FR2478878A1 - Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique - Google Patents

Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique Download PDF

Info

Publication number
FR2478878A1
FR2478878A1 FR8105146A FR8105146A FR2478878A1 FR 2478878 A1 FR2478878 A1 FR 2478878A1 FR 8105146 A FR8105146 A FR 8105146A FR 8105146 A FR8105146 A FR 8105146A FR 2478878 A1 FR2478878 A1 FR 2478878A1
Authority
FR
France
Prior art keywords
metal support
layer
product according
nickel
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8105146A
Other languages
English (en)
French (fr)
Other versions
FR2478878B3 (enExample
Inventor
Holger Eisentraut
Bernd Neubauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of FR2478878A1 publication Critical patent/FR2478878A1/fr
Application granted granted Critical
Publication of FR2478878B3 publication Critical patent/FR2478878B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Ceramic Products (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FR8105146A 1980-03-15 1981-03-13 Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique Granted FR2478878A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803010076 DE3010076A1 (de) 1980-03-15 1980-03-15 Halbzeug fuer die herstellung von metalldeckeln zum verschliessen von gehaeusen aus keramischem werkstoff

Publications (2)

Publication Number Publication Date
FR2478878A1 true FR2478878A1 (fr) 1981-09-25
FR2478878B3 FR2478878B3 (enExample) 1983-01-21

Family

ID=6097363

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8105146A Granted FR2478878A1 (fr) 1980-03-15 1981-03-13 Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique

Country Status (3)

Country Link
DE (1) DE3010076A1 (enExample)
FR (1) FR2478878A1 (enExample)
GB (1) GB2073082B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
CA1201211A (en) * 1982-08-05 1986-02-25 Olin Corporation Hermetically sealed semiconductor casing
EP0160222B1 (en) * 1984-04-30 1993-01-20 AlliedSignal Inc. Novel nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices
JP3078544B2 (ja) * 1998-09-24 2000-08-21 住友特殊金属株式会社 電子部品用パッケージ、その蓋体用の蓋材およびその蓋材の製造方法
JP6387818B2 (ja) 2014-12-11 2018-09-12 日立金属株式会社 気密封止用蓋材の製造方法

Also Published As

Publication number Publication date
DE3010076A1 (de) 1981-09-24
GB2073082B (en) 1983-11-16
GB2073082A (en) 1981-10-14
FR2478878B3 (enExample) 1983-01-21

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Legal Events

Date Code Title Description
ST Notification of lapse