ATA451878A - Verfahren zur herstellung von elektrisch leitenden und loetbaren anordnungen - Google Patents

Verfahren zur herstellung von elektrisch leitenden und loetbaren anordnungen

Info

Publication number
ATA451878A
ATA451878A AT0451878A AT451878A ATA451878A AT A451878 A ATA451878 A AT A451878A AT 0451878 A AT0451878 A AT 0451878A AT 451878 A AT451878 A AT 451878A AT A451878 A ATA451878 A AT A451878A
Authority
AT
Austria
Prior art keywords
solderable
arrangements
electrically conductive
producing electrically
producing
Prior art date
Application number
AT0451878A
Other languages
English (en)
Other versions
AT374329B (de
Original Assignee
Preh Elektro Feinmechanik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh Elektro Feinmechanik filed Critical Preh Elektro Feinmechanik
Publication of ATA451878A publication Critical patent/ATA451878A/de
Application granted granted Critical
Publication of AT374329B publication Critical patent/AT374329B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12069—Plural nonparticulate metal components
    • Y10T428/12076—Next to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24413—Metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
AT0451878A 1977-06-24 1978-06-21 Verfahren zur herstellung von elektrisch leitenden und loetbaren anordnungen AT374329B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2728465A DE2728465C2 (de) 1977-06-24 1977-06-24 Gedruckte Schaltung

Publications (2)

Publication Number Publication Date
ATA451878A true ATA451878A (de) 1983-08-15
AT374329B AT374329B (de) 1984-04-10

Family

ID=6012250

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0451878A AT374329B (de) 1977-06-24 1978-06-21 Verfahren zur herstellung von elektrisch leitenden und loetbaren anordnungen

Country Status (7)

Country Link
US (2) US4248921A (de)
JP (1) JPS5418072A (de)
AT (1) AT374329B (de)
BR (1) BR7804013A (de)
DE (1) DE2728465C2 (de)
FR (1) FR2395674A1 (de)
GB (1) GB2000197B (de)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
DE3028496C2 (de) * 1980-07-26 1986-04-24 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Haftvermittler für ein Trägermaterial
JPS5731193A (en) * 1980-07-31 1982-02-19 Matsushita Electric Works Ltd Method of producing printed circuit board
US4495251A (en) * 1981-03-11 1985-01-22 General Electric Company Shielded plastic microwave oven cavity
EP0097656A4 (de) * 1982-01-04 1986-05-14 Gen Electric Durch ein elektrolytisches austauschverfahren hergestellte verbesserte leiter.
US4499157A (en) * 1983-05-31 1985-02-12 Hughes Aircraft Company Solderable plated plastic components and processes for manufacture and soldering
US4591088A (en) * 1983-05-31 1986-05-27 Hughes Aircraft Company Solder reflow process for soldering shaped articles together
US4495253A (en) * 1983-05-31 1985-01-22 Hughes Aircraft Company Solderable plated plastic components and process for plating _
DE3443789A1 (de) * 1983-12-02 1985-06-27 Osaka Soda Co. Ltd., Osaka Elektrische leitende klebstoffmasse
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
ATE34401T1 (de) * 1984-08-17 1988-06-15 Werner Bandi Verfahren zur herstellung einer beschichtung auf ein traegermaterial.
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
DE3515985A1 (de) * 1985-05-03 1986-11-06 Wilhelm Ruf KG, 8000 München Verfahren zur herstellung einer loetbaren beschichtung auf einem substrat und leiterbahnplatte bzw. loetbare kontaktflaeche
US4680138A (en) * 1985-10-22 1987-07-14 Sayles Sr Delbert E Silver sensing material for use on film
US4673532A (en) * 1986-01-22 1987-06-16 Mcdonnell Douglas Corporation Rosin-free solder composition
US4780371A (en) * 1986-02-24 1988-10-25 International Business Machines Corporation Electrically conductive composition and use thereof
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
US4795508A (en) * 1987-02-05 1989-01-03 Shell Internationale Research Maatschappij B.V. Soldering compositions
JPH01214100A (ja) * 1988-02-21 1989-08-28 Asahi Chem Res Lab Ltd 電磁波シールド回路及びその製造方法
US4980225A (en) * 1988-07-12 1990-12-25 Sayles & Scheel Enterprises, Incorporated Conductive composition and method of use
US5106884A (en) * 1988-10-28 1992-04-21 The Dow Chemical Company Flexible polyurea foams having controlled load bearing qualities
GB8901114D0 (en) * 1989-01-19 1989-03-15 Cookson Group Plc Preparing articles for soldering
US5200264A (en) * 1989-09-05 1993-04-06 Advanced Products, Inc. Thermoset polymer thick film compositions and their use as electrical circuitry
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
FR2659649B1 (fr) * 1990-03-16 1992-06-12 Kodak Pathe Preparation d'alkoxydes d'indium solubles dans les solvants organiques.
JP3118103B2 (ja) * 1992-12-21 2000-12-18 矢崎総業株式会社 電気回路用導電部材、電気回路体及びその製造方法
US5419954A (en) * 1993-02-04 1995-05-30 The Alpha Corporation Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof
JPH08148787A (ja) * 1994-11-21 1996-06-07 Sumitomo Kinzoku Ceramics:Kk 厚膜ペースト
JPH0912385A (ja) * 1995-04-28 1997-01-14 Mitsuboshi Belting Ltd メッキ用表面処理剤およびこれを付着した基材
CN1095623C (zh) * 1996-04-18 2002-12-04 国际商业机器公司 用于含铜金属的复合涂料组合物
US6027762A (en) * 1996-05-23 2000-02-22 Mitsumi Electric Co., Ltd. Method for producing flexible board
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
JP2002531961A (ja) 1998-12-03 2002-09-24 アールティー マイクロウェーブ リミテッド サブストレート上に導電層を付着するためのプロセス
US6291025B1 (en) * 1999-06-04 2001-09-18 Argonide Corporation Electroless coatings formed from organic liquids
KR100369118B1 (ko) * 2000-05-13 2003-01-24 한국과학기술연구원 스크린 프린팅에 의한 고밀도 세라믹 후막 제조방법
US6824857B2 (en) 2001-04-02 2004-11-30 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
GB0117431D0 (en) * 2001-07-17 2001-09-12 Univ Brunel Method for printing conducting layer onto substrate
JP4156522B2 (ja) * 2001-12-27 2008-09-24 株式会社フジクラ 導電性組成物、導電性被膜および導電性被膜の形成方法
EP1383364A3 (de) * 2002-05-23 2006-01-04 Nashua Corporation Schaltungselemente mit tintenaufnehmender Beschichtung und einer Leiterbahn und Verfahren zu deren Herstellung
WO2003103352A1 (ja) * 2002-06-04 2003-12-11 住友電気工業株式会社 プリント配線用基板、プリント配線板およびこれらの製造方法
DE10258824B3 (de) * 2002-12-06 2004-05-06 Hjb Rolling Mill Technology Gmbh Verfahren zum Herstellen eines Bandes mit einem in dessen Querschnitt verlaufenden Stufenprofil
TWI265762B (en) * 2003-01-14 2006-11-01 Sharp Kk Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
US7071121B2 (en) * 2003-10-28 2006-07-04 Hewlett-Packard Development Company, L.P. Patterned ceramic films and method for producing the same
JP2011526054A (ja) * 2008-06-12 2011-09-29 ナノマス テクノロジーズ インコーポレイテッド 導電性インクおよびペースト
EP2374612A4 (de) * 2008-12-26 2017-11-15 FUJIFILM Corporation Oberflächenmetallfilmmaterial, verfahren zur herstellung eines oberflächenmetallfilmmaterials, verfahren zur herstellung eines metallstrukturmaterials und metallstrukturmaterial
KR101490571B1 (ko) * 2010-01-28 2015-02-05 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 패턴 형상 도전성막의 형성 방법
EP3019710A4 (de) 2013-07-09 2017-05-10 United Technologies Corporation Beschichteter polymerlüfter
WO2015006421A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Metal-encapsulated polymeric article
WO2015017095A2 (en) 2013-07-09 2015-02-05 United Technologies Corporation Plated polymer nosecone
WO2015006452A1 (en) * 2013-07-09 2015-01-15 United Technologies Corporation Vehicular engine and transmission components made of plated polymers
WO2015006438A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer compressor
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
WO2016208006A1 (ja) * 2015-06-24 2016-12-29 株式会社メイコー 立体配線基板の製造方法、立体配線基板、立体配線基板用基材
CN107926116B (zh) * 2015-08-17 2020-07-24 住友电气工业株式会社 印刷线路板和电子部件
JP6696989B2 (ja) 2015-08-17 2020-05-20 住友電気工業株式会社 プリント配線板及び電子部品
WO2017075076A1 (en) * 2015-10-27 2017-05-04 Hutchinson Technology Incorporated Metallizing polymers, ceramics and composites for attachment structures
TWI538581B (zh) * 2015-11-20 2016-06-11 財團法人工業技術研究院 金屬導體結構及線路結構
US10925663B2 (en) 2016-06-27 2021-02-23 Mound Laser & Photonics Center, Inc. Metallized components and surgical instruments
EP3491082B1 (de) 2016-07-28 2022-03-30 National Research Council of Canada Kupfertinte und daraus hergestellte leitfähige lötbare kupferbahnen
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
TW201842085A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
TW201842088A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 可印刷分子油墨
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
TW201920515A (zh) 2017-08-01 2019-06-01 加拿大國家研究委員會 銅墨水
EP3468312B1 (de) * 2017-10-06 2023-11-29 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren zur herstellung eines komponententrägers mit einer dreidimensional gedruckten verdrahtungsstruktur
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2748701A (en) * 1951-08-28 1956-06-05 Wendell P Barrows Electrically conductive coating
US3031344A (en) * 1957-08-08 1962-04-24 Radio Ind Inc Production of electrical printed circuits
US3014818A (en) * 1957-12-09 1961-12-26 Du Pont Electrically conducting articles and process of making same
US3245833A (en) * 1964-04-20 1966-04-12 Eastman Kodak Co Electrically conductive coatings
US3488166A (en) * 1967-01-13 1970-01-06 Ibm Method for activating plastics,subsequent metallization and article of manufacture resulting therefrom
DE1615961A1 (de) * 1967-04-12 1970-06-25 Degussa Verfahren zur Herstellung von gedruckten Schaltungen
GB1199471A (en) * 1967-05-02 1970-07-22 Ingram & Glass Ltd Improvements relating to Laminated Sheet Material.
FR1548401A (de) * 1967-08-16 1968-12-06
GB1164591A (en) * 1968-01-03 1969-09-17 Photocircuits Corp mprovements in Metallization of Insulating Substrates
DE1771661A1 (de) * 1968-06-22 1972-02-10 Basf Ag Verfahren zur Metallisierung von Kunststoffschaumkoerpern
US3640853A (en) * 1968-12-27 1972-02-08 Rca Corp Adhesion of nonconducting and conducting materials
GB1403198A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
CH578621A5 (de) * 1972-03-16 1976-08-13 Bbc Brown Boveri & Cie
DE2307776C3 (de) * 1973-02-16 1979-08-30 Wacker-Chemie Gmbh, 8000 Muenchen Verwendung von Gemischen auf Basis von OrganopolysUoxanen als Klebstoffe
US4009093A (en) * 1973-10-23 1977-02-22 The International Nickel Company, Inc. Platable polymeric composition
JPS525873A (en) * 1975-07-02 1977-01-17 Toyoda Automatic Loom Works Plating of synthetic resin goods
US4150177A (en) * 1976-03-31 1979-04-17 Massachusetts Institute Of Technology Method for selectively nickeling a layer of polymerized polyester resin
CA1097495A (en) * 1976-05-24 1981-03-17 James H. Aumiller Electrically conductive adhesive
US4113899A (en) * 1977-05-23 1978-09-12 Wear-Cote International, Inc. Method of obtaining electroless nickel coated filled epoxy resin article
US4170677A (en) * 1977-11-16 1979-10-09 The United States Of America As Represented By The Secretary Of The Army Anisotropic resistance bonding technique

Also Published As

Publication number Publication date
FR2395674A1 (fr) 1979-01-19
DE2728465A1 (de) 1979-01-11
AT374329B (de) 1984-04-10
US4391742A (en) 1983-07-05
DE2728465C2 (de) 1982-04-22
JPS5418072A (en) 1979-02-09
BR7804013A (pt) 1979-04-03
FR2395674B3 (de) 1981-02-06
US4248921A (en) 1981-02-03
GB2000197B (en) 1982-03-17
GB2000197A (en) 1979-01-04

Similar Documents

Publication Publication Date Title
AT374329B (de) Verfahren zur herstellung von elektrisch leitenden und loetbaren anordnungen
AT367438B (de) Verfahren zur herstellung von oligoimiden
ATA283379A (de) Verfahren zur herstellung von elektrisch leitfaehig organopolysiloxanelastomeren
AT366894B (de) Verfahren zur herstellung von aroma- und wuerzstofftraegern
AT356096B (de) Verfahren zur herstellung von furokumarinen
AT358548B (de) Verfahren zur herstellung von 2-aethylhexanol
AT356776B (de) Verfahren zur herstellung von elektrisch isolierenden, hochflexiblen und/oder loetfaehigen ueberzuegen
AT358559B (de) Verfahren zur herstellung von o-methallyloxy- phenol
AT360504B (de) Verfahren zur herstellung von m-chloranilinen
AT366032B (de) Verfahren zur herstellung von moranolin und n-methylmoranolin
AT356643B (de) Verfahren zur herstellung von acylcyaniden
AT360652B (de) Verfahren zur herstellung von 3-jod- und 3- -bromrifamycin s
AT360154B (de) Verfahren zur herstellung von aminoglycosid- -antibiotka
AT377741B (de) Verfahren zur herstellung von chlordioxid
AT366395B (de) Verfahren zur herstellung von vernetzten copolymerisaten
DD137651A1 (de) Elektrisches,mit isoliermasse umhuelltes bauelement und verfahren zur herstellung
AT360648B (de) Verfahren zur herstellung von p-hydroxy-alpha- -aminobenzylpenicillin
AT356642B (de) Verfahren zur herstellung von acylcyaniden
AT347440B (de) Verfahren zur herstellung von benzoylcyanid
DD134469A5 (de) Verfahren zur herstellung von elektrischen widerstaenden
AT362009B (de) Verfahren zur herstellung von leiterplatten
DD132512A1 (de) Verfahren zur herstellung von elektrischem isoliermaterial
DD132090A1 (de) Verfahren zur herstellung von elektroden bei keramischen kondensatoren
AT366036B (de) Verfahren zur herstellung von 3-pyridazonen
AT352104B (de) Verfahren zur herstellung von n-cyanoalkyl-p- halogenphenoxy-isobutyramiden

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee