Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
  • H01L21/30604—Chemical etching
  • H01L21/30612—Etching of AIIIBV compounds
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
  • H01L23/4822—Beam leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/013—Alloys
  • H01L2924/0132—Binary Alloys
  • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds

Applications Claiming Priority (1)

Publications (1)

Family

ID=23074635

Family Applications (1)

Country Status (9)

Cited By (1)

Families Citing this family (5)

Family Cites Families (2)

• 1972
  • 1972-08-15 US US05/280,784 patent/US3947304A/en not_active Expired - Lifetime
• 1973
  • 1973-03-01 CA CA164,988A patent/CA988817A/en not_active Expired
  • 1973-08-02 SE SE7310652A patent/SE387198B/xx unknown
  • 1973-08-09 NL NLAANVRAGE7311019,A patent/NL176412C/xx not_active IP Right Cessation
  • 1973-08-10 GB GB3800073A patent/GB1401114A/en not_active Expired
  • 1973-08-13 IT IT51988/73A patent/IT994153B/it active
  • 1973-08-14 FR FR7329683A patent/FR2196604A5/fr not_active Expired
  • 1973-08-14 JP JP48090634A patent/JPS525231B2/ja not_active Expired
  • 1973-08-14 BE BE134579A patent/BE803610A/fr not_active IP Right Cessation

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