FR2478420A1 - Procede de fabrication de cartes a circuit imprime - Google Patents
Procede de fabrication de cartes a circuit imprime Download PDFInfo
- Publication number
- FR2478420A1 FR2478420A1 FR8025255A FR8025255A FR2478420A1 FR 2478420 A1 FR2478420 A1 FR 2478420A1 FR 8025255 A FR8025255 A FR 8025255A FR 8025255 A FR8025255 A FR 8025255A FR 2478420 A1 FR2478420 A1 FR 2478420A1
- Authority
- FR
- France
- Prior art keywords
- film
- substrate
- photosensitive film
- holes
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 5
- 239000000057 synthetic resin Substances 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims description 13
- 238000010586 diagram Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 3
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 206010037660 Pyrexia Diseases 0.000 claims 1
- 230000008030 elimination Effects 0.000 claims 1
- 238000003379 elimination reaction Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 239000000047 product Substances 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 238000007639 printing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241001465805 Nymphalidae Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 206010037742 Rabies Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combination Of More Than One Step In Electrophotography (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3307080A JPS56129394A (en) | 1980-03-14 | 1980-03-14 | Method of producing through hole of printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2478420A1 true FR2478420A1 (fr) | 1981-09-18 |
| FR2478420B1 FR2478420B1 (enExample) | 1984-12-28 |
Family
ID=12376456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8025255A Granted FR2478420A1 (fr) | 1980-03-14 | 1980-11-28 | Procede de fabrication de cartes a circuit imprime |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4327167A (enExample) |
| JP (1) | JPS56129394A (enExample) |
| DE (1) | DE3108080A1 (enExample) |
| FR (1) | FR2478420A1 (enExample) |
| GB (1) | GB2072429B (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4786576A (en) * | 1984-09-27 | 1988-11-22 | Olin Hunt Specialty Products, Inc. | Method of high resolution of electrostatic transfer of a high density image to a nonporous and nonabsorbent conductive substrate |
| JPS61206293A (ja) * | 1985-03-08 | 1986-09-12 | 日本ペイント株式会社 | 回路板の製造方法 |
| IT1184408B (it) * | 1985-04-09 | 1987-10-28 | Telettra Lab Telefon | Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi |
| US5254435A (en) * | 1985-06-10 | 1993-10-19 | The Foxboro Company | Method of patterning resist |
| US4666818A (en) * | 1985-06-10 | 1987-05-19 | The Foxboro Company | Method of patterning resist for printed wiring board |
| DE3610114A1 (de) * | 1986-03-26 | 1987-02-12 | Manfred Dipl Ing Schoeffel | Schaltungstraegerplatte fuer laborzweck und verfahren zu ihrer herstellung |
| FR2618631A1 (fr) * | 1987-07-24 | 1989-01-27 | Thomson Csf | Procede de realisation de liaisons electriques entre faces de plaques a circuits imprimes resistant aux contraintes thermiques, en particulier de circuits triplaques |
| DE3885457D1 (de) * | 1988-08-25 | 1993-12-09 | Siemens Nixdorf Inf Syst | Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Löträndern um die Durchkontaktierungslöcher. |
| US5260168A (en) * | 1989-10-13 | 1993-11-09 | The Foxboro Company | Application specific tape automated bonding |
| US5066360A (en) * | 1990-09-24 | 1991-11-19 | International Business Machines Corp. | Pad printing of resist over via holes |
| GB2252844A (en) * | 1991-02-14 | 1992-08-19 | S B Services | Pneumatic circuit track board |
| US5494764A (en) * | 1992-03-26 | 1996-02-27 | Mitsubishi Paper Mills Limited | Method for making printed circuit boards |
| DE4239328C2 (de) * | 1992-11-23 | 1994-09-08 | Siemens Nixdorf Inf Syst | Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Lötaugen |
| US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
| WO1999052335A1 (fr) * | 1998-04-06 | 1999-10-14 | Mitsubishi Paper Mills Limited | Procede et appareil de fabrication de cartes imprimees |
| US6243551B1 (en) | 1999-01-07 | 2001-06-05 | Elfotek Ltd. | Electrophotographic copying method and apparatus |
| US6440625B1 (en) | 1999-01-31 | 2002-08-27 | Elfotek Ltd. | Method of electrostatic recording on a cylindrical photoreceptor with dielectric coating and an electrophotographic duplicating apparatus |
| DE10018634A1 (de) | 1999-04-15 | 2000-12-07 | Mitsubishi Paper Mills Ltd | Verfahren zur Flüssigkeitsentwicklung einer gedruckten Schaltung |
| DE10104726A1 (de) * | 2001-02-02 | 2002-08-08 | Siemens Solar Gmbh | Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht |
| JP2003078220A (ja) * | 2001-06-18 | 2003-03-14 | Canon Inc | 樹脂成形基板 |
| DE10147890B4 (de) * | 2001-09-28 | 2006-09-28 | Infineon Technologies Ag | Verfahren zur Herstellung eines Substrats aus Keramikmaterial mit einer strukturierten Metallschicht und derartiges Substrat |
| JP4488784B2 (ja) * | 2004-04-13 | 2010-06-23 | 株式会社東芝 | 電子回路の製造方法および電子回路 |
| CN101534608B (zh) * | 2008-03-12 | 2011-01-26 | 比亚迪股份有限公司 | 一种柔性线路板的制作方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2947625A (en) * | 1955-12-21 | 1960-08-02 | Ibm | Method of manufacturing printed circuits |
| US3061911A (en) * | 1958-01-31 | 1962-11-06 | Xerox Corp | Method of making printed circuits |
| FR1559157A (enExample) * | 1967-02-16 | 1969-03-07 | ||
| DE2247977A1 (de) * | 1972-09-29 | 1974-04-11 | Siemens Ag | Verfahren zur herstellung doppelseitiger durchkontaktierter gedruckter schaltungsplatten |
| US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1249966B (de) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten | |
| US3231374A (en) * | 1960-09-02 | 1966-01-25 | Rca Corp | Methods for preparing etch resists using an electrostatic image developer composition |
| JPS5258873A (en) * | 1975-11-11 | 1977-05-14 | Seiko Instr & Electronics | Method of producing printed substrate |
| US4145460A (en) * | 1977-06-27 | 1979-03-20 | Western Electric Company, Inc. | Method of fabricating a printed circuit board with etched through holes |
| US4104111A (en) * | 1977-08-03 | 1978-08-01 | Mack Robert L | Process for manufacturing printed circuit boards |
| JPS555874A (en) * | 1978-06-29 | 1980-01-17 | Sharp Corp | Ink collecting device in jet printer |
-
1980
- 1980-03-14 JP JP3307080A patent/JPS56129394A/ja active Granted
- 1980-11-13 GB GB8036423A patent/GB2072429B/en not_active Expired
- 1980-11-14 US US06/207,199 patent/US4327167A/en not_active Expired - Lifetime
- 1980-11-28 FR FR8025255A patent/FR2478420A1/fr active Granted
-
1981
- 1981-03-04 DE DE19813108080 patent/DE3108080A1/de active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2947625A (en) * | 1955-12-21 | 1960-08-02 | Ibm | Method of manufacturing printed circuits |
| US3061911A (en) * | 1958-01-31 | 1962-11-06 | Xerox Corp | Method of making printed circuits |
| FR1559157A (enExample) * | 1967-02-16 | 1969-03-07 | ||
| DE2247977A1 (de) * | 1972-09-29 | 1974-04-11 | Siemens Ag | Verfahren zur herstellung doppelseitiger durchkontaktierter gedruckter schaltungsplatten |
| US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2072429A (en) | 1981-09-30 |
| US4327167A (en) | 1982-04-27 |
| DE3108080A1 (de) | 1982-02-18 |
| JPS56129394A (en) | 1981-10-09 |
| JPH0135518B2 (enExample) | 1989-07-25 |
| FR2478420B1 (enExample) | 1984-12-28 |
| GB2072429B (en) | 1983-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |