JPS5418072A - Method of manufacturing electroconductive soldable arrangement - Google Patents
Method of manufacturing electroconductive soldable arrangementInfo
- Publication number
- JPS5418072A JPS5418072A JP7598378A JP7598378A JPS5418072A JP S5418072 A JPS5418072 A JP S5418072A JP 7598378 A JP7598378 A JP 7598378A JP 7598378 A JP7598378 A JP 7598378A JP S5418072 A JPS5418072 A JP S5418072A
- Authority
- JP
- Japan
- Prior art keywords
- soldable
- arrangement
- manufacturing electroconductive
- electroconductive
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12069—Plural nonparticulate metal components
- Y10T428/12076—Next to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12104—Particles discontinuous
- Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/24413—Metal or metal compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2728465A DE2728465C2 (de) | 1977-06-24 | 1977-06-24 | Gedruckte Schaltung |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5418072A true JPS5418072A (en) | 1979-02-09 |
Family
ID=6012250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7598378A Pending JPS5418072A (en) | 1977-06-24 | 1978-06-24 | Method of manufacturing electroconductive soldable arrangement |
Country Status (7)
Country | Link |
---|---|
US (2) | US4248921A (ja) |
JP (1) | JPS5418072A (ja) |
AT (1) | AT374329B (ja) |
BR (1) | BR7804013A (ja) |
DE (1) | DE2728465C2 (ja) |
FR (1) | FR2395674A1 (ja) |
GB (1) | GB2000197B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731193A (en) * | 1980-07-31 | 1982-02-19 | Matsushita Electric Works Ltd | Method of producing printed circuit board |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4409261A (en) * | 1980-02-07 | 1983-10-11 | Cts Corporation | Process for air firing oxidizable conductors |
DE3028496C2 (de) * | 1980-07-26 | 1986-04-24 | Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt | Haftvermittler für ein Trägermaterial |
US4495251A (en) * | 1981-03-11 | 1985-01-22 | General Electric Company | Shielded plastic microwave oven cavity |
JPS59500034A (ja) * | 1982-01-04 | 1984-01-05 | ゼネラル・エレクトリック・カンパニイ | 電気めっきされた増量置換処理導体およびその形成方法 |
US4499157A (en) * | 1983-05-31 | 1985-02-12 | Hughes Aircraft Company | Solderable plated plastic components and processes for manufacture and soldering |
US4495253A (en) * | 1983-05-31 | 1985-01-22 | Hughes Aircraft Company | Solderable plated plastic components and process for plating _ |
US4591088A (en) * | 1983-05-31 | 1986-05-27 | Hughes Aircraft Company | Solder reflow process for soldering shaped articles together |
DE3443789A1 (de) * | 1983-12-02 | 1985-06-27 | Osaka Soda Co. Ltd., Osaka | Elektrische leitende klebstoffmasse |
US4581301A (en) * | 1984-04-10 | 1986-04-08 | Michaelson Henry W | Additive adhesive based process for the manufacture of printed circuit boards |
EP0171482B1 (de) * | 1984-08-17 | 1988-05-18 | Werner Bandi | Verfahren zur Herstellung einer Beschichtung auf ein Trägermaterial |
US4680141A (en) * | 1984-11-29 | 1987-07-14 | Mcdonnell Douglas Corporation | Solder composition |
JPS61159793A (ja) * | 1984-12-31 | 1986-07-19 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
DE3515985A1 (de) * | 1985-05-03 | 1986-11-06 | Wilhelm Ruf KG, 8000 München | Verfahren zur herstellung einer loetbaren beschichtung auf einem substrat und leiterbahnplatte bzw. loetbare kontaktflaeche |
US4680138A (en) * | 1985-10-22 | 1987-07-14 | Sayles Sr Delbert E | Silver sensing material for use on film |
US4673532A (en) * | 1986-01-22 | 1987-06-16 | Mcdonnell Douglas Corporation | Rosin-free solder composition |
US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
JPH0714105B2 (ja) * | 1986-05-19 | 1995-02-15 | 日本電装株式会社 | 混成集積回路基板及びその製造方法 |
US4795508A (en) * | 1987-02-05 | 1989-01-03 | Shell Internationale Research Maatschappij B.V. | Soldering compositions |
JPH01214100A (ja) * | 1988-02-21 | 1989-08-28 | Asahi Chem Res Lab Ltd | 電磁波シールド回路及びその製造方法 |
US4980225A (en) * | 1988-07-12 | 1990-12-25 | Sayles & Scheel Enterprises, Incorporated | Conductive composition and method of use |
US5106884A (en) * | 1988-10-28 | 1992-04-21 | The Dow Chemical Company | Flexible polyurea foams having controlled load bearing qualities |
GB8901114D0 (en) * | 1989-01-19 | 1989-03-15 | Cookson Group Plc | Preparing articles for soldering |
US5200264A (en) * | 1989-09-05 | 1993-04-06 | Advanced Products, Inc. | Thermoset polymer thick film compositions and their use as electrical circuitry |
US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
FR2659649B1 (fr) * | 1990-03-16 | 1992-06-12 | Kodak Pathe | Preparation d'alkoxydes d'indium solubles dans les solvants organiques. |
JP3118103B2 (ja) * | 1992-12-21 | 2000-12-18 | 矢崎総業株式会社 | 電気回路用導電部材、電気回路体及びその製造方法 |
US5419954A (en) * | 1993-02-04 | 1995-05-30 | The Alpha Corporation | Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof |
JPH08148787A (ja) * | 1994-11-21 | 1996-06-07 | Sumitomo Kinzoku Ceramics:Kk | 厚膜ペースト |
JPH0912385A (ja) * | 1995-04-28 | 1997-01-14 | Mitsuboshi Belting Ltd | メッキ用表面処理剤およびこれを付着した基材 |
AU5561696A (en) * | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
EP0809423A1 (en) * | 1996-05-23 | 1997-11-26 | Mitsumi Electric Company Ltd. | Flexible board |
US6592943B2 (en) | 1998-12-01 | 2003-07-15 | Fujitsu Limited | Stencil and method for depositing solder |
US6054761A (en) * | 1998-12-01 | 2000-04-25 | Fujitsu Limited | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
WO2000033625A1 (en) | 1998-12-03 | 2000-06-08 | Rt Microwave Limited | Process for depositing conducting layer on substrate |
US6291025B1 (en) * | 1999-06-04 | 2001-09-18 | Argonide Corporation | Electroless coatings formed from organic liquids |
KR100369118B1 (ko) * | 2000-05-13 | 2003-01-24 | 한국과학기술연구원 | 스크린 프린팅에 의한 고밀도 세라믹 후막 제조방법 |
WO2002080637A1 (en) | 2001-04-02 | 2002-10-10 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
JP4595237B2 (ja) * | 2001-04-27 | 2010-12-08 | 日立金属株式会社 | 銅めっき液および銅めっき方法 |
GB0117431D0 (en) * | 2001-07-17 | 2001-09-12 | Univ Brunel | Method for printing conducting layer onto substrate |
TW588101B (en) * | 2001-12-27 | 2004-05-21 | Fujikura Ltd | Electro-conductive composition, electro-conductive coating and method for producing the coating |
EP1383364A3 (en) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
CN100512599C (zh) * | 2002-06-04 | 2009-07-08 | 住友电气工业株式会社 | 印刷布线用基板及印刷布线板 |
DE10258824B3 (de) * | 2002-12-06 | 2004-05-06 | Hjb Rolling Mill Technology Gmbh | Verfahren zum Herstellen eines Bandes mit einem in dessen Querschnitt verlaufenden Stufenprofil |
TWI265762B (en) * | 2003-01-14 | 2006-11-01 | Sharp Kk | Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof |
US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
US7071121B2 (en) * | 2003-10-28 | 2006-07-04 | Hewlett-Packard Development Company, L.P. | Patterned ceramic films and method for producing the same |
EP2291471A1 (en) * | 2008-06-12 | 2011-03-09 | NanoMas Technologies, Inc. | Conductive inks and pastes |
KR101625421B1 (ko) * | 2008-12-26 | 2016-05-30 | 후지필름 가부시키가이샤 | 표면 금속막 재료, 표면 금속막 재료의 제작 방법, 금속 패턴 재료의 제작 방법, 및 금속 패턴 재료 |
US8828555B2 (en) | 2010-01-28 | 2014-09-09 | Japan Science And Technology Agency | Method for forming patterned conductive film |
WO2015006421A1 (en) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Metal-encapsulated polymeric article |
US11267576B2 (en) | 2013-07-09 | 2022-03-08 | Raytheon Technologies Corporation | Plated polymer nosecone |
WO2015006397A1 (en) * | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Industrial products formed from plated polymers |
WO2015006433A2 (en) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Plated polymer fan |
US10927843B2 (en) | 2013-07-09 | 2021-02-23 | Raytheon Technologies Corporation | Plated polymer compressor |
US9398703B2 (en) | 2014-05-19 | 2016-07-19 | Sierra Circuits, Inc. | Via in a printed circuit board |
WO2016208006A1 (ja) * | 2015-06-24 | 2016-12-29 | 株式会社メイコー | 立体配線基板の製造方法、立体配線基板、立体配線基板用基材 |
WO2017029973A1 (ja) | 2015-08-17 | 2017-02-23 | 住友電気工業株式会社 | プリント配線板及び電子部品 |
JP6696988B2 (ja) * | 2015-08-17 | 2020-05-20 | 住友電気工業株式会社 | プリント配線板及び電子部品 |
US20170113297A1 (en) * | 2015-10-27 | 2017-04-27 | Hutchinson Technology Incorporated | Metallizing polymers, ceramics and composites for attachment structures |
TWI538581B (zh) * | 2015-11-20 | 2016-06-11 | 財團法人工業技術研究院 | 金屬導體結構及線路結構 |
US10925663B2 (en) | 2016-06-27 | 2021-02-23 | Mound Laser & Photonics Center, Inc. | Metallized components and surgical instruments |
CA3032252A1 (en) | 2016-07-28 | 2018-02-01 | National Research Council Of Canada | Copper ink and conductive solderable copper traces produced therefrom |
US10849233B2 (en) | 2017-07-10 | 2020-11-24 | Catlam, Llc | Process for forming traces on a catalytic laminate |
TW201842088A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 可印刷分子油墨 |
TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
CA3052747A1 (en) | 2017-02-08 | 2018-08-16 | National Research Council Of Canada | Silver molecular ink with low viscosity and low processing temperature |
US10349520B2 (en) | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
US10765012B2 (en) | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
TW201920515A (zh) | 2017-08-01 | 2019-06-01 | 加拿大國家研究委員會 | 銅墨水 |
EP3468312B1 (en) * | 2017-10-06 | 2023-11-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a component carrier having a three dimensionally printed wiring structure |
US10827624B2 (en) | 2018-03-05 | 2020-11-03 | Catlam, Llc | Catalytic laminate with conductive traces formed during lamination |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2748701A (en) * | 1951-08-28 | 1956-06-05 | Wendell P Barrows | Electrically conductive coating |
US3031344A (en) * | 1957-08-08 | 1962-04-24 | Radio Ind Inc | Production of electrical printed circuits |
US3014818A (en) * | 1957-12-09 | 1961-12-26 | Du Pont | Electrically conducting articles and process of making same |
US3245833A (en) * | 1964-04-20 | 1966-04-12 | Eastman Kodak Co | Electrically conductive coatings |
US3488166A (en) * | 1967-01-13 | 1970-01-06 | Ibm | Method for activating plastics,subsequent metallization and article of manufacture resulting therefrom |
DE1615961A1 (de) * | 1967-04-12 | 1970-06-25 | Degussa | Verfahren zur Herstellung von gedruckten Schaltungen |
GB1199471A (en) * | 1967-05-02 | 1970-07-22 | Ingram & Glass Ltd | Improvements relating to Laminated Sheet Material. |
FR1548401A (ja) * | 1967-08-16 | 1968-12-06 | ||
GB1164591A (en) * | 1968-01-03 | 1969-09-17 | Photocircuits Corp | mprovements in Metallization of Insulating Substrates |
DE1771661A1 (de) * | 1968-06-22 | 1972-02-10 | Basf Ag | Verfahren zur Metallisierung von Kunststoffschaumkoerpern |
US3640853A (en) * | 1968-12-27 | 1972-02-08 | Rca Corp | Adhesion of nonconducting and conducting materials |
GB1403198A (en) * | 1971-09-30 | 1975-08-28 | Bell & Howell Co | Metal encapsulation |
CH578621A5 (ja) * | 1972-03-16 | 1976-08-13 | Bbc Brown Boveri & Cie | |
DE2307776C3 (de) * | 1973-02-16 | 1979-08-30 | Wacker-Chemie Gmbh, 8000 Muenchen | Verwendung von Gemischen auf Basis von OrganopolysUoxanen als Klebstoffe |
US4009093A (en) * | 1973-10-23 | 1977-02-22 | The International Nickel Company, Inc. | Platable polymeric composition |
JPS525873A (en) * | 1975-07-02 | 1977-01-17 | Toyoda Automatic Loom Works | Plating of synthetic resin goods |
US4150177A (en) * | 1976-03-31 | 1979-04-17 | Massachusetts Institute Of Technology | Method for selectively nickeling a layer of polymerized polyester resin |
CA1097495A (en) * | 1976-05-24 | 1981-03-17 | James H. Aumiller | Electrically conductive adhesive |
US4113899A (en) * | 1977-05-23 | 1978-09-12 | Wear-Cote International, Inc. | Method of obtaining electroless nickel coated filled epoxy resin article |
US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
-
1977
- 1977-06-24 DE DE2728465A patent/DE2728465C2/de not_active Expired
-
1978
- 1978-06-21 AT AT0451878A patent/AT374329B/de not_active IP Right Cessation
- 1978-06-23 GB GB7827734A patent/GB2000197B/en not_active Expired
- 1978-06-23 US US05/918,378 patent/US4248921A/en not_active Expired - Lifetime
- 1978-06-23 BR BR7804013A patent/BR7804013A/pt unknown
- 1978-06-23 FR FR7818916A patent/FR2395674A1/fr active Granted
- 1978-06-24 JP JP7598378A patent/JPS5418072A/ja active Pending
-
1980
- 1980-09-22 US US06/189,365 patent/US4391742A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731193A (en) * | 1980-07-31 | 1982-02-19 | Matsushita Electric Works Ltd | Method of producing printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
FR2395674A1 (fr) | 1979-01-19 |
BR7804013A (pt) | 1979-04-03 |
GB2000197B (en) | 1982-03-17 |
FR2395674B3 (ja) | 1981-02-06 |
US4248921A (en) | 1981-02-03 |
US4391742A (en) | 1983-07-05 |
AT374329B (de) | 1984-04-10 |
DE2728465C2 (de) | 1982-04-22 |
GB2000197A (en) | 1979-01-04 |
DE2728465A1 (de) | 1979-01-11 |
ATA451878A (de) | 1983-08-15 |
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