FR2783448B1 - Procede de gravure d'un materiau solide transparent avec un faisceau laser - Google Patents

Procede de gravure d'un materiau solide transparent avec un faisceau laser

Info

Publication number
FR2783448B1
FR2783448B1 FR9903449A FR9903449A FR2783448B1 FR 2783448 B1 FR2783448 B1 FR 2783448B1 FR 9903449 A FR9903449 A FR 9903449A FR 9903449 A FR9903449 A FR 9903449A FR 2783448 B1 FR2783448 B1 FR 2783448B1
Authority
FR
France
Prior art keywords
etching
laser beam
solid material
transparent solid
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9903449A
Other languages
English (en)
Other versions
FR2783448A1 (fr
Inventor
Jun Wang
Hiroyuki Niino
Akira Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Publication of FR2783448A1 publication Critical patent/FR2783448A1/fr
Application granted granted Critical
Publication of FR2783448B1 publication Critical patent/FR2783448B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0207—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mining & Mineral Resources (AREA)
  • Laser Beam Processing (AREA)
FR9903449A 1998-09-21 1999-03-19 Procede de gravure d'un materiau solide transparent avec un faisceau laser Expired - Lifetime FR2783448B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10265837A JP3012926B1 (ja) 1998-09-21 1998-09-21 透明材料のレーザー微細加工法

Publications (2)

Publication Number Publication Date
FR2783448A1 FR2783448A1 (fr) 2000-03-24
FR2783448B1 true FR2783448B1 (fr) 2002-12-06

Family

ID=17422760

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9903449A Expired - Lifetime FR2783448B1 (fr) 1998-09-21 1999-03-19 Procede de gravure d'un materiau solide transparent avec un faisceau laser

Country Status (5)

Country Link
US (1) US6362453B1 (fr)
JP (1) JP3012926B1 (fr)
DE (1) DE19912879C2 (fr)
FR (1) FR2783448B1 (fr)
GB (1) GB2341580B (fr)

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JP2002192360A (ja) * 2000-12-26 2002-07-10 Amada Co Ltd レーザ加工方法及びその装置
DE10130349A1 (de) * 2001-06-22 2003-01-02 Konrad Seppelt Verfahren zum lokalen laserinduzierten Ätzen von Feststoffen
JP4961206B2 (ja) * 2003-06-06 2012-06-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 界面活性剤膜を用いるレーザ切削加工
DE10328559B4 (de) * 2003-06-24 2006-04-20 Leibniz-Institut für Oberflächenmodifizierung e.V. Verfahren zur Präzisionsbearbeitung von transparenten Materialien mit gepulster Laserstrahlung
DE10328534B4 (de) * 2003-06-24 2006-04-20 Leibniz-Institut für Oberflächenmodifizierung e.V. Vorrichtung und Verfahren zum Laserabtrag transparenter Materialien
US6990285B2 (en) * 2003-07-31 2006-01-24 Corning Incorporated Method of making at least one hole in a transparent body and devices made by this method
JP4784930B2 (ja) * 2003-09-11 2011-10-05 株式会社ニコン 高分子結晶の加工方法、高分子結晶の加工装置、及び高分子結晶の観察装置
US7027479B2 (en) * 2003-12-03 2006-04-11 The Boeing Company Volume absorbing laser beam dump
JP4565114B2 (ja) * 2005-03-23 2010-10-20 独立行政法人産業技術総合研究所 透明材料のレーザー微細加工方法及び装置
DE102005055174B8 (de) * 2005-11-18 2007-07-26 Leibniz-Institut für Oberflächenmodifizierung e.V. Verfahren zum Abtrag von lichtdurchlässigen Materialien mit Laserstrahlung und Vorrichtung hierfür
JP4753786B2 (ja) * 2006-04-27 2011-08-24 シグマ光機株式会社 短パルスレーザ加工方法および装置
DE102006030588A1 (de) * 2006-07-03 2008-01-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flüssigkeitsstrahlgeführtes Ätzverfahren zum Materialabtrag an Festkörpern sowie dessen Verwendung
JP2008036687A (ja) * 2006-08-08 2008-02-21 Research Foundation For Opto-Science & Technology 表面加工方法
JP4609592B2 (ja) * 2007-12-10 2011-01-12 コニカミノルタホールディングス株式会社 透明材料加工法及び透明材料加工装置
WO2009107837A1 (fr) * 2008-02-28 2009-09-03 株式会社ワイズ・マイクロテクノロジー Procédé de formation de trou traversant, et produit ayant un trou traversant
JP5336101B2 (ja) 2008-04-01 2013-11-06 信越化学工業株式会社 Ｓｏｉ基板の製造方法
JP5397937B2 (ja) * 2009-02-13 2014-01-22 セイコーインスツル株式会社 透明材料加工装置
JP5633070B2 (ja) * 2011-01-04 2014-12-03 独立行政法人産業技術総合研究所 レーザー誘起背面式の透明基板微細加工で使用される流動性物質
JP5896411B2 (ja) * 2012-05-14 2016-03-30 国立研究開発法人産業技術総合研究所 レーザー誘起背面式の透明基板微細加工を行う加工装置
US9919380B2 (en) * 2013-02-23 2018-03-20 Coherent, Inc. Shaping of brittle materials with controlled surface and bulk properties
US20160074968A1 (en) * 2014-09-11 2016-03-17 Suss Microtec Photonic Systems Inc. Laser etching system including mask reticle for multi-depth etching
WO2016122821A2 (fr) 2015-01-29 2016-08-04 Imra America, Inc. Modification de matériaux transparents induite par traitement laser
DE102015210286A1 (de) 2015-06-03 2016-12-08 3D-Micromac Ag Verfahren und Vorrichtung zur Herstellung eines strukturierten Elements sowie strukturiertes Element
KR20190116378A (ko) * 2017-03-06 2019-10-14 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
WO2019047145A1 (fr) * 2017-09-08 2019-03-14 深圳大学 Dispositif de fabrication de réseau de bragg sur fibre optique et son procédé de fabrication
CN107526131B (zh) * 2017-09-08 2023-11-03 深圳大学 一种制备光纤布拉格光栅的装置及其制备方法
US20190233321A1 (en) * 2018-01-26 2019-08-01 Corning Incorporated Liquid-assisted laser micromachining of transparent dielectrics
WO2020072394A1 (fr) * 2018-10-04 2020-04-09 Corning Incorporated Systèmes et procédés de formation d'affichages comprenant des électrodes latérales évidées
US20220350250A1 (en) * 2019-04-26 2022-11-03 Seoul National University R&Db Foundation Micropatterning method, micropatterning apparatus and micropatterning chip for silicone-based elastomer
CN115304376B (zh) * 2022-08-09 2023-04-18 之江实验室 一种透明陶瓷微流控芯片及其制备方法

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Also Published As

Publication number Publication date
DE19912879A1 (de) 2000-04-20
FR2783448A1 (fr) 2000-03-24
US6362453B1 (en) 2002-03-26
DE19912879C2 (de) 2002-11-07
GB2341580A (en) 2000-03-22
JP3012926B1 (ja) 2000-02-28
GB2341580B (en) 2000-11-15
JP2000094163A (ja) 2000-04-04
GB9906291D0 (en) 1999-05-12

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