FR2363644A1 - Procede de galvanoplastie et dispositif pour la mise en oeuvre du procede - Google Patents

Procede de galvanoplastie et dispositif pour la mise en oeuvre du procede

Info

Publication number
FR2363644A1
FR2363644A1 FR7726610A FR7726610A FR2363644A1 FR 2363644 A1 FR2363644 A1 FR 2363644A1 FR 7726610 A FR7726610 A FR 7726610A FR 7726610 A FR7726610 A FR 7726610A FR 2363644 A1 FR2363644 A1 FR 2363644A1
Authority
FR
France
Prior art keywords
pulses
galvanoplasty
implementing
microseconds
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7726610A
Other languages
English (en)
Other versions
FR2363644B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10472476A external-priority patent/JPS5329346A/ja
Priority claimed from JP15005176A external-priority patent/JPS5373437A/ja
Priority claimed from JP6912977A external-priority patent/JPS544253A/ja
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Publication of FR2363644A1 publication Critical patent/FR2363644A1/fr
Application granted granted Critical
Publication of FR2363644B1 publication Critical patent/FR2363644B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1584—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/09—Wave forms

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

L'invention concerne un procédé de galvanoplastie et un dispositif pour la mise en oeuvre du procédé. On fait passer un courant sous forme d'impulsions entre une pièce à recouvrir 14 et une électrode 13 en présence d'un électrolyte 15, les impulsions ayant une durée inférieure ou égale à 100 microsecondes, de preférence inférieure à 50 microsecondes, l'intervalle entre deux impulsions étant supérieur à deux fois la durée d'impulsions. Les impulsions peuvent être modifiées en fonction de la condition de l'intervalle de dépôt électrolytique
FR7726610A 1976-09-01 1977-09-01 Procede de galvanoplastie et dispositif pour la mise en oeuvre du procede Granted FR2363644A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10472476A JPS5329346A (en) 1976-09-01 1976-09-01 Process of electrodeposition
JP15005176A JPS5373437A (en) 1976-12-14 1976-12-14 Power source device for electrolysis
JP6912977A JPS544253A (en) 1977-06-10 1977-06-10 Electrolytic apparatus

Publications (2)

Publication Number Publication Date
FR2363644A1 true FR2363644A1 (fr) 1978-03-31
FR2363644B1 FR2363644B1 (fr) 1982-05-28

Family

ID=27299961

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7726610A Granted FR2363644A1 (fr) 1976-09-01 1977-09-01 Procede de galvanoplastie et dispositif pour la mise en oeuvre du procede

Country Status (5)

Country Link
US (1) US4496436A (fr)
CH (1) CH629542A5 (fr)
DE (1) DE2739427C2 (fr)
FR (1) FR2363644A1 (fr)
GB (1) GB1529187A (fr)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1539309A (en) * 1976-12-14 1979-01-31 Inoue Japax Res Electrochemical polishing
US4396467A (en) * 1980-10-27 1983-08-02 General Electric Company Periodic reverse current pulsing to form uniformly sized feed through conductors
NL8105150A (nl) 1981-11-13 1983-06-01 Veco Beheer Bv Werkwijze voor het vervaardigen van zeefmateriaal, verkregen zeefmateriaal, alsmede inrichting voor het uitvoeren van de werkwijze.
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4566953A (en) * 1984-12-24 1986-01-28 At&T Technologies, Inc. Pulse plating of nickel-antimony films
IT1215985B (it) * 1988-03-04 1990-02-22 Elca Srl Procedimento elettrochimico per la realizzazione di rivestimenti di cromo e metalli simili mediante corrente pulsante ad inversione periodica della polarita'
US5270229A (en) * 1989-03-07 1993-12-14 Matsushita Electric Industrial Co., Ltd. Thin film semiconductor device and process for producing thereof
FI85793C (fi) * 1990-05-18 1992-05-25 Plasmapiiri Oy Foerfarande och anordning foer framstaellning av kretskort.
JP2875680B2 (ja) * 1992-03-17 1999-03-31 株式会社東芝 基材表面の微小孔又は微細凹みの充填又は被覆方法
DE4225961C5 (de) * 1992-08-06 2011-01-27 Atotech Deutschland Gmbh Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
DE19547948C1 (de) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung
US6402931B1 (en) 1998-05-18 2002-06-11 Faraday Technology Marketing Group, Llc Electrochemical machining using modulated reverse electric fields
US6582578B1 (en) 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
DE19925373B4 (de) * 1999-06-02 2006-04-06 Robert Bosch Gmbh Verfahren und Vorrichtung zum Galvanisieren
US6299741B1 (en) 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US6379223B1 (en) 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
JP3423702B2 (ja) * 2000-08-29 2003-07-07 創輝株式会社 金属めっき方法
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
DE10202431C1 (de) * 2002-01-22 2003-05-28 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von Gut mit Pulsstrom
US7239747B2 (en) * 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
US20030188974A1 (en) * 2002-04-03 2003-10-09 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20030201185A1 (en) * 2002-04-29 2003-10-30 Applied Materials, Inc. In-situ pre-clean for electroplating process
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
US20030209523A1 (en) * 2002-05-09 2003-11-13 Applied Materials, Inc. Planarization by chemical polishing for ULSI applications
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
US20040118699A1 (en) * 2002-10-02 2004-06-24 Applied Materials, Inc. Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects
DE10311575B4 (de) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
CN101416569B (zh) 2006-03-30 2011-04-06 埃托特克德国有限公司 用金属填充孔和凹处的电解方法
ATE506468T1 (de) 2008-04-28 2011-05-15 Atotech Deutschland Gmbh Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer
US20110017608A1 (en) * 2009-07-27 2011-01-27 Faraday Technology, Inc. Electrochemical etching and polishing of conductive substrates
EP2518187A1 (fr) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Bain d'acide aqueux pour le dépôt électrolytique de cuivre
US10081880B2 (en) 2013-05-06 2018-09-25 Fpinnovations Cellulose nanocrystal (CNC) films and conductive CNC-based polymer films produced using electrochemical techniques
CN109790638B (zh) 2016-08-15 2021-06-18 德国艾托特克公司 用于电解镀铜的酸性水性组合物
EP3470552B1 (fr) 2017-10-13 2020-12-30 ATOTECH Deutschland GmbH Composition aqueuse acide pour déposer électrolytiquement un dépôt de cuivre
EP3901331A1 (fr) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Composition aqueuse acide pour déposer électrolytiquement un dépôt de cuivre

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1421984A1 (de) * 1962-10-01 1968-11-07 Forsch Edelmetalle Und Metallc Verfahren zur Herstellung von rissfreien Chromueberzuegen
DE2061225A1 (de) * 1969-12-30 1971-09-09 Ibm Verfahren zum elektrolytischen Abscheiden von legierten Duennschichten
FR2134401A1 (fr) * 1971-04-24 1972-12-08 Schering Ag
US3959088A (en) * 1975-03-19 1976-05-25 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for generating high amperage pulses from an A-C power source

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2726202A (en) * 1955-06-06 1955-12-06 Robotron Corp Method for plating by condenser discharge
JPS5745318B2 (fr) * 1974-09-18 1982-09-27

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1421984A1 (de) * 1962-10-01 1968-11-07 Forsch Edelmetalle Und Metallc Verfahren zur Herstellung von rissfreien Chromueberzuegen
DE2061225A1 (de) * 1969-12-30 1971-09-09 Ibm Verfahren zum elektrolytischen Abscheiden von legierten Duennschichten
FR2134401A1 (fr) * 1971-04-24 1972-12-08 Schering Ag
US3959088A (en) * 1975-03-19 1976-05-25 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for generating high amperage pulses from an A-C power source

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PLATING, volume 58, No. 8, août 1969, pages 909 - 913, American Electroplaters Society, Inc. East Orange (us), V.A. LAMB: 'Electroplating with Current Pulses in the microsecond Range' *
PLATING, volume 62, No. 2, février 1975, pages 139 - 141, American Electroplaters Society, Inc. East Orange (US), W. SULLIVAN: 'Electroplating Cobalt With a High Current Capacity Pulse Plating System' *

Also Published As

Publication number Publication date
GB1529187A (en) 1978-10-18
FR2363644B1 (fr) 1982-05-28
DE2739427C2 (de) 1983-12-08
DE2739427A1 (de) 1978-03-02
CH629542A5 (de) 1982-04-30
US4496436A (en) 1985-01-29

Similar Documents

Publication Publication Date Title
FR2363644A1 (fr) Procede de galvanoplastie et dispositif pour la mise en oeuvre du procede
FR2374439A1 (fr) Procede et appareil de polissage electrochimique
BE878588A (fr) Procede pour reduire les courants de derivation dans un appareil electrochimique, et cet appareil,
DE69610611D1 (de) Verfahren zum elektrochemischen bearbeiten mittels bipolairen strompulsen
OA07267A (fr) Procédé et dispositif de réglage du plan anodique d'une cuve d'électrolyse pour la production d'aluminium.
DE2862463D1 (en) Electrode for electrolytic processes, electrolysis cell and method for electrolysis
OA05574A (fr) Procédé et dispositif pour le nettoyage des mégots d'anodes usées provenant de cuve d'électrolyse ignée.
JPS5446178A (en) Method and apparatus for carrying out electrochemical reaction and dual electrode suitable thereto
FR2384257A2 (fr) Procede et dispositif pour la determination electrochimique de la concentration des metaux lourds dans l'eau
DE3783831D1 (de) Verfahren und vorrichtung zur kontrolle des organischen kontaminationspegels in einem platierungsbad ohne elektrode.
FR2345882A1 (fr) Procede et dispositif pour engendrer ou detecter de l'energie acoustique
PT67986A (fr) Dispositif et procede pour la filtration discontinue de suspensions.
DE69112659D1 (de) Kohlenstoffelektrode und Verfahren und Vorrichtung zur Elektrolyse eines Wasserstoff-Fluorid enthaltenden Schmelzbades mit der Kohlenstoffelektrode.
GB2005722B (en) Method and apparatus for the regeneration of an electrolyte particurarly an electrolyte for tinning
BE817477A (fr) Procede et dispositif pour la detection des court-circuits et l'equilibrage du courant dans des cellules d'electrolyse
ATA341477A (de) Verfahren und vorrichtung zur beeinflussung des elektirschen stromes im fluessigen aluminium bei der gewinnung von aluminium durch schmelzfluss- elektrolyse von aluminiumoxyd
FR2568271B1 (fr) Procede pour l'electrodeposition de metaux en continu, a densite de courant elevee, dans des cellules verticales et dispositif pour l'execution du procede
ES8600821A1 (es) Procedimiento para el control del estado redox de uno o varios elementos en el vidrio.
DE3566730D1 (en) Method for the measurement of the wall thickness of bodies by ultrasonic pulses, and device for carrying out the process
FR2311109B3 (fr) Procede continu de raffinage electrolytique et dispositif pour sa mise en oeuvre
ES2019961B3 (es) Aparato de rodaje automatico de electrodos de robor de soldadura.
DE3668915D1 (de) Verfahren und vorrichtung zum feststellen des beginns des stromlosen plattierungsvorgangs.
DE3580197D1 (de) Verfahren zum schneiden mittels elektroerosion und vorrichtung zum durchfuehren dieses verfahrens.
JPS5329792A (en) Method and apparatus for analysis of metals in solution
FR2351409A1 (fr) Dispositif pour l'analyse quantitative fluorometrique x en continu de boues