FR2395606A1 - Structure de capacite amelioree a champ eleve utilisant une region de piegeage de porteurs - Google Patents
Structure de capacite amelioree a champ eleve utilisant une region de piegeage de porteursInfo
- Publication number
- FR2395606A1 FR2395606A1 FR7804188A FR7804188A FR2395606A1 FR 2395606 A1 FR2395606 A1 FR 2395606A1 FR 7804188 A FR7804188 A FR 7804188A FR 7804188 A FR7804188 A FR 7804188A FR 2395606 A1 FR2395606 A1 FR 2395606A1
- Authority
- FR
- France
- Prior art keywords
- layer
- high field
- trap region
- carrier trap
- improved capacity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 235000012239 silicon dioxide Nutrition 0.000 abstract 3
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- 229910052785 arsenic Inorganic materials 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000010893 electron trap Methods 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
- 229920005591 polysilicon Polymers 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 239000010937 tungsten Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/3115—Doping the insulating layers
- H01L21/31155—Doping the insulating layers by ion implantation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7804188A FR2395606A1 (fr) | 1978-02-08 | 1978-02-08 | Structure de capacite amelioree a champ eleve utilisant une region de piegeage de porteurs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7804188A FR2395606A1 (fr) | 1978-02-08 | 1978-02-08 | Structure de capacite amelioree a champ eleve utilisant une region de piegeage de porteurs |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2395606A1 true FR2395606A1 (fr) | 1979-01-19 |
FR2395606B1 FR2395606B1 (enrdf_load_stackoverflow) | 1980-03-14 |
Family
ID=9204595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7804188A Granted FR2395606A1 (fr) | 1978-02-08 | 1978-02-08 | Structure de capacite amelioree a champ eleve utilisant une region de piegeage de porteurs |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2395606A1 (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0016246A1 (fr) * | 1979-02-15 | 1980-10-01 | International Business Machines Corporation | Structure semi-conductrice à effet de champ du type métal-isolant-métal ou métal-isolant-semi-conducteur et élément de mémoire comportant une telle structure |
EP0308814A3 (en) * | 1987-09-21 | 1989-04-26 | National Semiconductor Corporation | Modification of interfacial fields between dielectrics amodification of interfacial fields between dielectrics and semiconductors nd semiconductors |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2056947A1 (en) * | 1970-11-20 | 1972-06-29 | Fraunhofer Ges Forschung | Mos surface stabilization - by ion implantation and tempering in hydrogen atmosphere |
US3945031A (en) * | 1973-12-10 | 1976-03-16 | Bell Telephone Laboratories, Incorporated | Charge effects in doped silicon dioxide |
-
1978
- 1978-02-08 FR FR7804188A patent/FR2395606A1/fr active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2056947A1 (en) * | 1970-11-20 | 1972-06-29 | Fraunhofer Ges Forschung | Mos surface stabilization - by ion implantation and tempering in hydrogen atmosphere |
US3945031A (en) * | 1973-12-10 | 1976-03-16 | Bell Telephone Laboratories, Incorporated | Charge effects in doped silicon dioxide |
Non-Patent Citations (1)
Title |
---|
NV1046/75 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0016246A1 (fr) * | 1979-02-15 | 1980-10-01 | International Business Machines Corporation | Structure semi-conductrice à effet de champ du type métal-isolant-métal ou métal-isolant-semi-conducteur et élément de mémoire comportant une telle structure |
EP0308814A3 (en) * | 1987-09-21 | 1989-04-26 | National Semiconductor Corporation | Modification of interfacial fields between dielectrics amodification of interfacial fields between dielectrics and semiconductors nd semiconductors |
US6117749A (en) * | 1987-09-21 | 2000-09-12 | National Semiconductor Corporation | Modification of interfacial fields between dielectrics and semiconductors |
Also Published As
Publication number | Publication date |
---|---|
FR2395606B1 (enrdf_load_stackoverflow) | 1980-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |