FR2740648B1 - Connexion sans brasure de contacts electriques utlisant un systeme a combinaison de laser et connexion a poussee par fibre optique - Google Patents
Connexion sans brasure de contacts electriques utlisant un systeme a combinaison de laser et connexion a poussee par fibre optiqueInfo
- Publication number
- FR2740648B1 FR2740648B1 FR9613239A FR9613239A FR2740648B1 FR 2740648 B1 FR2740648 B1 FR 2740648B1 FR 9613239 A FR9613239 A FR 9613239A FR 9613239 A FR9613239 A FR 9613239A FR 2740648 B1 FR2740648 B1 FR 2740648B1
- Authority
- FR
- France
- Prior art keywords
- connection
- electrical
- unsolded
- electrical contacts
- thicknesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title 1
- 239000013307 optical fiber Substances 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Wire Bonding (AREA)
- Laser Beam Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Electronic Switches (AREA)
Abstract
La présente invention concerne un procédé d'attache de fils électriques (208), agencés sur un circuit TAB, sur des surépaisseurs (210) de contact électrique par un faisceau laser à longueur d'onde spécifiée. Il comprend les étapes consistant à: agencer sur la surface supérieure des fils électriques (208) un métal de germe dont l'absorption à la longueur d'onde du faisceau laser est appropriée; aligner les fils électriques (208) avec les surépaisseurs (210) de contact électrique, les fils électriques (208) étant superposés aux surépaisseurs (210) de contact électrique; maintenir en contact à l'aide d'une fibre optique (204) les fils électriques (208) et les surépaisseurs (210) de contact électrique à une surface d'attache (206); et attacher les fils électriques (208) et les surépaisseurs (210) de contact électrique à la surface d'attache (206) en dirigeant le faisceau laser à travers la fibre optique (204).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55856795A | 1995-10-31 | 1995-10-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2740648A1 FR2740648A1 (fr) | 1997-04-30 |
FR2740648B1 true FR2740648B1 (fr) | 2002-11-01 |
Family
ID=24230044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9613239A Expired - Fee Related FR2740648B1 (fr) | 1995-10-31 | 1996-10-30 | Connexion sans brasure de contacts electriques utlisant un systeme a combinaison de laser et connexion a poussee par fibre optique |
Country Status (6)
Country | Link |
---|---|
US (2) | US6397465B1 (fr) |
JP (1) | JP3630511B2 (fr) |
KR (1) | KR100256464B1 (fr) |
DE (1) | DE19644121C2 (fr) |
FR (1) | FR2740648B1 (fr) |
TW (1) | TW309483B (fr) |
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US6236015B1 (en) | 1995-10-31 | 2001-05-22 | Hewlett-Packard Company | Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding |
US5847356A (en) * | 1996-08-30 | 1998-12-08 | Hewlett-Packard Company | Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system |
US6670222B1 (en) * | 1997-06-14 | 2003-12-30 | Jds Uniphase Corporation | Texturing of a die pad surface for enhancing bonding strength in the surface attachment |
DE10036900C2 (de) | 2000-07-28 | 2002-07-11 | Siemens Ag | Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner |
DE10133731C2 (de) * | 2001-07-11 | 2003-08-14 | Huf Tools Gmbh | Verfahren zum Herstellen eines elektrischen Endprodukts, welches Löt-oder Schweißstellen aufweist |
US6706402B2 (en) | 2001-07-25 | 2004-03-16 | Nantero, Inc. | Nanotube films and articles |
EP1512317B1 (fr) * | 2002-05-24 | 2010-07-14 | Koninklijke Philips Electronics N.V. | Procede concu pour transferer un composant supporte par un support dans une position souhaitee sur un substrat et dispositif associe |
KR100467589B1 (ko) * | 2002-06-21 | 2005-01-24 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 fpc 배선 연결방법 |
EP1405712B1 (fr) * | 2002-10-02 | 2004-07-21 | Leister Process Technologies | Procédé et dispositif pour traiter des pièces au moyen d'un rayon laser |
US6951778B2 (en) * | 2002-10-31 | 2005-10-04 | Hewlett-Packard Development Company, L.P. | Edge-sealed substrates and methods for effecting the same |
EP1578556A1 (fr) * | 2002-12-20 | 2005-09-28 | Koninklijke Philips Electronics N.V. | Procede et dispositif de soudage par points laser |
US20040150688A1 (en) * | 2003-01-30 | 2004-08-05 | Kin-Ming Kwan | Measuring laser light transmissivity in a to-be-welded region of a work piece |
US20050099449A1 (en) * | 2003-11-07 | 2005-05-12 | Tim Frasure | Methods and structures for disassembling inkjet printhead components and control therefor |
GB2410467A (en) * | 2004-01-30 | 2005-08-03 | Hewlett Packard Development Co | A method of making an inkjet printhead |
JP4552671B2 (ja) * | 2005-01-31 | 2010-09-29 | ブラザー工業株式会社 | 基板接合体、インクジェットヘッド及びこれらの製造方法 |
JP4726195B2 (ja) * | 2005-04-14 | 2011-07-20 | キヤノン株式会社 | 液体吐出記録ヘッドおよびそれを備える液体吐出記録装置 |
JP4684784B2 (ja) * | 2005-07-26 | 2011-05-18 | リコーマイクロエレクトロニクス株式会社 | 電極接合方法及びその装置 |
DE102005063272A1 (de) * | 2005-12-30 | 2007-07-05 | Robert Bosch Gmbh | Flexible Leiterplatte und Kontaktierverfahren |
US7524731B2 (en) * | 2006-09-29 | 2009-04-28 | Freescale Semiconductor, Inc. | Process of forming an electronic device including an inductor |
JP2008307710A (ja) * | 2007-06-12 | 2008-12-25 | Canon Inc | インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法およびインクジェット記録ヘッドの実装ツール |
JP5197175B2 (ja) * | 2008-06-16 | 2013-05-15 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
US8998384B2 (en) * | 2011-03-31 | 2015-04-07 | Hewlett-Packard Development Company, L.P. | Circuits and methods using a non-gold corrosion inhibitor |
CN103056540B (zh) * | 2012-12-19 | 2014-11-05 | 长春轨道客车股份有限公司 | 不锈钢多层板电阻点焊接头焊接前的强度试验方法 |
EP2919275B1 (fr) | 2014-03-13 | 2021-08-18 | Airbus Defence and Space GmbH | Interconnecteur de cellule solaire, cellule solaire et procédé d'interconnexion de réseau de cellules solaires d'un réseau de cellules solaires |
US10005935B2 (en) | 2015-05-01 | 2018-06-26 | Lord Corporation | Adhesive for rubber bonding |
CN108419385A (zh) * | 2017-02-10 | 2018-08-17 | 天津市松正电动汽车技术股份有限公司 | 电动车控制器 |
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-
1996
- 1996-07-20 TW TW085108857A patent/TW309483B/zh active
- 1996-10-23 DE DE19644121A patent/DE19644121C2/de not_active Expired - Fee Related
- 1996-10-25 JP JP28349496A patent/JP3630511B2/ja not_active Expired - Fee Related
- 1996-10-30 FR FR9613239A patent/FR2740648B1/fr not_active Expired - Fee Related
- 1996-10-30 KR KR1019960049999A patent/KR100256464B1/ko not_active IP Right Cessation
-
1997
- 1997-04-16 US US08/843,492 patent/US6397465B1/en not_active Expired - Fee Related
-
2002
- 2002-06-03 US US10/161,472 patent/US6983539B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3630511B2 (ja) | 2005-03-16 |
DE19644121A1 (de) | 1997-05-07 |
TW309483B (fr) | 1997-07-01 |
US6983539B2 (en) | 2006-01-10 |
US20030041455A1 (en) | 2003-03-06 |
JPH09172034A (ja) | 1997-06-30 |
KR100256464B1 (ko) | 2000-05-15 |
US6397465B1 (en) | 2002-06-04 |
FR2740648A1 (fr) | 1997-04-30 |
DE19644121C2 (de) | 2003-01-30 |
KR970020436A (ko) | 1997-05-28 |
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ST | Notification of lapse |
Effective date: 20110630 |