GB2073082A - Strips for the production of solderable metal covers for housings of ceramic material - Google Patents

Strips for the production of solderable metal covers for housings of ceramic material Download PDF

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Publication number
GB2073082A
GB2073082A GB8106610A GB8106610A GB2073082A GB 2073082 A GB2073082 A GB 2073082A GB 8106610 A GB8106610 A GB 8106610A GB 8106610 A GB8106610 A GB 8106610A GB 2073082 A GB2073082 A GB 2073082A
Authority
GB
United Kingdom
Prior art keywords
metal carrier
article according
solder
semi
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8106610A
Other versions
GB2073082B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of GB2073082A publication Critical patent/GB2073082A/en
Application granted granted Critical
Publication of GB2073082B publication Critical patent/GB2073082B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A strip (Fig. 1) for the production of solderable metal covers (Fig. 5) for sealing housings of ceramic material which contain a semi-conductor or an integrated circuit is less than 0.5 mm thick, and consists of a metal carrier 4 which has a thermal co-efficient of expansion similar to that of the housing material and is provided with a solder layer 1 having spaced recesses 2 or cut-outs arranged at a distance from each other. <IMAGE>

Description

SPECIFICATION Improvements in or relating to semi-finished articles for the production of metal covers for housings of ceramic material The present invention relates to semi-finished articles in strip form for the production of metal covers with a thickness of less than 0.5mm, for housings of ceramic material in which a semi conductor or an integrated circuit is mounted. The semi-finished article has a metal carrier whose thermal expansion co-efficient is adapted to that of the casing material, and a solder layer secured thereto on at least one side.
A semi-finished article of the kind hereinabove referred to is usual in the trade. Metal covers are stamped from it, which are then connected with the ceramic housing by solder and seal this against the outer atmosphere. In such known semi-finished articles it may occur that, on soldering, particles of solder spray off and lead to electric disruptions is closed semi-conductors or integrated circuits. Moreover the danger also exists of evaporation of foreign material from the solder layer which leads to corrosion.
It is an object of the invention to provide a semi-finished article from which metal covers for sealing ceramic housings can be produced which causes substantially no disruptions on connection of the metal cover with the ceramic housing and thus also causes no disturbances in the semi conductor or integrated circuit. Furthermore, the semi-finished article should be cheap to produce and enable mass production.
Accordingly, the invention consists in a semi finished article in strip form for the production of metal covers, having a thickness of less than 0.5mm for sealing ceramic housings in which a semi-conductor or an integrated circuit is mounted, said article comprising a metal carrier whose thermal co-efficient of expansion is adapted to that of the housing material, and a layer of solder connected thereto on at least one side thereof, wherein the layer of solder has spaced recesses or cut-outs which are delimited by a border or frame of solder.
In order that the invention may be more clearly understood, reference will now be made to the accompanying drawings which show certain embodiments thereof by way of example and in which:~ Figures 1 to 4 shows views of different embodiments of semi-finished articles, Figure 5 shows a plan view of a metal cover made from such an article, and Figure 6 shows a dissociated drawing of a ceramic housing which comprises a semi conductor or an incorporated circuit.
Referring now to the drawings, Figure 1 shows a plan view of a semi-finished article comprising a layer 1 of solder arranged on a metal carrier having spaced recesses or cut-outs 2 which are delimited by frames of solder. A notch 3 is made on both sides of the strip-like semi-finished article which facilitates the working of the article in a continuous process. Each notch 3 is advantageously located on the axis of symmetry of the adjacent recess 2 extending transversely to the longitudinal axis of the strip, whereby the locational arrangement of the recess is ensured for each metal cover.
Figures 2,3 and 4 show further embodiments in vertical section through a strip-like semi-finished article according to Figure 1. Reference numeral 4 designates the metal carrier to which the solder layer 1 is secured. It has proved advantageous to provide an intermediate layer 5 between the metal carrier 4 and the solder layer 1 which provides the wettability of the metal carrier with the solder. A copper or copper-based alloy has proved itself as a suitable material for such an intermediate layer, and advantageously has less than 0.1% impurities therein. Nickel or nickel alloy are of advantage as materials for the metal carrier 1. Amongst the nickel alloys, nickel/iron alloys or nickel/iron/cobalt alloys are suitable; in particular the metal carrier may consist of a Ni 42/Fe 58 alloy Ni 29/Fe 54/Co 17 alloy.If the metal carrier is only provided with a solder layer on one face, then the other face is usefully provided with a corrosion protective layer 6 as is shown in Figure 4. Precious metals in particular or even a nickel layer have proved themselves as material for this corrosion protective layer 6. The solder layer may consist of tin-based alloy having less than 0.1% impurities therein such as Sn 80/Ag 20 and Sn 95/Ag 5 for example. The thickness of the articles does not exceed 0.5mm.
Figure 5 shows a metal cover 7 stamped out of a semi-finished article according to the invention.
This cover 7, as seen from the exploded drawing in Figure 6, closes off the opening in a ceramic housing 8, a semi-finished article or integrated circuit 10 being mounted in the opening. The housing 8 is further provided with connecting tags 9 which are electrically conductively connected within the recess by wire connections with semi-conductors or the conductor tracks of the integrated circuit.
The manufacture of a semi-finished article may be carried out by roller plating individual layers of the article together in a continuous process. The recesses 2 are then cut by machining from the solder layer by milling or grinding.
The metal carrier layer 4 has a thermal coefficient of expansion adapted to that of the housing material.

Claims (11)

1. A semi-finished article in strip form for the production of metal covers, having a thickness of less than 0.5mm for sealing ceramic housings in which a semi-conductor or an integrated circuit is mounted, said article comprising a metal carrier whose thermal co-efficient of expansion is adapted to that of the housing material, and a layer of solder connected thereto on at least one side thereof, wherein the layer of solder has spaced recesses or cut-outs which are delimited by a border or frame of solder.
2. An article according to claim 1, wherein an intermediate layer is arranged between the metal carrier and the solder layer so as to increase the wettability of the metal carrier with the solder.
3. An article according to claim 1 or claim 2, wherein the metal carrier is provided on one face only with the solder layer, the other face of the metal carrier being provided with a corrosionresistant layer.
4. An article according to claim 1, 2 or 3, wherein the metal carrier consists of nickel or a nickel alloy.
5. An article according to claim 4, wherein the metal carrier consists of a nickel/iron alloy or a nickel/iron/cobalt alloy.
6. An article according to claim 5, wherein the metal carrier consists of a nickel 42/iron 58 alloy.
7. An article according to claim 5, wherein the metal carrier consists of nickel 29/iron 54/cobalt 17 alloy.
8. An article according to claim 2, wherein the intermediate layer consists of copper or a copper alloy with less than 0.1% of impurities.
9. An article according to any of the preceding claims, wherein the solder layer consists of a tin base alloy with less than 0.1% of impurities:
10. A semi-finished article according to any of the preceding claims, which has a notch on at least one longitudinal side.
11. Semi-finished articles substantially as hereinbefore described with reference to the accompanying drawings.
GB8106610A 1980-03-15 1981-03-03 Strips for the production of solderable metal covers for housings of ceramic material Expired GB2073082B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803010076 DE3010076A1 (en) 1980-03-15 1980-03-15 SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF METAL LIDS FOR CLOSING HOUSINGS FROM CERAMIC MATERIAL

Publications (2)

Publication Number Publication Date
GB2073082A true GB2073082A (en) 1981-10-14
GB2073082B GB2073082B (en) 1983-11-16

Family

ID=6097363

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8106610A Expired GB2073082B (en) 1980-03-15 1981-03-03 Strips for the production of solderable metal covers for housings of ceramic material

Country Status (3)

Country Link
DE (1) DE3010076A1 (en)
FR (1) FR2478878A1 (en)
GB (1) GB2073082B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0100817A2 (en) * 1982-08-05 1984-02-22 Olin Corporation A hermetically sealed casing of an electrical device and process of manufacturing
EP0160222A2 (en) * 1984-04-30 1985-11-06 AlliedSignal Inc. Novel nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
EP0989605A2 (en) * 1998-09-24 2000-03-29 Sumitomo Special Metals Company Limited Package for electronic component, lid material for package lid, and production method for lid material
EP3232568A4 (en) * 2014-12-11 2018-08-08 Hitachi Metals, Ltd. Method for manufacturing hermetic-sealing lid member, hermetic-sealing lid member, and method for manufacturing electronic component storing package

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0100817A2 (en) * 1982-08-05 1984-02-22 Olin Corporation A hermetically sealed casing of an electrical device and process of manufacturing
EP0100817A3 (en) * 1982-08-05 1986-01-22 Olin Corporation Improved hermetically sealed semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
EP0160222A2 (en) * 1984-04-30 1985-11-06 AlliedSignal Inc. Novel nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices
EP0160222A3 (en) * 1984-04-30 1987-06-16 Allied Corporation Novel nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices
EP0989605A2 (en) * 1998-09-24 2000-03-29 Sumitomo Special Metals Company Limited Package for electronic component, lid material for package lid, and production method for lid material
EP0989605A3 (en) * 1998-09-24 2001-08-22 Sumitomo Special Metals Company Limited Package for electronic component, lid material for package lid, and production method for lid material
US6974635B1 (en) 1998-09-24 2005-12-13 Neomax Materials Co., Ltd. Package for electronic component, lid material for package lid, and production method for lid material
EP3232568A4 (en) * 2014-12-11 2018-08-08 Hitachi Metals, Ltd. Method for manufacturing hermetic-sealing lid member, hermetic-sealing lid member, and method for manufacturing electronic component storing package
US10461001B2 (en) 2014-12-11 2019-10-29 Hitachi Metals, Ltd. Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package

Also Published As

Publication number Publication date
FR2478878B3 (en) 1983-01-21
DE3010076A1 (en) 1981-09-24
GB2073082B (en) 1983-11-16
FR2478878A1 (en) 1981-09-25

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Legal Events

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PCNP Patent ceased through non-payment of renewal fee