GB2073082B - Strips for the production of solderable metal covers for housings of ceramic material - Google Patents

Strips for the production of solderable metal covers for housings of ceramic material

Info

Publication number
GB2073082B
GB2073082B GB8106610A GB8106610A GB2073082B GB 2073082 B GB2073082 B GB 2073082B GB 8106610 A GB8106610 A GB 8106610A GB 8106610 A GB8106610 A GB 8106610A GB 2073082 B GB2073082 B GB 2073082B
Authority
GB
United Kingdom
Prior art keywords
housings
strips
production
ceramic material
metal covers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8106610A
Other versions
GB2073082A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of GB2073082A publication Critical patent/GB2073082A/en
Application granted granted Critical
Publication of GB2073082B publication Critical patent/GB2073082B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB8106610A 1980-03-15 1981-03-03 Strips for the production of solderable metal covers for housings of ceramic material Expired GB2073082B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803010076 DE3010076A1 (en) 1980-03-15 1980-03-15 SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF METAL LIDS FOR CLOSING HOUSINGS FROM CERAMIC MATERIAL

Publications (2)

Publication Number Publication Date
GB2073082A GB2073082A (en) 1981-10-14
GB2073082B true GB2073082B (en) 1983-11-16

Family

ID=6097363

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8106610A Expired GB2073082B (en) 1980-03-15 1981-03-03 Strips for the production of solderable metal covers for housings of ceramic material

Country Status (3)

Country Link
DE (1) DE3010076A1 (en)
FR (1) FR2478878A1 (en)
GB (1) GB2073082B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1201211A (en) * 1982-08-05 1986-02-25 Olin Corporation Hermetically sealed semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
DE3587003T2 (en) * 1984-04-30 1993-06-17 Allied Signal Inc NICKEL / INDIUM ALLOY FOR THE PRODUCTION OF A HERMETICALLY SEALED HOUSING FOR SEMICONDUCTOR ARRANGEMENTS AND OTHER ELECTRONIC ARRANGEMENTS.
JP3078544B2 (en) * 1998-09-24 2000-08-21 住友特殊金属株式会社 Electronic component package, lid material for the lid, and method for manufacturing the lid material
JP6387818B2 (en) 2014-12-11 2018-09-12 日立金属株式会社 Method of manufacturing hermetic sealing lid

Also Published As

Publication number Publication date
FR2478878B3 (en) 1983-01-21
FR2478878A1 (en) 1981-09-25
GB2073082A (en) 1981-10-14
DE3010076A1 (en) 1981-09-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee