FR2515427A1 - Procede de fabrication de resistances de forte valeur pour circuits integres - Google Patents
Procede de fabrication de resistances de forte valeur pour circuits integres Download PDFInfo
- Publication number
- FR2515427A1 FR2515427A1 FR8120165A FR8120165A FR2515427A1 FR 2515427 A1 FR2515427 A1 FR 2515427A1 FR 8120165 A FR8120165 A FR 8120165A FR 8120165 A FR8120165 A FR 8120165A FR 2515427 A1 FR2515427 A1 FR 2515427A1
- Authority
- FR
- France
- Prior art keywords
- polycrystalline silicon
- silicide
- layer
- resistors
- pawns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/40—Resistors
- H10D1/47—Resistors having no potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- H10P76/202—
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8120165A FR2515427A1 (fr) | 1981-10-27 | 1981-10-27 | Procede de fabrication de resistances de forte valeur pour circuits integres |
| US06/423,722 US4451328A (en) | 1981-10-27 | 1982-09-27 | Manufacturing TaSi-polysilicon conductors having high-resistance elements by a liftoff technique |
| EP82401873A EP0078190B1 (fr) | 1981-10-27 | 1982-10-12 | Procédé de fabrication de résistances de forte valeur pour circuits intégrés |
| DE8282401873T DE3264575D1 (en) | 1981-10-27 | 1982-10-12 | Process for manufacturing high value resistors for integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8120165A FR2515427A1 (fr) | 1981-10-27 | 1981-10-27 | Procede de fabrication de resistances de forte valeur pour circuits integres |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2515427A1 true FR2515427A1 (fr) | 1983-04-29 |
| FR2515427B1 FR2515427B1 (show.php) | 1983-12-02 |
Family
ID=9263434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8120165A Granted FR2515427A1 (fr) | 1981-10-27 | 1981-10-27 | Procede de fabrication de resistances de forte valeur pour circuits integres |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4451328A (show.php) |
| EP (1) | EP0078190B1 (show.php) |
| DE (1) | DE3264575D1 (show.php) |
| FR (1) | FR2515427A1 (show.php) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4570328A (en) * | 1983-03-07 | 1986-02-18 | Motorola, Inc. | Method of producing titanium nitride MOS device gate electrode |
| JPS59232456A (ja) * | 1983-06-16 | 1984-12-27 | Hitachi Ltd | 薄膜回路素子 |
| JPS60130844A (ja) * | 1983-12-20 | 1985-07-12 | Toshiba Corp | 半導体装置の製造方法 |
| US4581815A (en) * | 1984-03-01 | 1986-04-15 | Advanced Micro Devices, Inc. | Integrated circuit structure having intermediate metal silicide layer and method of making same |
| US4693925A (en) * | 1984-03-01 | 1987-09-15 | Advanced Micro Devices, Inc. | Integrated circuit structure having intermediate metal silicide layer |
| US4829363A (en) * | 1984-04-13 | 1989-05-09 | Fairchild Camera And Instrument Corp. | Structure for inhibiting dopant out-diffusion |
| US4604789A (en) * | 1985-01-31 | 1986-08-12 | Inmos Corporation | Process for fabricating polysilicon resistor in polycide line |
| DE3683679D1 (de) * | 1985-04-26 | 1992-03-12 | Fujitsu Ltd | Verfahren zur herstellung einer kontaktanordnung fuer eine halbleiteranordnung. |
| JPS6289341A (ja) * | 1985-10-15 | 1987-04-23 | Mitsubishi Electric Corp | マスタスライス方式大規模半導体集積回路装置の製造方法 |
| US4701241A (en) * | 1986-10-06 | 1987-10-20 | Rca Corporation | Method of making a resistor |
| ATE87766T1 (de) * | 1986-11-18 | 1993-04-15 | Siemens Ag | Integrierte halbleiterschaltung mit als duennschichtstege auf den die aktiven transistorbereiche trennenden feldoxidbereichen angeordneten lastwiderstaende und verfahren zu ihrer herstellung. |
| JPS63136668A (ja) * | 1986-11-28 | 1988-06-08 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
| US4920388A (en) * | 1987-02-17 | 1990-04-24 | Siliconix Incorporated | Power transistor with integrated gate resistor |
| GB8710359D0 (en) * | 1987-05-01 | 1987-06-03 | Inmos Ltd | Semiconductor element |
| JPH01143252A (ja) * | 1987-11-27 | 1989-06-05 | Nec Corp | 半導体装置 |
| US5336911A (en) * | 1988-05-10 | 1994-08-09 | Seiko Epson Corporation | Semiconductor device |
| US4859278A (en) * | 1988-08-11 | 1989-08-22 | Xerox Corporation | Fabrication of high resistive loads utilizing a single level polycide process |
| US5126279A (en) * | 1988-12-19 | 1992-06-30 | Micron Technology, Inc. | Single polysilicon cross-coupled resistor, six-transistor SRAM cell design technique |
| US5017459A (en) * | 1989-04-26 | 1991-05-21 | Eastman Kodak Company | Lift-off process |
| US5135882A (en) * | 1989-07-31 | 1992-08-04 | Micron Technology, Inc. | Technique for forming high-value inter-nodal coupling resistance for rad-hard applications in a double-poly, salicide process using local interconnect |
| US4948747A (en) * | 1989-12-18 | 1990-08-14 | Motorola, Inc. | Method of making an integrated circuit resistor |
| US5068201A (en) * | 1990-05-31 | 1991-11-26 | Sgs-Thomson Microelectronics, Inc. | Method for forming a high valued resistive load element and low resistance interconnect for integrated circuits |
| USD332204S (en) | 1991-01-31 | 1993-01-05 | The Decor Corporation Pty. Ltd. | Combined container lid and convertible grid |
| JPH088225B2 (ja) * | 1991-12-17 | 1996-01-29 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 改良された半導体用局部的相互接続 |
| US6143613A (en) * | 1997-06-30 | 2000-11-07 | Vlsi Technology, Inc. | Selective exclusion of silicide formation to make polysilicon resistors |
| US6023086A (en) * | 1997-09-02 | 2000-02-08 | Motorola, Inc. | Semiconductor transistor with stabilizing gate electrode |
| US6187617B1 (en) | 1999-07-29 | 2001-02-13 | International Business Machines Corporation | Semiconductor structure having heterogeneous silicide regions and method for forming same |
| US20050130383A1 (en) * | 2003-12-10 | 2005-06-16 | International Business Machines Corporation | Silicide resistor in beol layer of semiconductor device and method |
| US7393701B2 (en) * | 2006-12-05 | 2008-07-01 | International Business Machines Corporation | Method of adjusting buried resistor resistance |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2269199A1 (show.php) * | 1974-04-25 | 1975-11-21 | Rca Corp |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4214917A (en) * | 1978-02-10 | 1980-07-29 | Emm Semi | Process of forming a semiconductor memory cell with continuous polysilicon run circuit elements |
| US4297721A (en) * | 1978-11-03 | 1981-10-27 | Mostek Corporation | Extremely low current load device for integrated circuit |
| US4332839A (en) * | 1978-12-29 | 1982-06-01 | Bell Telephone Laboratories, Incorporated | Method for making integrated semiconductor circuit structure with formation of Ti or Ta silicide |
| US4267558A (en) * | 1979-01-05 | 1981-05-12 | Texas Instruments Incorporated | Electrically erasable memory with self-limiting erase |
| JPS5599722A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Preparation of semiconductor device |
| US4291328A (en) * | 1979-06-15 | 1981-09-22 | Texas Instruments Incorporated | Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon |
| US4362597A (en) * | 1981-01-19 | 1982-12-07 | Bell Telephone Laboratories, Incorporated | Method of fabricating high-conductivity silicide-on-polysilicon structures for MOS devices |
-
1981
- 1981-10-27 FR FR8120165A patent/FR2515427A1/fr active Granted
-
1982
- 1982-09-27 US US06/423,722 patent/US4451328A/en not_active Expired - Lifetime
- 1982-10-12 DE DE8282401873T patent/DE3264575D1/de not_active Expired
- 1982-10-12 EP EP82401873A patent/EP0078190B1/fr not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2269199A1 (show.php) * | 1974-04-25 | 1975-11-21 | Rca Corp |
Non-Patent Citations (1)
| Title |
|---|
| EXBK/80 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0078190B1 (fr) | 1985-07-03 |
| DE3264575D1 (en) | 1985-08-08 |
| EP0078190A1 (fr) | 1983-05-04 |
| US4451328A (en) | 1984-05-29 |
| FR2515427B1 (show.php) | 1983-12-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |