FR2782597B1 - Module d'alimentation electrique - Google Patents
Module d'alimentation electriqueInfo
- Publication number
- FR2782597B1 FR2782597B1 FR9910726A FR9910726A FR2782597B1 FR 2782597 B1 FR2782597 B1 FR 2782597B1 FR 9910726 A FR9910726 A FR 9910726A FR 9910726 A FR9910726 A FR 9910726A FR 2782597 B1 FR2782597 B1 FR 2782597B1
- Authority
- FR
- France
- Prior art keywords
- power supply
- supply module
- module
- power
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P25/00—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details
- H02P25/02—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details characterised by the kind of motor
- H02P25/08—Reluctance motors
- H02P25/092—Converters specially adapted for controlling reluctance motors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9763798P | 1998-08-24 | 1998-08-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2782597A1 FR2782597A1 (fr) | 2000-02-25 |
FR2782597B1 true FR2782597B1 (fr) | 2005-06-17 |
Family
ID=22264406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9910726A Expired - Fee Related FR2782597B1 (fr) | 1998-08-24 | 1999-08-24 | Module d'alimentation electrique |
Country Status (4)
Country | Link |
---|---|
US (2) | US6166464A (fr) |
JP (1) | JP3103354B2 (fr) |
DE (1) | DE19939933B4 (fr) |
FR (1) | FR2782597B1 (fr) |
Families Citing this family (69)
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US6278199B1 (en) * | 1999-02-25 | 2001-08-21 | International Rectifier Corp. | Electronic single switch module |
KR20010058771A (ko) * | 1999-12-30 | 2001-07-06 | 구자홍 | 전기/전자 제품용 원 시스템 모듈 |
US6555937B2 (en) * | 2000-02-01 | 2003-04-29 | Denso Corporation | Vehicle alternator rectifier having L-shaped connection terminals |
DE10004059A1 (de) * | 2000-02-01 | 2001-11-08 | Buhler Motor Gmbh | Mehrphasen-Motor |
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US6912134B2 (en) * | 2000-09-12 | 2005-06-28 | International Rectifier Corporation | Fan control circuit and package |
DE10064194B4 (de) * | 2000-12-22 | 2006-12-07 | Infineon Technologies Ag | Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls |
US7046518B2 (en) * | 2001-04-02 | 2006-05-16 | International Rectifier Corporation | Power module |
DE10141114C1 (de) * | 2001-06-08 | 2002-11-21 | Semikron Elektronik Gmbh | Schaltungsanordnung |
GB0114531D0 (en) | 2001-06-14 | 2001-08-08 | Switched Reluctance Drives Ltd | A control strategy for switched reluctance drive systems |
US6531782B1 (en) | 2001-06-19 | 2003-03-11 | Cypress Semiconductor Corp. | Method of placing die to minimize die-to-die routing complexity on a substrate |
DE10254910B4 (de) * | 2001-11-26 | 2008-12-24 | AutoNetworks Technologies, Ltd., Nagoya | Schaltkreisbildende Einheit und Verfahren zu deren Herstellung |
DE10204200A1 (de) * | 2002-02-01 | 2003-08-21 | Conti Temic Microelectronic | Leistungsmodul |
DE10205816A1 (de) * | 2002-02-13 | 2003-08-14 | Bosch Gmbh Robert | Gehäuse für ein elektrisches Gerät |
ITPR20020037A1 (it) * | 2002-07-26 | 2004-01-26 | Zapi S P A | Procedimento per misurare le correnti di fase di un dispositivo per il controllo di motori elettrici realizzato in tecnologia ims o affine i |
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US6891725B2 (en) * | 2002-09-23 | 2005-05-10 | Siemens Energy & Automation, Inc. | System and method for improved motor controller |
KR100902766B1 (ko) * | 2002-09-27 | 2009-06-15 | 페어차일드코리아반도체 주식회사 | 절연성 세라믹 히트 싱크를 갖는 디스크리트 패키지 |
JP4186732B2 (ja) * | 2003-07-24 | 2008-11-26 | 株式会社村田製作所 | 電子機器 |
FR2859066A1 (fr) * | 2003-08-14 | 2005-02-25 | Int Rectifier Corp | Module de puissance a grille de connexion formant un insert de moulage |
US7187551B2 (en) * | 2003-08-14 | 2007-03-06 | International Rectifier Corporation | Module for solid state relay for engine cooling fan control |
JP4471752B2 (ja) * | 2004-07-06 | 2010-06-02 | 日立オートモティブシステムズ株式会社 | 電動パワーステアリング用制御装置および電動パワーステアリングシステム |
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US7745930B2 (en) * | 2005-04-25 | 2010-06-29 | International Rectifier Corporation | Semiconductor device packages with substrates for redistributing semiconductor device electrodes |
EP1878031B1 (fr) * | 2005-05-02 | 2014-06-04 | Epcos Ag | Module d' électronique de puissance |
ATE512446T1 (de) * | 2005-05-02 | 2011-06-15 | Epcos Ag | Modul der leistungselektronik umfassend einen kondensator |
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US7336491B2 (en) * | 2005-09-06 | 2008-02-26 | Lear Corporation | Heat sink |
DE102006011674A1 (de) * | 2006-03-14 | 2007-09-20 | Arvinmeritor Light Vehicle Systems-France | Leiterplatte mit Masseleiter für einen Elektromotor, und Elektromotor |
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JP4909961B2 (ja) * | 2008-09-02 | 2012-04-04 | 日立オートモティブシステムズ株式会社 | 電動パワーステアリング用制御装置 |
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JP5067679B2 (ja) * | 2010-05-21 | 2012-11-07 | 株式会社デンソー | 半導体モジュール、および、それを用いた駆動装置 |
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FR2975253B1 (fr) * | 2011-05-13 | 2016-12-23 | Valeo Systemes De Controle Moteur | Assemblage d'un module electronique de puissance et d'une carte pcb a faible encombrement |
CN103582976A (zh) * | 2011-05-31 | 2014-02-12 | 伊顿公司 | 插入式复合配电组件和包括该组件的系统 |
JP5808630B2 (ja) * | 2011-09-28 | 2015-11-10 | 株式会社ミツバ | Srモータ用制御装置 |
US20140105767A1 (en) * | 2012-10-16 | 2014-04-17 | Denso Corporation | Power supply module |
DE102012112389A1 (de) * | 2012-12-17 | 2014-06-18 | Aptronic Ag | Elektrische Baugruppe zur Montage auf einer Hutschiene |
KR102034717B1 (ko) * | 2013-02-07 | 2019-10-21 | 삼성전자주식회사 | 파워모듈용 기판, 파워모듈용 터미널 및 이들을 포함하는 파워모듈 |
FR3004058B1 (fr) * | 2013-03-26 | 2016-12-16 | Valeo Systemes Thermiques | Module de commande d'un appareil electrique |
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CN106452272B (zh) * | 2016-11-04 | 2018-08-28 | 南京怡咖电气科技有限公司 | 一种用于电动车的开关磁阻电机集成驱动装置 |
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DE19646396C2 (de) * | 1996-11-11 | 2001-06-28 | Semikron Elektronik Gmbh | Leistungshalbleitermodul für verschiedene Schaltungsvarianten |
US5838133A (en) * | 1997-05-14 | 1998-11-17 | Mccann; Roy A. | Switched reluctance motor controller |
DE19720695A1 (de) * | 1997-05-16 | 1998-11-26 | Honeywell Ag | Umformer |
JP3031323B2 (ja) * | 1997-12-26 | 2000-04-10 | 日本電気株式会社 | 半導体装置とその製造方法 |
US6201701B1 (en) * | 1998-03-11 | 2001-03-13 | Kimball International, Inc. | Integrated substrate with enhanced thermal characteristics |
-
1999
- 1999-08-17 US US09/375,716 patent/US6166464A/en not_active Expired - Fee Related
- 1999-08-23 DE DE19939933A patent/DE19939933B4/de not_active Expired - Fee Related
- 1999-08-24 JP JP11236402A patent/JP3103354B2/ja not_active Expired - Fee Related
- 1999-08-24 FR FR9910726A patent/FR2782597B1/fr not_active Expired - Fee Related
-
2000
- 2000-09-12 US US09/660,305 patent/US6441520B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3103354B2 (ja) | 2000-10-30 |
DE19939933B4 (de) | 2004-05-13 |
US6166464A (en) | 2000-12-26 |
FR2782597A1 (fr) | 2000-02-25 |
US6441520B1 (en) | 2002-08-27 |
DE19939933A1 (de) | 2000-04-06 |
JP2000091500A (ja) | 2000-03-31 |
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