FR2395674A1 - Procede de production de dispositifs conducteurs de l'electricite et soudables - Google Patents
Procede de production de dispositifs conducteurs de l'electricite et soudablesInfo
- Publication number
- FR2395674A1 FR2395674A1 FR7818916A FR7818916A FR2395674A1 FR 2395674 A1 FR2395674 A1 FR 2395674A1 FR 7818916 A FR7818916 A FR 7818916A FR 7818916 A FR7818916 A FR 7818916A FR 2395674 A1 FR2395674 A1 FR 2395674A1
- Authority
- FR
- France
- Prior art keywords
- weldable
- production
- devices
- electrical conducting
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12069—Plural nonparticulate metal components
- Y10T428/12076—Next to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12104—Particles discontinuous
- Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/24413—Metal or metal compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Conductive Materials (AREA)
Abstract
L'invention concerne un procédé de production de dispositifs conducteurs de l'électricité et soudables. Sur un conducteur non métallique, on applique selon un modèle et l'on fait durcir une pate formee d'un polymère organique contenant de petites particules métalliques produisant la conductibilité électrique, ainsi que des sels métalliques qu'un agent à effet de flottation maintient en surface et qui sont solubles dans des bains de métallisation, galvaniques ou auto-catalytiques. On obtient, au moins dans les zones destinées aux soudures, un ancrage de la couche de métal aux particules conductrices. Application : production de circuits imprimés soudables.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2728465A DE2728465C2 (de) | 1977-06-24 | 1977-06-24 | Gedruckte Schaltung |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2395674A1 true FR2395674A1 (fr) | 1979-01-19 |
FR2395674B3 FR2395674B3 (fr) | 1981-02-06 |
Family
ID=6012250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7818916A Granted FR2395674A1 (fr) | 1977-06-24 | 1978-06-23 | Procede de production de dispositifs conducteurs de l'electricite et soudables |
Country Status (7)
Country | Link |
---|---|
US (2) | US4248921A (fr) |
JP (1) | JPS5418072A (fr) |
AT (1) | AT374329B (fr) |
BR (1) | BR7804013A (fr) |
DE (1) | DE2728465C2 (fr) |
FR (1) | FR2395674A1 (fr) |
GB (1) | GB2000197B (fr) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4409261A (en) * | 1980-02-07 | 1983-10-11 | Cts Corporation | Process for air firing oxidizable conductors |
DE3028496C2 (de) * | 1980-07-26 | 1986-04-24 | Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt | Haftvermittler für ein Trägermaterial |
JPS5731193A (en) * | 1980-07-31 | 1982-02-19 | Matsushita Electric Works Ltd | Method of producing printed circuit board |
US4495251A (en) * | 1981-03-11 | 1985-01-22 | General Electric Company | Shielded plastic microwave oven cavity |
JPS59500034A (ja) * | 1982-01-04 | 1984-01-05 | ゼネラル・エレクトリック・カンパニイ | 電気めっきされた増量置換処理導体およびその形成方法 |
US4499157A (en) * | 1983-05-31 | 1985-02-12 | Hughes Aircraft Company | Solderable plated plastic components and processes for manufacture and soldering |
US4495253A (en) * | 1983-05-31 | 1985-01-22 | Hughes Aircraft Company | Solderable plated plastic components and process for plating _ |
US4591088A (en) * | 1983-05-31 | 1986-05-27 | Hughes Aircraft Company | Solder reflow process for soldering shaped articles together |
DE3443789A1 (de) * | 1983-12-02 | 1985-06-27 | Osaka Soda Co. Ltd., Osaka | Elektrische leitende klebstoffmasse |
US4581301A (en) * | 1984-04-10 | 1986-04-08 | Michaelson Henry W | Additive adhesive based process for the manufacture of printed circuit boards |
EP0171482B1 (fr) * | 1984-08-17 | 1988-05-18 | Werner Bandi | Procédé pour appliquer un revêtement sur un substrat |
US4680141A (en) * | 1984-11-29 | 1987-07-14 | Mcdonnell Douglas Corporation | Solder composition |
JPS61159793A (ja) * | 1984-12-31 | 1986-07-19 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
DE3515985A1 (de) * | 1985-05-03 | 1986-11-06 | Wilhelm Ruf KG, 8000 München | Verfahren zur herstellung einer loetbaren beschichtung auf einem substrat und leiterbahnplatte bzw. loetbare kontaktflaeche |
US4680138A (en) * | 1985-10-22 | 1987-07-14 | Sayles Sr Delbert E | Silver sensing material for use on film |
US4673532A (en) * | 1986-01-22 | 1987-06-16 | Mcdonnell Douglas Corporation | Rosin-free solder composition |
US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
JPH0714105B2 (ja) * | 1986-05-19 | 1995-02-15 | 日本電装株式会社 | 混成集積回路基板及びその製造方法 |
US4795508A (en) * | 1987-02-05 | 1989-01-03 | Shell Internationale Research Maatschappij B.V. | Soldering compositions |
JPH01214100A (ja) * | 1988-02-21 | 1989-08-28 | Asahi Chem Res Lab Ltd | 電磁波シールド回路及びその製造方法 |
US4980225A (en) * | 1988-07-12 | 1990-12-25 | Sayles & Scheel Enterprises, Incorporated | Conductive composition and method of use |
US5106884A (en) * | 1988-10-28 | 1992-04-21 | The Dow Chemical Company | Flexible polyurea foams having controlled load bearing qualities |
GB8901114D0 (en) * | 1989-01-19 | 1989-03-15 | Cookson Group Plc | Preparing articles for soldering |
US5200264A (en) * | 1989-09-05 | 1993-04-06 | Advanced Products, Inc. | Thermoset polymer thick film compositions and their use as electrical circuitry |
US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
FR2659649B1 (fr) * | 1990-03-16 | 1992-06-12 | Kodak Pathe | Preparation d'alkoxydes d'indium solubles dans les solvants organiques. |
JP3118103B2 (ja) * | 1992-12-21 | 2000-12-18 | 矢崎総業株式会社 | 電気回路用導電部材、電気回路体及びその製造方法 |
US5419954A (en) * | 1993-02-04 | 1995-05-30 | The Alpha Corporation | Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof |
JPH08148787A (ja) * | 1994-11-21 | 1996-06-07 | Sumitomo Kinzoku Ceramics:Kk | 厚膜ペースト |
JPH0912385A (ja) * | 1995-04-28 | 1997-01-14 | Mitsuboshi Belting Ltd | メッキ用表面処理剤およびこれを付着した基材 |
AU5561696A (en) * | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
EP0809423A1 (fr) * | 1996-05-23 | 1997-11-26 | Mitsumi Electric Company Ltd. | Panneau flexible |
US6592943B2 (en) | 1998-12-01 | 2003-07-15 | Fujitsu Limited | Stencil and method for depositing solder |
US6054761A (en) * | 1998-12-01 | 2000-04-25 | Fujitsu Limited | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
WO2000033625A1 (fr) | 1998-12-03 | 2000-06-08 | Rt Microwave Limited | Technique de depot de couche conductrice sur un substrat |
US6291025B1 (en) * | 1999-06-04 | 2001-09-18 | Argonide Corporation | Electroless coatings formed from organic liquids |
KR100369118B1 (ko) * | 2000-05-13 | 2003-01-24 | 한국과학기술연구원 | 스크린 프린팅에 의한 고밀도 세라믹 후막 제조방법 |
WO2002080637A1 (fr) | 2001-04-02 | 2002-10-10 | Nashua Corporation | Elements de circuit possedant une trace conductrice enfouie et procedes de fabrication associes |
JP4595237B2 (ja) * | 2001-04-27 | 2010-12-08 | 日立金属株式会社 | 銅めっき液および銅めっき方法 |
GB0117431D0 (en) * | 2001-07-17 | 2001-09-12 | Univ Brunel | Method for printing conducting layer onto substrate |
TW588101B (en) * | 2001-12-27 | 2004-05-21 | Fujikura Ltd | Electro-conductive composition, electro-conductive coating and method for producing the coating |
EP1383364A3 (fr) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Eléments de circuit ayant un revêtement récepteur d'encre et une trace conductrice et leur procédé de fabrication |
CN100512599C (zh) * | 2002-06-04 | 2009-07-08 | 住友电气工业株式会社 | 印刷布线用基板及印刷布线板 |
DE10258824B3 (de) * | 2002-12-06 | 2004-05-06 | Hjb Rolling Mill Technology Gmbh | Verfahren zum Herstellen eines Bandes mit einem in dessen Querschnitt verlaufenden Stufenprofil |
TWI265762B (en) * | 2003-01-14 | 2006-11-01 | Sharp Kk | Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof |
US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
US7071121B2 (en) * | 2003-10-28 | 2006-07-04 | Hewlett-Packard Development Company, L.P. | Patterned ceramic films and method for producing the same |
EP2291471A1 (fr) * | 2008-06-12 | 2011-03-09 | NanoMas Technologies, Inc. | Encres et pâtes conductrices |
KR101625421B1 (ko) * | 2008-12-26 | 2016-05-30 | 후지필름 가부시키가이샤 | 표면 금속막 재료, 표면 금속막 재료의 제작 방법, 금속 패턴 재료의 제작 방법, 및 금속 패턴 재료 |
US8828555B2 (en) | 2010-01-28 | 2014-09-09 | Japan Science And Technology Agency | Method for forming patterned conductive film |
WO2015006421A1 (fr) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Article polymère sous encapsulation métallique |
US11267576B2 (en) | 2013-07-09 | 2022-03-08 | Raytheon Technologies Corporation | Plated polymer nosecone |
WO2015006397A1 (fr) * | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Produits industriels formés à partir de polymères plaqués |
WO2015006433A2 (fr) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Ventilateur en polymère plaqué |
US10927843B2 (en) | 2013-07-09 | 2021-02-23 | Raytheon Technologies Corporation | Plated polymer compressor |
US9398703B2 (en) | 2014-05-19 | 2016-07-19 | Sierra Circuits, Inc. | Via in a printed circuit board |
WO2016208006A1 (fr) * | 2015-06-24 | 2016-12-29 | 株式会社メイコー | Procédé de production de carte de câblage tridimensionnelle, carte de câblage tridimensionnelle et substrat de carte de câblage tridimensionnelle |
WO2017029973A1 (fr) | 2015-08-17 | 2017-02-23 | 住友電気工業株式会社 | Carte de circuit imprimé, et composant électronique |
JP6696988B2 (ja) * | 2015-08-17 | 2020-05-20 | 住友電気工業株式会社 | プリント配線板及び電子部品 |
US20170113297A1 (en) * | 2015-10-27 | 2017-04-27 | Hutchinson Technology Incorporated | Metallizing polymers, ceramics and composites for attachment structures |
TWI538581B (zh) * | 2015-11-20 | 2016-06-11 | 財團法人工業技術研究院 | 金屬導體結構及線路結構 |
US10925663B2 (en) | 2016-06-27 | 2021-02-23 | Mound Laser & Photonics Center, Inc. | Metallized components and surgical instruments |
CA3032252A1 (fr) | 2016-07-28 | 2018-02-01 | National Research Council Of Canada | Encre de cuivre et traces de cuivre conductrices pouvant etre soudees produites a partir de cette derniere |
US10849233B2 (en) | 2017-07-10 | 2020-11-24 | Catlam, Llc | Process for forming traces on a catalytic laminate |
TW201842088A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 可印刷分子油墨 |
TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
CA3052747A1 (fr) | 2017-02-08 | 2018-08-16 | National Research Council Of Canada | Encre moleculaire d'argent a faible viscosite et basse temperature de traitement |
US10349520B2 (en) | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
US10765012B2 (en) | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
TW201920515A (zh) | 2017-08-01 | 2019-06-01 | 加拿大國家研究委員會 | 銅墨水 |
EP3468312B1 (fr) * | 2017-10-06 | 2023-11-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Procédé de fabrication d'un support de composants avec une structure de câblage imprimée en trois dimensions |
US10827624B2 (en) | 2018-03-05 | 2020-11-03 | Catlam, Llc | Catalytic laminate with conductive traces formed during lamination |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2748701A (en) * | 1951-08-28 | 1956-06-05 | Wendell P Barrows | Electrically conductive coating |
US3031344A (en) * | 1957-08-08 | 1962-04-24 | Radio Ind Inc | Production of electrical printed circuits |
US3014818A (en) * | 1957-12-09 | 1961-12-26 | Du Pont | Electrically conducting articles and process of making same |
US3245833A (en) * | 1964-04-20 | 1966-04-12 | Eastman Kodak Co | Electrically conductive coatings |
US3488166A (en) * | 1967-01-13 | 1970-01-06 | Ibm | Method for activating plastics,subsequent metallization and article of manufacture resulting therefrom |
DE1615961A1 (de) * | 1967-04-12 | 1970-06-25 | Degussa | Verfahren zur Herstellung von gedruckten Schaltungen |
GB1199471A (en) * | 1967-05-02 | 1970-07-22 | Ingram & Glass Ltd | Improvements relating to Laminated Sheet Material. |
FR1548401A (fr) * | 1967-08-16 | 1968-12-06 | ||
GB1164591A (en) * | 1968-01-03 | 1969-09-17 | Photocircuits Corp | mprovements in Metallization of Insulating Substrates |
DE1771661A1 (de) * | 1968-06-22 | 1972-02-10 | Basf Ag | Verfahren zur Metallisierung von Kunststoffschaumkoerpern |
US3640853A (en) * | 1968-12-27 | 1972-02-08 | Rca Corp | Adhesion of nonconducting and conducting materials |
GB1403198A (en) * | 1971-09-30 | 1975-08-28 | Bell & Howell Co | Metal encapsulation |
CH578621A5 (fr) * | 1972-03-16 | 1976-08-13 | Bbc Brown Boveri & Cie | |
DE2307776C3 (de) * | 1973-02-16 | 1979-08-30 | Wacker-Chemie Gmbh, 8000 Muenchen | Verwendung von Gemischen auf Basis von OrganopolysUoxanen als Klebstoffe |
US4009093A (en) * | 1973-10-23 | 1977-02-22 | The International Nickel Company, Inc. | Platable polymeric composition |
JPS525873A (en) * | 1975-07-02 | 1977-01-17 | Toyoda Automatic Loom Works | Plating of synthetic resin goods |
US4150177A (en) * | 1976-03-31 | 1979-04-17 | Massachusetts Institute Of Technology | Method for selectively nickeling a layer of polymerized polyester resin |
CA1097495A (fr) * | 1976-05-24 | 1981-03-17 | James H. Aumiller | Composition adhesive conductrice d'electricite |
US4113899A (en) * | 1977-05-23 | 1978-09-12 | Wear-Cote International, Inc. | Method of obtaining electroless nickel coated filled epoxy resin article |
US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
-
1977
- 1977-06-24 DE DE2728465A patent/DE2728465C2/de not_active Expired
-
1978
- 1978-06-21 AT AT0451878A patent/AT374329B/de not_active IP Right Cessation
- 1978-06-23 GB GB7827734A patent/GB2000197B/en not_active Expired
- 1978-06-23 US US05/918,378 patent/US4248921A/en not_active Expired - Lifetime
- 1978-06-23 BR BR7804013A patent/BR7804013A/pt unknown
- 1978-06-23 FR FR7818916A patent/FR2395674A1/fr active Granted
- 1978-06-24 JP JP7598378A patent/JPS5418072A/ja active Pending
-
1980
- 1980-09-22 US US06/189,365 patent/US4391742A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
BR7804013A (pt) | 1979-04-03 |
GB2000197B (en) | 1982-03-17 |
FR2395674B3 (fr) | 1981-02-06 |
US4248921A (en) | 1981-02-03 |
US4391742A (en) | 1983-07-05 |
AT374329B (de) | 1984-04-10 |
DE2728465C2 (de) | 1982-04-22 |
JPS5418072A (en) | 1979-02-09 |
GB2000197A (en) | 1979-01-04 |
DE2728465A1 (de) | 1979-01-11 |
ATA451878A (de) | 1983-08-15 |
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