FR2181049B1 - - Google Patents

Info

Publication number
FR2181049B1
FR2181049B1 FR7314471A FR7314471A FR2181049B1 FR 2181049 B1 FR2181049 B1 FR 2181049B1 FR 7314471 A FR7314471 A FR 7314471A FR 7314471 A FR7314471 A FR 7314471A FR 2181049 B1 FR2181049 B1 FR 2181049B1
Authority
FR
France
Prior art keywords
copper
substrate
metals
heating
direct bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7314471A
Other languages
English (en)
French (fr)
Other versions
FR2181049A1 (ko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2181049A1 publication Critical patent/FR2181049A1/fr
Application granted granted Critical
Publication of FR2181049B1 publication Critical patent/FR2181049B1/fr
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • CCHEMISTRY; METALLURGY
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567Treatment time
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658Atmosphere during thermal treatment
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658Atmosphere during thermal treatment
    • C04B2235/6583Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6584Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage below that of air
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658Atmosphere during thermal treatment
    • C04B2235/6586Processes characterised by the flow of gas
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04Ceramic interlayers
    • C04B2237/06Oxidic interlayers
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04Ceramic interlayers
    • C04B2237/08Non-oxidic interlayers
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/341Silica or silicates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/343Alumina or aluminates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/345Refractory metal oxides
    • C04B2237/346Titania or titanates
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/403Refractory metals
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/405Iron metal group, e.g. Co or Ni
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/405Iron metal group, e.g. Co or Ni
    • C04B2237/406Iron, e.g. steel
    • CCHEMISTRY; METALLURGY
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/407Copper
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/408Noble metals, e.g. palladium, platina or silver
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/54Oxidising the surface before joining
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/60Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
    • CCHEMISTRY; METALLURGY
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
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    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/74Forming laminates or joined articles comprising at least two different interlayers separated by a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Products (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Chemical Vapour Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
FR7314471A 1972-04-20 1973-04-19 Expired FR2181049B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24588972A 1972-04-20 1972-04-20

Publications (2)

Publication Number Publication Date
FR2181049A1 FR2181049A1 (ko) 1973-11-30
FR2181049B1 true FR2181049B1 (ko) 1980-04-11

Family

ID=22928519

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7314471A Expired FR2181049B1 (ko) 1972-04-20 1973-04-19

Country Status (6)

Country Link
US (1) US3766634A (ko)
JP (1) JPS5713515B2 (ko)
DE (1) DE2319854C2 (ko)
FR (1) FR2181049B1 (ko)
GB (1) GB1394322A (ko)
IT (1) IT983841B (ko)

Families Citing this family (219)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911570A (en) * 1973-08-21 1975-10-14 Electro Oxide Corp Electrical connector and method of making
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
JPS54157277A (en) * 1978-06-01 1979-12-12 Nippon Electric Co Method of printed board for microwave
CH633391A5 (de) * 1978-11-22 1982-11-30 Bbc Brown Boveri & Cie Scheibenrotor fuer eine elektrische maschine.
JPS55104979A (en) * 1979-02-02 1980-08-11 Kogyo Gijutsuin Adhesion of ceramic molded body to transition metal
JPS599510B2 (ja) * 1979-10-15 1984-03-02 昭栄化学工業株式会社 点火栓用セラミツク圧電体の製造方法
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
US4245488A (en) * 1980-01-04 1981-01-20 General Electric Company Use of motor power control circuit losses in a clothes washing machine
DE3036128C2 (de) * 1980-09-25 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten Verbinden von Kupferfolien mit Oxidkeramiksubstraten
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
JPS58102532A (ja) * 1981-12-15 1983-06-18 Toshiba Corp 半導体装置
DE3204167A1 (de) * 1982-02-06 1983-08-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten
US4500029A (en) * 1982-06-11 1985-02-19 General Electric Company Electrical assembly including a conductor pattern bonded to a non-metallic substrate and method of fabricating such assembly
DE3223948A1 (de) * 1982-06-26 1983-12-29 Tigra Verschleiß- und Werkzeugtechnik GmbH, 7240 Horb Verfahren zum verloeten keramischer und metallischer werkstoffe untereinander
EP0097944B1 (en) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Method for directly bonding ceramic and metal members and laminated body of the same
DE3233022A1 (de) * 1982-09-06 1984-03-08 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Verfahren zum direkten verbinden eines koerpers mit einem keramischen substrat
DE3241926A1 (de) * 1982-11-12 1984-05-17 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Verbindung eines keramischen rotationsbauteils mit einem metallischen rotationsbauteil fuer stroemungsmaschinen, insbesondere gasturbinentriebwerke
JPS59150453A (ja) * 1982-12-23 1984-08-28 Toshiba Corp 半導体モジユ−ル用基板の製造方法
JPS59121860A (ja) * 1982-12-28 1984-07-14 Toshiba Corp 半導体用基板
US4538170A (en) * 1983-01-03 1985-08-27 General Electric Company Power chip package
GB8305366D0 (en) * 1983-02-25 1983-03-30 Secr Defence Cathode ray tube
JPS59190279A (ja) * 1983-04-13 1984-10-29 株式会社東芝 セラミツクス構造体及びその製造方法
EP0127801B1 (de) * 1983-06-03 1986-10-22 Asea Brown Boveri Ag Kollektor für eine elektrische Maschine und Verfahren zu dessen Herstellung
US4604299A (en) * 1983-06-09 1986-08-05 Kollmorgen Technologies Corporation Metallization of ceramics
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
DE3324661A1 (de) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metall mit keramik
JPS60107845A (ja) * 1983-11-17 1985-06-13 Toshiba Corp 半導体用回路基板
US4582240A (en) * 1984-02-08 1986-04-15 Gould Inc. Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components
US4563383A (en) * 1984-03-30 1986-01-07 General Electric Company Direct bond copper ceramic substrate for electronic applications
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization
EP0185967A3 (en) * 1984-12-10 1988-08-03 Kollmorgen Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4602731A (en) * 1984-12-24 1986-07-29 Borg-Warner Corporation Direct liquid phase bonding of ceramics to metals
US4631099A (en) * 1985-01-04 1986-12-23 Agency Of Industrial Science & Technology Method for adhesion of oxide type ceramics with copper or alloy thereof
DE3633907A1 (de) * 1986-08-02 1988-02-04 Altan Akyuerek Verfahren zum haftfesten verbinden eines kupferkoerpers mit einem substrat
DE3639021A1 (de) * 1986-11-14 1988-05-26 Philips Patentverwaltung Verfahren zum verloeten von keramischen bauteilen
EP0273227A3 (en) * 1986-12-22 1989-01-25 Kalman F. Zsamboky A method of improving bond strength between a metal layer and a non-metallic substrate
FR2615049B1 (fr) * 1987-05-04 1989-06-16 Alsthom Collecteur pour machine electrique tournante et procede de fabrication de ce collecteur
FR2623046B1 (fr) * 1987-11-10 1990-03-23 Telemecanique Electrique Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant
US4788765A (en) * 1987-11-13 1988-12-06 Gentron Corporation Method of making circuit assembly with hardened direct bond lead frame
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
US4902854A (en) * 1988-04-12 1990-02-20 Kaufman Lance R Hermetic direct bond circuit assembly
US4990720A (en) * 1988-04-12 1991-02-05 Kaufman Lance R Circuit assembly and method with direct bonded terminal pin
US4831723A (en) * 1988-04-12 1989-05-23 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
US5032691A (en) * 1988-04-12 1991-07-16 Kaufman Lance R Electric circuit assembly with voltage isolation
US4879633A (en) * 1988-04-12 1989-11-07 Kaufman Lance R Direct bond circuit assembly with ground plane
US4924292A (en) * 1988-04-12 1990-05-08 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
US5070602A (en) * 1988-04-12 1991-12-10 Lance R. Kaufman Method of making a circuit assembly
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Also Published As

Publication number Publication date
JPS4917381A (ko) 1974-02-15
GB1394322A (en) 1975-05-14
FR2181049A1 (ko) 1973-11-30
DE2319854A1 (de) 1973-10-25
US3766634A (en) 1973-10-23
IT983841B (it) 1974-11-11
JPS5713515B2 (ko) 1982-03-17
DE2319854C2 (de) 1983-12-29

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