FR2354393A1 - Procede et dispositif de pulverisation cathodique reactive - Google Patents

Procede et dispositif de pulverisation cathodique reactive

Info

Publication number
FR2354393A1
FR2354393A1 FR7717497A FR7717497A FR2354393A1 FR 2354393 A1 FR2354393 A1 FR 2354393A1 FR 7717497 A FR7717497 A FR 7717497A FR 7717497 A FR7717497 A FR 7717497A FR 2354393 A1 FR2354393 A1 FR 2354393A1
Authority
FR
France
Prior art keywords
reactive
gas
spraying method
spraying
tubular substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7717497A
Other languages
English (en)
Other versions
FR2354393B1 (fr
Inventor
Geoffrey Lester Harding
David Robert Mckenzie
Brian Window
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Sydney
Original Assignee
University of Sydney
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Sydney filed Critical University of Sydney
Publication of FR2354393A1 publication Critical patent/FR2354393A1/fr
Application granted granted Critical
Publication of FR2354393B1 publication Critical patent/FR2354393B1/fr
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • C23C14/0036Reactive sputtering
    • C23C14/0063Reactive sputtering characterised by means for introducing or removing gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Procédé de pulvérisation cathodique réactive pour déposer un film mince de matériau sur un substrat tubulaire qui peut, par exemple, être un tube collecteur d'énergie solaire. L'uniformité de la couche en surface et en profondeur est obtenue en empêchant le déplacement des gaz réactifs, d'une partie de la zone de pulvérisation vers une autre. Dans une variante, le gaz est balayé par entraînement dans un courant de gaz transversal à la pulvérisation, ou encore, le débit de gaz réactif est entièrement consommé dans une zone délimitée de pulvérisation. Un tel dispositif comprend des tubes 15, 16, 27, 28, munis de séries de trous ou d'ouvertures alignées parallèlement à l'axe du substrat tubulaire 5, sur lequel l'on doit déposer le film.
FR7717497A 1976-06-10 1977-06-08 Procede et dispositif de pulverisation cathodique reactive Granted FR2354393A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU622876 1976-06-10

Publications (2)

Publication Number Publication Date
FR2354393A1 true FR2354393A1 (fr) 1978-01-06
FR2354393B1 FR2354393B1 (fr) 1982-03-19

Family

ID=3696752

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7717497A Granted FR2354393A1 (fr) 1976-06-10 1977-06-08 Procede et dispositif de pulverisation cathodique reactive

Country Status (13)

Country Link
US (1) US4128466A (fr)
JP (1) JPS52150790A (fr)
AU (1) AU507748B2 (fr)
CA (1) CA1076521A (fr)
CH (1) CH622828A5 (fr)
DE (1) DE2725885A1 (fr)
ES (1) ES459671A1 (fr)
FR (1) FR2354393A1 (fr)
GB (1) GB1570044A (fr)
IL (1) IL52212A (fr)
IT (1) IT1083425B (fr)
NL (1) NL7706230A (fr)
SE (1) SE440369B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413479A1 (fr) * 1977-12-27 1979-07-27 Coulter Systems Corp Dispositif pour pulverisation cathodique d'un revetement sur un cylindre
EP0049380A1 (fr) * 1980-09-17 1982-04-14 COMPAGNIE INDUSTRIELLE DES TELECOMMUNICATIONS CIT-ALCATEL S.A. dite: Dispositif de déposition chimique activée sous plasma
EP0092452A1 (fr) * 1982-03-31 1983-10-26 Commissariat A L'energie Atomique Revêtement pour la conversion photothermique

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2010676B (en) * 1977-12-27 1982-05-19 Alza Corp Diffusional drug delivery device with block copolymer as drug carrier
JPS5594479A (en) * 1979-01-06 1980-07-17 Coulter Systems Corp Spattering method and apparatus
DE3002194A1 (de) * 1980-01-22 1981-07-23 Berna AG Olten, Olten Vorrichtung zur (teil) beschichtung eines substrates durch kathodenzerstaeubung, vefahren zur beschichtung und deren anwendung
US4309261A (en) * 1980-07-03 1982-01-05 University Of Sydney Method of and apparatus for reactively sputtering a graded surface coating onto a substrate
US4290877A (en) * 1980-09-08 1981-09-22 The United States Of America As Represented By The Secretary Of The Interior Sputtering apparatus for coating elongated tubes and strips
JPS57111031A (en) * 1980-12-27 1982-07-10 Clarion Co Ltd Sputtering device
CA1155798A (fr) * 1981-03-30 1983-10-25 Shmuel Maniv Methode et dispositif de deposition par reaction
JPS6037188B2 (ja) * 1981-08-27 1985-08-24 三菱マテリアル株式会社 スパツタリング装置
JPS599166U (ja) * 1982-07-08 1984-01-20 日産自動車株式会社 内燃機関の点火制御装置
EP0106638A1 (fr) * 1982-10-12 1984-04-25 National Research Development Corporation Procédé et appareil pour la croissance des matières au moyen d'une décharge luminescente
US4704339A (en) * 1982-10-12 1987-11-03 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Infra-red transparent optical components
JPS6016755U (ja) * 1982-12-12 1985-02-04 白木金属工業株式会社 被膜蒸着装置
JPS5991361U (ja) * 1982-12-12 1984-06-21 日東工器株式会社 被膜蒸着装置
JPS5991360U (ja) * 1982-12-12 1984-06-21 シロキ工業株式会社 反応性蒸着膜形成装置
DE3306738A1 (de) * 1983-02-25 1984-08-30 Berna AG Olten, Olten Vorrichtung und verfahren zur beschichtung von substraten mittels glimmentladung, sowie deren anwendung
US4420385A (en) * 1983-04-15 1983-12-13 Gryphon Products Apparatus and process for sputter deposition of reacted thin films
CH659346A5 (de) * 1983-05-10 1987-01-15 Balzers Hochvakuum Vorrichtung zum behandeln der innenwand eines rohres.
US4491509A (en) * 1984-03-09 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for sputtering material onto a substrate
DE3726731A1 (de) * 1987-08-11 1989-02-23 Hartec Ges Fuer Hartstoffe Und Verfahren zum aufbringen von ueberzuegen auf gegenstaende mittels magnetfeldunterstuetzter kathodenzerstaeubung im vakuum
US4885070A (en) * 1988-02-12 1989-12-05 Leybold Aktiengesellschaft Method and apparatus for the application of materials
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
US5225057A (en) * 1988-02-08 1993-07-06 Optical Coating Laboratory, Inc. Process for depositing optical films on both planar and non-planar substrates
US5798027A (en) * 1988-02-08 1998-08-25 Optical Coating Laboratory, Inc. Process for depositing optical thin films on both planar and non-planar substrates
DE4402883A1 (de) * 1994-02-01 1995-08-03 Henkel Kgaa Optimiertes Verfahren zur Aufarbeitung von wasserdampfbasierten Brüdenströmen
JPH07316810A (ja) * 1994-05-27 1995-12-05 Fuji Xerox Co Ltd スパッタリング装置
WO1999023274A1 (fr) * 1997-11-03 1999-05-14 Siemens Aktiengesellschaft PROCEDE DE DEPOT PHYSIQUE EN PHASE VAPEUR AVEC JET DE GAZ POUR LA REALISATION D'UNE COUCHE AVEC DU MoSi¿2?
US6436252B1 (en) 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
US6669824B2 (en) 2000-07-10 2003-12-30 Unaxis Usa, Inc. Dual-scan thin film processing system
US6495010B2 (en) 2000-07-10 2002-12-17 Unaxis Usa, Inc. Differentially-pumped material processing system
ITFI20020042A1 (it) * 2002-03-08 2002-06-06 Galileo Vacuum Systems S R L Impianto per la metallizzazione sotto vuoto di oggetti trattati in lotti
CN102598286A (zh) * 2009-09-06 2012-07-18 张晗钟 管状光伏器件和制造方法
US9392678B2 (en) * 2012-10-16 2016-07-12 Asml Netherlands B.V. Target material supply apparatus for an extreme ultraviolet light source

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1415251A (fr) * 1964-11-27 1965-10-22 Fuji Photo Film Co Ltd Procédé et appareil d'application de revêtements sous vide
FR1492429A (fr) * 1966-08-31 1967-08-18 Libbey Owens Ford Glass Co Procédé et appareil pour éliminer les éléments contaminants de la surface d'un substrat
FR1502647A (fr) * 1965-12-17 1968-02-07
GB1147318A (en) * 1968-02-22 1969-04-02 Standard Telephones Cables Ltd Improvements in r.f. cathodic sputtering systems
DE1938131A1 (de) * 1969-07-26 1971-01-28 Leybold Heraeus Gmbh & Co Kg Verfahren und Vorrichtung zum Aufbringen duenner Schichten durch Kathodenzerstaeubung
FR2053217A1 (fr) * 1969-07-28 1971-04-16 Gillette Co

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2476592A (en) * 1944-12-13 1949-07-19 Fruth Hal Frederick Cathodic deposition apparatus
US3324825A (en) * 1964-11-25 1967-06-13 Mhd Res Inc Glow discharge reactor
US3501393A (en) * 1967-05-05 1970-03-17 Litton Systems Inc Apparatus for sputtering wherein the plasma is confined by the target structure
US3725238A (en) * 1969-07-28 1973-04-03 Gillette Co Target element
DE2109061A1 (en) * 1970-02-27 1971-09-09 Varian Associates Vacuum coating of multiface substrate
FR2088659A5 (fr) * 1970-04-21 1972-01-07 Progil
JPS473154U (fr) * 1971-01-29 1972-09-02
GB1365492A (en) * 1971-02-05 1974-09-04 Triplex Safety Glass Co Metal oxide films
US3856654A (en) * 1971-08-26 1974-12-24 Western Electric Co Apparatus for feeding and coating masses of workpieces in a controlled atmosphere
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor
US3897325A (en) * 1972-10-20 1975-07-29 Nippon Electric Varian Ltd Low temperature sputtering device
JPS49125285A (fr) * 1973-04-06 1974-11-30
US3976555A (en) * 1975-03-20 1976-08-24 Coulter Information Systems, Inc. Method and apparatus for supplying background gas in a sputtering chamber
US3979273A (en) * 1975-05-27 1976-09-07 United Technologies Corporation Method of forming aluminide coatings on nickel-, cobalt-, and iron-base alloys

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1415251A (fr) * 1964-11-27 1965-10-22 Fuji Photo Film Co Ltd Procédé et appareil d'application de revêtements sous vide
FR1502647A (fr) * 1965-12-17 1968-02-07
FR1492429A (fr) * 1966-08-31 1967-08-18 Libbey Owens Ford Glass Co Procédé et appareil pour éliminer les éléments contaminants de la surface d'un substrat
GB1147318A (en) * 1968-02-22 1969-04-02 Standard Telephones Cables Ltd Improvements in r.f. cathodic sputtering systems
DE1938131A1 (de) * 1969-07-26 1971-01-28 Leybold Heraeus Gmbh & Co Kg Verfahren und Vorrichtung zum Aufbringen duenner Schichten durch Kathodenzerstaeubung
FR2053217A1 (fr) * 1969-07-28 1971-04-16 Gillette Co

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/76 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413479A1 (fr) * 1977-12-27 1979-07-27 Coulter Systems Corp Dispositif pour pulverisation cathodique d'un revetement sur un cylindre
EP0049380A1 (fr) * 1980-09-17 1982-04-14 COMPAGNIE INDUSTRIELLE DES TELECOMMUNICATIONS CIT-ALCATEL S.A. dite: Dispositif de déposition chimique activée sous plasma
EP0092452A1 (fr) * 1982-03-31 1983-10-26 Commissariat A L'energie Atomique Revêtement pour la conversion photothermique
US4504553A (en) * 1982-03-31 1985-03-12 Commissariat A L'energie Atomique Covering for photothermal conversion

Also Published As

Publication number Publication date
JPS572272B2 (fr) 1982-01-14
CH622828A5 (fr) 1981-04-30
DE2725885C2 (fr) 1987-07-09
IL52212A0 (en) 1977-08-31
NL7706230A (nl) 1977-12-13
ES459671A1 (es) 1978-05-01
CA1076521A (fr) 1980-04-29
GB1570044A (en) 1980-06-25
DE2725885A1 (de) 1977-12-22
AU2514177A (en) 1978-11-16
SE7706649L (sv) 1977-12-11
US4128466A (en) 1978-12-05
FR2354393B1 (fr) 1982-03-19
SE440369B (sv) 1985-07-29
JPS52150790A (en) 1977-12-14
AU507748B2 (en) 1980-02-28
IT1083425B (it) 1985-05-21
IL52212A (en) 1979-10-31

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Legal Events

Date Code Title Description
ST Notification of lapse