JPS59171147A - 電子部品用パツケ−ジ - Google Patents

電子部品用パツケ−ジ

Info

Publication number
JPS59171147A
JPS59171147A JP58245634A JP24563483A JPS59171147A JP S59171147 A JPS59171147 A JP S59171147A JP 58245634 A JP58245634 A JP 58245634A JP 24563483 A JP24563483 A JP 24563483A JP S59171147 A JPS59171147 A JP S59171147A
Authority
JP
Japan
Prior art keywords
package
retaining element
moisture retaining
base
moisture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58245634A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322702B2 (enExample
Inventor
クリスチヤン・バル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Original Assignee
D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie filed Critical D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Publication of JPS59171147A publication Critical patent/JPS59171147A/ja
Publication of JPH0322702B2 publication Critical patent/JPH0322702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Casings For Electric Apparatus (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
JP58245634A 1982-12-28 1983-12-28 電子部品用パツケ−ジ Granted JPS59171147A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8221871A FR2538618B1 (fr) 1982-12-28 1982-12-28 Boitier pour composant electronique comportant un element fixant l'humidite
FR8221871 1982-12-28

Publications (2)

Publication Number Publication Date
JPS59171147A true JPS59171147A (ja) 1984-09-27
JPH0322702B2 JPH0322702B2 (enExample) 1991-03-27

Family

ID=9280563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58245634A Granted JPS59171147A (ja) 1982-12-28 1983-12-28 電子部品用パツケ−ジ

Country Status (5)

Country Link
US (1) US4553020A (enExample)
EP (1) EP0113282B1 (enExample)
JP (1) JPS59171147A (enExample)
DE (1) DE3375624D1 (enExample)
FR (1) FR2538618B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015503851A (ja) * 2012-01-11 2015-02-02 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ 腐食保護されたボンディング接続部を有する電子デバイス、及び、該電子デバイスの製造方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802277A (en) * 1985-04-12 1989-02-07 Hughes Aircraft Company Method of making a chip carrier slotted array
US4762606A (en) * 1985-04-12 1988-08-09 Hughes Aircraft Company Mini chip carrier slotted array
IL78192A (en) * 1985-04-12 1992-03-29 Hughes Aircraft Co Mini chip carrier slotted array
EP0209642A3 (en) * 1985-07-25 1987-04-15 Hewlett-Packard Company Ceramic microcircuit package
US4777434A (en) * 1985-10-03 1988-10-11 Amp Incorporated Microelectronic burn-in system
FR2588770B1 (fr) * 1985-10-22 1989-10-27 Inf Milit Spatiale Aeronaut Dispositif de limitation de l'humidite dans une enceinte, notamment applicable a un boitier de composant electronique
FR2591801B1 (fr) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut Boitier d'encapsulation d'un circuit electronique
DE3784213T2 (de) * 1986-10-29 1993-06-03 Toshiba Kawasaki Kk Elektronischer apparat mit einem keramischen substrat.
GB2233821A (en) * 1989-07-11 1991-01-16 Oxley Dev Co Ltd Ceramic package including a semiconductor chip
US5166607A (en) * 1991-05-31 1992-11-24 Vlsi Technology, Inc. Method and apparatus to heat the surface of a semiconductor die in a device during burn-in while withdrawing heat from device leads
US5397916A (en) * 1991-12-10 1995-03-14 Normington; Peter J. C. Semiconductor device including stacked die
US5281852A (en) * 1991-12-10 1994-01-25 Normington Peter J C Semiconductor device including stacked die
FR2688629A1 (fr) * 1992-03-10 1993-09-17 Thomson Csf Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices.
US5513198A (en) * 1993-07-14 1996-04-30 Corning Incorporated Packaging of high power semiconductor lasers
FR2709020B1 (fr) * 1993-08-13 1995-09-08 Thomson Csf Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant.
FR2719967B1 (fr) * 1994-05-10 1996-06-07 Thomson Csf Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés.
US5696785A (en) * 1994-10-11 1997-12-09 Corning Incorporated Impurity getters in laser enclosures
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
US5694740A (en) * 1996-03-15 1997-12-09 Analog Devices, Inc. Micromachined device packaged to reduce stiction
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
US6483078B2 (en) 2000-02-09 2002-11-19 Oceanit Laboratories, Inc. Moisture control system for electrical devices
US6664511B2 (en) * 2001-07-09 2003-12-16 Jds Uniphase Corporation Package for optical components
FR2832136B1 (fr) * 2001-11-09 2005-02-18 3D Plus Sa Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte
US6667461B1 (en) * 2002-06-19 2003-12-23 Tyco Electronics Corporation Multiple load protection and control device
FR2875672B1 (fr) * 2004-09-21 2007-05-11 3D Plus Sa Sa Dispositif electronique avec repartiteur de chaleur integre
TW200614854A (en) * 2004-10-29 2006-05-01 Chunghwa Picture Tubes Ltd Organic electro-luminescence display panel and fabricating process thereof
FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
FR2894070B1 (fr) * 2005-11-30 2008-04-11 3D Plus Sa Sa Module electronique 3d
FR2895568B1 (fr) * 2005-12-23 2008-02-08 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2905198B1 (fr) * 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
FR2943176B1 (fr) 2009-03-10 2011-08-05 3D Plus Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee
EP4177935A1 (en) * 2021-11-03 2023-05-10 Schott Ag Hermetic laser-welded enclosure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE25647C (de) * J. GJERS in Middlesbrough on Tees, York (England) Gemauerte Ausgleichkammern
US2127121A (en) * 1932-09-24 1938-08-16 John E Kelley Drier for hair and skin
US2469435A (en) * 1944-01-17 1949-05-10 Hirsch Abraham Adler Regenerable desiccator
US2882244A (en) * 1953-12-24 1959-04-14 Union Carbide Corp Molecular sieve adsorbents
US3304623A (en) * 1964-07-13 1967-02-21 Realistic Company Hair dryer
US3391517A (en) * 1966-05-26 1968-07-09 Western Electric Co Methods and apparatus for seating nonmagnetic articles in paramagnetic containers
US3586926A (en) * 1967-11-30 1971-06-22 Nippon Electric Co Hermetically sealed semiconductor device with absorptive agent
GB1501878A (en) * 1975-09-09 1978-02-22 Thorn Electrical Ind Ltd Electroluminescent panel
DE2744146C3 (de) * 1977-09-30 1982-03-11 Heimann Gmbh, 6200 Wiesbaden Regelbare Wasserstoffquelle mit Getterwirkung zum Einbau in Elektronenröhren, insbesondere Vidikonröhren
GB2049274B (en) * 1979-03-16 1983-04-27 Sharp Kk Moisture absorptive arrangement for a glass sealed thinfilm electroluminescent display panel
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
US4352119A (en) * 1979-09-17 1982-09-28 Beckman Instruments, Inc. Electrical device and method for particle entrapment device for an electrical component
JPS56137658A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device
US4426769A (en) * 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015503851A (ja) * 2012-01-11 2015-02-02 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ 腐食保護されたボンディング接続部を有する電子デバイス、及び、該電子デバイスの製造方法

Also Published As

Publication number Publication date
US4553020A (en) 1985-11-12
DE3375624D1 (en) 1988-03-10
FR2538618A1 (fr) 1984-06-29
JPH0322702B2 (enExample) 1991-03-27
EP0113282B1 (fr) 1988-02-03
FR2538618B1 (fr) 1986-03-07
EP0113282A1 (fr) 1984-07-11

Similar Documents

Publication Publication Date Title
JPS59171147A (ja) 電子部品用パツケ−ジ
US5742007A (en) Electronic device package and method for forming the same
JPH08316364A (ja) 半導体装置
JPS55163850A (en) Semiconductor device
JPS6119118B2 (enExample)
US6165816A (en) Fabrication of electronic components having a hollow package structure with a ceramic lid
JPS6411354A (en) Sealing structure of electronic circuit
JPS6473753A (en) Semiconductor integrated circuit device
JPS5850021B2 (ja) 半導体装置の製法
CA1217570A (en) Electronic component package comprising a moisture retention element
KR100244826B1 (ko) 반도체장치 및 그 제조방법
JPS62110731A (ja) 特に電子素子パツケ−ジに適用が可能な、容器内の湿度制御装置
JPS61194735A (ja) 半導体装置
US6888232B2 (en) Semiconductor package having a heat-activated source of releasable hydrogen
JPS5745262A (en) Sealing and fitting structure of semiconductor device
JPS54129880A (en) Manufacture for semiconductor device
JPS5851424B2 (ja) 半導体装置
JPS6124257A (ja) 固体デバイス素子
JPS5565448A (en) Ceramic package for semiconductor device
JPH0317238B2 (enExample)
JPS6123345A (ja) 半導体装置
JPS6127641A (ja) 集積回路装置の製造方法
JPS5956746A (ja) 半導体パツケ−ジ
JPS54102969A (en) Semiconductor device
JPS6118157A (ja) 半導体装置