FR2478878A1 - SEMI-FINISHED PRODUCT FOR THE MANUFACTURE OF METAL COVERS FOR CLOSING CERAMIC MATERIAL HOUSINGS - Google Patents
SEMI-FINISHED PRODUCT FOR THE MANUFACTURE OF METAL COVERS FOR CLOSING CERAMIC MATERIAL HOUSINGS Download PDFInfo
- Publication number
- FR2478878A1 FR2478878A1 FR8105146A FR8105146A FR2478878A1 FR 2478878 A1 FR2478878 A1 FR 2478878A1 FR 8105146 A FR8105146 A FR 8105146A FR 8105146 A FR8105146 A FR 8105146A FR 2478878 A1 FR2478878 A1 FR 2478878A1
- Authority
- FR
- France
- Prior art keywords
- metal support
- layer
- product according
- nickel
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4817—Conductive parts for containers, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PRODUIT EN BANDE COMPORTANT UN SUPPORT METALLIQUE ET UNE COUCHE A BRASER. LE COUVERCLE 7 COMPORTE UNE COUCHE A BRASER 1, UNE OUVERTURE 2, UN SUPPORT METALLIQUE 4, UNE COUCHE INTERMEDIAIRE 5 ET UNE COUCHE ANTICORROSION 6.BAND PRODUCT WITH A METAL SUPPORT AND A BRAZING LAYER. THE COVER 7 INCLUDES A BRAZING LAYER 1, AN OPENING 2, A METAL SUPPORT 4, AN INTERMEDIATE LAYER 5 AND AN ANTI-CORROSION LAYER 6.
Description
La Drésente invention concerne un produit semi-fini en forme de bande enThe present invention relates to a semi-finished product in the form of a strip
Mrue de la fabrication de couvercles métalliques d'une épaisseur de moins de 0O5 wr pour fermer des bottiers en materiau ceramique dans lesquels est disposé un mi-conducteur ou un circuit intégré. Le produit semi-fini comporte un support métal- lique dont le coefficient de dilatation thermique est adapté à celui du matériau du boîtier, et il présente au moins sur un côté As for the manufacture of metal covers with a thickness of less than 0.05 wt to close ceramic material housings in which a semiconductor or an integrated circuit is arranged. The semi-finished product comprises a metal support whose thermal expansion coefficient is adapted to that of the housing material, and it has at least one side
une couche à braser qui est fixée sur lui. a brazing layer that is attached to it.
Un produit fini du type décrit ci-dessus est courant dans le commerce. il sert au découpage de couvercles métalliques qui sont ensuite reliés par brasure au boîtier céramique, ce qui ferme celui-ci par rapport à l'atmosphère extérieure. Dans ce produit connu. il peut: se produire des projections de particules de la couche au momment de la soudure, ce qui mène à des perturbations A finished product of the type described above is commercially available. it serves to cut metal covers which are then soldered to the ceramic housing, which closes the latter with respect to the external atmosphere. In this known product. it can: occur projections of particles from the layer to the moment of the weld, which leads to disturbances
électriques dans le semi-conducteur ou le circuit intégré enfermé. in the semiconductor or the enclosed integrated circuit.
En outre, il existe le risque de vaporisation de matières étrangères In addition, there is the risk of spraying foreign matter
provenant de la couche, ce qui mène à des corrosions. from the layer, which leads to corrosions.
Le but de l'invention est de réaliser un produit semi-fini à partir duquel on puisse réaliser des couvercles métale The object of the invention is to produce a semi-finished product from which metal lids can be made.
liques pour fermer des boîtiers céramiques sans amener de pertur- to close ceramic housings without causing disturbances
bations quelconques au cours de la liaison entre le couvercle et le bottier, ni en provoquer sur le semi-conducteur ou le circuit intégré. En outre, la produit semi-fini doit être fabriqué de façon bations during the connection between the cover and the casing, nor provoke on the semiconductor or the integrated circuit. In addition, the semi-finished product must be manufactured in such a way
économique et permettre une fabrication en série. economical and allow mass production.
Le moyen d'atteindre ce but selon l'invention, pour The means of achieving this object according to the invention, for
un produit semi-fini du type indiqué au début, consiste selon l'in- a semi-finished product of the type indicated at the beginning, consists
vention en ce que la couche à braser comporte des ouvertures plates seuparées qui sont délimitées par un cadre de brasureo La dimension de!ouverture dans la couche à braser correspond à peu près à l'ouverture du boîtier à fermer.o D'autres caractéristiques et avantages de l'invention In that the solder layer has flat, single apertures which are delimited by a brazing frame. The size of the opening in the solder layer corresponds approximately to the opening of the casing to be closed. advantages of the invention
seront mieux compris à la lecture de la description qui va suivre will be better understood by reading the following description
d'un exenmpl de réalisation et en se reportant aux dessins annexes sur lesquels: 325 - les figures 1 à 4 représentent des exemples de realiúation du produit semi-fini de l'invention; - la figure 5 représente un couvercle métallique réalisé à partir du produit semi-fini; et - la figure 6 représente en vue éclatée un boîtier en céramique fermé par un couvercle selon l'invention et contenant un semi-conducteur ou un circuit intégré. an embodiment exenmpl and with reference to the accompanying drawings in which: - Figures 1 to 4 show examples of realiúation of the semi-finished product of the invention; - Figure 5 shows a metal cover made from the semi-finished product; and FIG. 6 is an exploded view of a ceramic case closed by a cover according to the invention and containing a semiconductor or an integrated circuit.
La vue du produit semi-fini selon l'invention, repré- The view of the semi-finished product according to the invention,
senté sur la figure 1, représente la couche à braser 1 qui est dis- Figure 1 shows the solder layer 1 which is
posée sur un support métallique et qui présente des ouvertures plates séparées 2 délimitées par de la brasure à la façon d'un cadre. Des placed on a metal support and which has separate flat openings 2 delimited by solder in the manner of a frame. of the
deux cotés du produit en forme de bande, on a réalisé une perfora- two sides of the strip-shaped product, a perforation
tion 3 qui facilite le traitement du produit, notamment la fabrica- tion 3 which facilitates the processing of the product,
tion d'un couvercle séparé à partir du produit semi-fini, selon un procédé continu. Cette perforation 3 est réalisée de préférence sur l'axe de symétrie de l'ouverture, axe qui est perpendiculaire à la longueur de la bande, ce qui assure le positionnement correct de a separate lid from the semi-finished product in a continuous process. This perforation 3 is preferably made on the axis of symmetry of the opening, which axis is perpendicular to the length of the strip, which ensures the correct positioning of
l'ouverture pour chaque couvercle.the opening for each lid.
Les figures 2, 3 et 4 représentent d'autres exemples de réalisation en coupe verticale au travers d'un produit en forme de bande selon la figure 1. Le repère 4 désigne le support métallique auquel la couche 1 est fixée. On a trouvé avantageux de prévoir entre le support métallique 4 et la couche 1 une couche intermédiaire 5 qui entraIne la mouillabilité du support métallique. Comme matériau pour une telle couche intermédiaire, on a trouvé de préférence un alliage de cuivre ou à base de cuivre. Comme matériau pour le support métallique, le nickel ou ses alliages sont avantageux. Comme alliage de nickel, il s'agit de préférence d'alliage nickel-fer ou d'alliage nickel-fer-cobalt; en particulier, le support métallique se compose d'un alliage 42 Ni-58 Fe, ou d'un alliage 29 Ni-54 Fe-17 Co. Quand le support métallique est muni d'un côté seulement d'une couche à braser, le côté opposé à la couche à braser est muni de préférence d'une couche anticorrosion 6, comme le montre la figure 4. Comme matérinu pour la couche 6, on a sélectionné notamment des mêtaux nobles ou Figures 2, 3 and 4 show other examples of embodiment in vertical section through a strip-shaped product according to Figure 1. The reference 4 designates the metal support to which the layer 1 is fixed. It has been found advantageous to provide between the metal support 4 and the layer 1 an intermediate layer 5 which causes the wettability of the metal support. As a material for such an interlayer, a copper or copper alloy is preferably found. As a material for the metal support, nickel or its alloys are advantageous. As a nickel alloy, it is preferably nickel-iron alloy or nickel-iron-cobalt alloy; in particular, the metal support consists of an alloy Ni-58 Fe, or a alloy Ni-54 Fe-17 Co. When the metal support is provided with only one side of a layer to be soldered, the opposite side of the layer to be brazed is preferably provided with an anticorrosion layer 6, as shown in FIG. 4. As a material for the layer 6, particular noble metals or
une couche de nickel. Comme alliage à braser, on a choisi de préfé- a layer of nickel. As a solder alloy, it has been preferable to
rence des alliages 80 Sn-20 Ag et 95 Sn-5 Ag. 80 Sn-20 Ag and 95 Sn-5 Ag alloys.
La figure 5 représente un couvercle métallique 7 découpé à partir d'un produit semi-fini selon l'invention. Comme le montre la vue de la figure 6, ce couvercle 7 ferme l'ouverture d'un bottier 8 en céramique dans l'ouverture duquel on a disposé un semi-conducteur ou un circuit intégré 10. Le boîtier est muni en outre de pattes de Figure 5 shows a metal cover 7 cut from a semi-finished product according to the invention. As shown in the view of FIG. 6, this cover 7 closes the opening of a ceramic casing 8 in the opening of which a semiconductor or an integrated circuit 10 has been arranged. The casing is further provided with tabs of
raccordement 9 qui sont reliées électriquement par des fils de liai- 9 which are electrically connected by wires of connection
son au semi-conducteur ou auxpistes conductrices du circuit imprimé. La fabrication du semi-produit de l'invention est réalisé de façon que les différentes couches du produit semi-fini soient reliées ensemble par laminage selon un procédé continu. Les semiconductor sound or conductive traces of the printed circuit. The production of the semi-finished product of the invention is carried out so that the different layers of the semi-finished product are connected together by rolling in a continuous process. The
évidements sont ensuite réalisés dans la couche à braser par enlève- recesses are then made in the solder layer by removing
ment de copeaux, par exemple par fraisage ou meulage. chips, for example by milling or grinding.
Bien entendu diverses modifications peuvent être Of course various modifications can be
apportées par l'homme de l'art aux dispositifs ou procédés qui vien- provided by those skilled in the art to the devices or processes which come
nent d'être décrits uniquement à titre d'exemples non limitatifs to be described solely as non-limitative examples
sans sortir du cadre de l'invention. without departing from the scope of the invention.
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803010076 DE3010076A1 (en) | 1980-03-15 | 1980-03-15 | SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF METAL LIDS FOR CLOSING HOUSINGS FROM CERAMIC MATERIAL |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2478878A1 true FR2478878A1 (en) | 1981-09-25 |
FR2478878B3 FR2478878B3 (en) | 1983-01-21 |
Family
ID=6097363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8105146A Granted FR2478878A1 (en) | 1980-03-15 | 1981-03-13 | SEMI-FINISHED PRODUCT FOR THE MANUFACTURE OF METAL COVERS FOR CLOSING CERAMIC MATERIAL HOUSINGS |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE3010076A1 (en) |
FR (1) | FR2478878A1 (en) |
GB (1) | GB2073082B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1201211A (en) * | 1982-08-05 | 1986-02-25 | Olin Corporation | Hermetically sealed semiconductor casing |
US4656499A (en) * | 1982-08-05 | 1987-04-07 | Olin Corporation | Hermetically sealed semiconductor casing |
DE3587003T2 (en) * | 1984-04-30 | 1993-06-17 | Allied Signal Inc | NICKEL / INDIUM ALLOY FOR THE PRODUCTION OF A HERMETICALLY SEALED HOUSING FOR SEMICONDUCTOR ARRANGEMENTS AND OTHER ELECTRONIC ARRANGEMENTS. |
JP3078544B2 (en) * | 1998-09-24 | 2000-08-21 | 住友特殊金属株式会社 | Electronic component package, lid material for the lid, and method for manufacturing the lid material |
JP6387818B2 (en) | 2014-12-11 | 2018-09-12 | 日立金属株式会社 | Method of manufacturing hermetic sealing lid |
-
1980
- 1980-03-15 DE DE19803010076 patent/DE3010076A1/en not_active Ceased
-
1981
- 1981-03-03 GB GB8106610A patent/GB2073082B/en not_active Expired
- 1981-03-13 FR FR8105146A patent/FR2478878A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2478878B3 (en) | 1983-01-21 |
GB2073082A (en) | 1981-10-14 |
GB2073082B (en) | 1983-11-16 |
DE3010076A1 (en) | 1981-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |