Crolles 2 Sas | Condensateur empilé de mémoire vive dynamique et son procédé de fabrication utilisant un polissage chimico-mécanique |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2757927B2 (ja) * | 1990-06-28 | 1998-05-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 半導体基板上の隔置されたシリコン領域の相互接続方法 |
US5381302A (en) * | 1993-04-02 | 1995-01-10 | Micron Semiconductor, Inc. | Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same |
JP3623834B2 (ja) * | 1995-01-31 | 2005-02-23 | 富士通株式会社 | 半導体記憶装置及びその製造方法 |
JP3532325B2 (ja) * | 1995-07-21 | 2004-05-31 | 株式会社東芝 | 半導体記憶装置 |
US7701059B1 (en) * | 1997-08-21 | 2010-04-20 | Micron Technology, Inc. | Low resistance metal silicide local interconnects and a method of making |
US6130102A (en) * | 1997-11-03 | 2000-10-10 | Motorola Inc. | Method for forming semiconductor device including a dual inlaid structure |
US6133599A (en) * | 1998-04-01 | 2000-10-17 | Vanguard International Semiconductor Corporation | Design and a novel process for formation of DRAM bit line and capacitor node contacts |
JP2000058783A (ja) * | 1998-08-06 | 2000-02-25 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
KR100268424B1 (ko) * | 1998-08-07 | 2000-10-16 | 윤종용 | 반도체 장치의 배선 형성 방법 |
US6037216A (en) * | 1998-11-02 | 2000-03-14 | Vanguard International Semiconductor Corporation | Method for simultaneously fabricating capacitor structures, for giga-bit DRAM cells, and peripheral interconnect structures, using a dual damascene process |
US6365453B1 (en) * | 1999-06-16 | 2002-04-02 | Micron Technology, Inc. | Method and structure for reducing contact aspect ratios |
FR2800199B1 (fr) * | 1999-10-21 | 2002-03-01 | St Microelectronics Sa | Fabrication de memoire dram |
US6492241B1 (en) * | 2000-04-10 | 2002-12-10 | Micron Technology, Inc. | Integrated capacitors fabricated with conductive metal oxides |
US6358820B1 (en) * | 2000-04-17 | 2002-03-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing semiconductor device |
-
2001
- 2001-08-16 FR FR0110866A patent/FR2828766B1/fr not_active Expired - Fee Related
- 2001-09-18 US US09/955,926 patent/US6958505B2/en not_active Expired - Lifetime
-
2002
- 2002-08-14 WO PCT/FR2002/002886 patent/WO2003017361A1/fr not_active Application Discontinuation
- 2002-08-14 JP JP2003522166A patent/JP2005500694A/ja active Pending
- 2002-08-14 EP EP02794817A patent/EP1425794A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2828766A1 (fr) | 2003-02-21 |
US20030034821A1 (en) | 2003-02-20 |
EP1425794A1 (fr) | 2004-06-09 |
US6958505B2 (en) | 2005-10-25 |
WO2003017361A1 (fr) | 2003-02-27 |
JP2005500694A (ja) | 2005-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |