FR2538618B1 - Boitier pour composant electronique comportant un element fixant l'humidite - Google Patents

Boitier pour composant electronique comportant un element fixant l'humidite

Info

Publication number
FR2538618B1
FR2538618B1 FR8221871A FR8221871A FR2538618B1 FR 2538618 B1 FR2538618 B1 FR 2538618B1 FR 8221871 A FR8221871 A FR 8221871A FR 8221871 A FR8221871 A FR 8221871A FR 2538618 B1 FR2538618 B1 FR 2538618B1
Authority
FR
France
Prior art keywords
electronic component
fixing element
component housing
moisture fixing
moisture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8221871A
Other languages
English (en)
French (fr)
Other versions
FR2538618A1 (fr
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Original Assignee
D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie filed Critical D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Priority to FR8221871A priority Critical patent/FR2538618B1/fr
Priority to DE8383402489T priority patent/DE3375624D1/de
Priority to EP83402489A priority patent/EP0113282B1/fr
Priority to US06/565,042 priority patent/US4553020A/en
Priority to JP58245634A priority patent/JPS59171147A/ja
Publication of FR2538618A1 publication Critical patent/FR2538618A1/fr
Application granted granted Critical
Publication of FR2538618B1 publication Critical patent/FR2538618B1/fr
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Casings For Electric Apparatus (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
FR8221871A 1982-12-28 1982-12-28 Boitier pour composant electronique comportant un element fixant l'humidite Expired FR2538618B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8221871A FR2538618B1 (fr) 1982-12-28 1982-12-28 Boitier pour composant electronique comportant un element fixant l'humidite
DE8383402489T DE3375624D1 (en) 1982-12-28 1983-12-20 Housing for an electronic component having a humidity fixing element
EP83402489A EP0113282B1 (fr) 1982-12-28 1983-12-20 Boîtier pour composant électronique comportant un élément fixant l'humidité
US06/565,042 US4553020A (en) 1982-12-28 1983-12-23 Electronic component package comprising a moisture-retention element
JP58245634A JPS59171147A (ja) 1982-12-28 1983-12-28 電子部品用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8221871A FR2538618B1 (fr) 1982-12-28 1982-12-28 Boitier pour composant electronique comportant un element fixant l'humidite

Publications (2)

Publication Number Publication Date
FR2538618A1 FR2538618A1 (fr) 1984-06-29
FR2538618B1 true FR2538618B1 (fr) 1986-03-07

Family

ID=9280563

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8221871A Expired FR2538618B1 (fr) 1982-12-28 1982-12-28 Boitier pour composant electronique comportant un element fixant l'humidite

Country Status (5)

Country Link
US (1) US4553020A (enExample)
EP (1) EP0113282B1 (enExample)
JP (1) JPS59171147A (enExample)
DE (1) DE3375624D1 (enExample)
FR (1) FR2538618B1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802277A (en) * 1985-04-12 1989-02-07 Hughes Aircraft Company Method of making a chip carrier slotted array
US4762606A (en) * 1985-04-12 1988-08-09 Hughes Aircraft Company Mini chip carrier slotted array
IL78192A (en) * 1985-04-12 1992-03-29 Hughes Aircraft Co Mini chip carrier slotted array
EP0209642A3 (en) * 1985-07-25 1987-04-15 Hewlett-Packard Company Ceramic microcircuit package
US4777434A (en) * 1985-10-03 1988-10-11 Amp Incorporated Microelectronic burn-in system
FR2588770B1 (fr) * 1985-10-22 1989-10-27 Inf Milit Spatiale Aeronaut Dispositif de limitation de l'humidite dans une enceinte, notamment applicable a un boitier de composant electronique
FR2591801B1 (fr) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut Boitier d'encapsulation d'un circuit electronique
DE3784213T2 (de) * 1986-10-29 1993-06-03 Toshiba Kawasaki Kk Elektronischer apparat mit einem keramischen substrat.
GB2233821A (en) * 1989-07-11 1991-01-16 Oxley Dev Co Ltd Ceramic package including a semiconductor chip
US5166607A (en) * 1991-05-31 1992-11-24 Vlsi Technology, Inc. Method and apparatus to heat the surface of a semiconductor die in a device during burn-in while withdrawing heat from device leads
US5397916A (en) * 1991-12-10 1995-03-14 Normington; Peter J. C. Semiconductor device including stacked die
US5281852A (en) * 1991-12-10 1994-01-25 Normington Peter J C Semiconductor device including stacked die
FR2688629A1 (fr) * 1992-03-10 1993-09-17 Thomson Csf Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices.
US5513198A (en) * 1993-07-14 1996-04-30 Corning Incorporated Packaging of high power semiconductor lasers
FR2709020B1 (fr) * 1993-08-13 1995-09-08 Thomson Csf Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant.
FR2719967B1 (fr) * 1994-05-10 1996-06-07 Thomson Csf Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés.
US5696785A (en) * 1994-10-11 1997-12-09 Corning Incorporated Impurity getters in laser enclosures
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
US5694740A (en) * 1996-03-15 1997-12-09 Analog Devices, Inc. Micromachined device packaged to reduce stiction
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
US6483078B2 (en) 2000-02-09 2002-11-19 Oceanit Laboratories, Inc. Moisture control system for electrical devices
US6664511B2 (en) * 2001-07-09 2003-12-16 Jds Uniphase Corporation Package for optical components
FR2832136B1 (fr) * 2001-11-09 2005-02-18 3D Plus Sa Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte
US6667461B1 (en) * 2002-06-19 2003-12-23 Tyco Electronics Corporation Multiple load protection and control device
FR2875672B1 (fr) * 2004-09-21 2007-05-11 3D Plus Sa Sa Dispositif electronique avec repartiteur de chaleur integre
TW200614854A (en) * 2004-10-29 2006-05-01 Chunghwa Picture Tubes Ltd Organic electro-luminescence display panel and fabricating process thereof
FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
FR2894070B1 (fr) * 2005-11-30 2008-04-11 3D Plus Sa Sa Module electronique 3d
FR2895568B1 (fr) * 2005-12-23 2008-02-08 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2905198B1 (fr) * 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
FR2943176B1 (fr) 2009-03-10 2011-08-05 3D Plus Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee
DE102012200273A1 (de) 2012-01-11 2013-07-11 Robert Bosch Gmbh Elektronisches Bauteil mit korrosionsgeschützter Bondverbindung und Verfahren zur Herstellung des Bauteils
EP4177935A1 (en) * 2021-11-03 2023-05-10 Schott Ag Hermetic laser-welded enclosure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE25647C (de) * J. GJERS in Middlesbrough on Tees, York (England) Gemauerte Ausgleichkammern
US2127121A (en) * 1932-09-24 1938-08-16 John E Kelley Drier for hair and skin
US2469435A (en) * 1944-01-17 1949-05-10 Hirsch Abraham Adler Regenerable desiccator
US2882244A (en) * 1953-12-24 1959-04-14 Union Carbide Corp Molecular sieve adsorbents
US3304623A (en) * 1964-07-13 1967-02-21 Realistic Company Hair dryer
US3391517A (en) * 1966-05-26 1968-07-09 Western Electric Co Methods and apparatus for seating nonmagnetic articles in paramagnetic containers
US3586926A (en) * 1967-11-30 1971-06-22 Nippon Electric Co Hermetically sealed semiconductor device with absorptive agent
GB1501878A (en) * 1975-09-09 1978-02-22 Thorn Electrical Ind Ltd Electroluminescent panel
DE2744146C3 (de) * 1977-09-30 1982-03-11 Heimann Gmbh, 6200 Wiesbaden Regelbare Wasserstoffquelle mit Getterwirkung zum Einbau in Elektronenröhren, insbesondere Vidikonröhren
GB2049274B (en) * 1979-03-16 1983-04-27 Sharp Kk Moisture absorptive arrangement for a glass sealed thinfilm electroluminescent display panel
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
US4352119A (en) * 1979-09-17 1982-09-28 Beckman Instruments, Inc. Electrical device and method for particle entrapment device for an electrical component
JPS56137658A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device
US4426769A (en) * 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages

Also Published As

Publication number Publication date
JPS59171147A (ja) 1984-09-27
US4553020A (en) 1985-11-12
DE3375624D1 (en) 1988-03-10
FR2538618A1 (fr) 1984-06-29
JPH0322702B2 (enExample) 1991-03-27
EP0113282B1 (fr) 1988-02-03
EP0113282A1 (fr) 1984-07-11

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Legal Events

Date Code Title Description
ST Notification of lapse