US3795049A
(en)
*
|
1972-02-22 |
1974-03-05 |
Trw Inc |
Method of making a printed circuit edge connector
|
GB1431185A
(en)
*
|
1972-10-31 |
1976-04-07 |
Int Computers Ltd |
Electrical connectors and to methods for making electrical connec tors
|
NL152716B
(nl)
*
|
1973-08-08 |
1977-03-15 |
Amp Inc |
Elektrisch verbindingsorgaan voor het losneembaar verbinden van twee ter weerszijden daarvan te plaatsen vaste contactdragers en werkwijze voor het vervaardigen van een dergelijk elektrisch verbindingsorgaan.
|
NL158033B
(nl)
*
|
1974-02-27 |
1978-09-15 |
Amp Inc |
Verbetering van een elektrisch verbindingsorgaan voor het losneembaar verbinden van twee vaste contactdragers en werkwijze voor het vervaardigen van zulk een elektrisch verbindingsorgaan.
|
JPS5519981Y2
(fr)
*
|
1974-03-13 |
1980-05-13 |
|
|
US4142780A
(en)
*
|
1974-03-29 |
1979-03-06 |
Sharp Kabushiki Kaisha |
Exchangeable liquid crystal panel
|
US3916513A
(en)
*
|
1974-05-03 |
1975-11-04 |
Ampex |
Forming interconnections between circuit layers
|
JPS5836513B2
(ja)
*
|
1974-05-10 |
1983-08-09 |
東レ株式会社 |
積層片コネクタ−とその製造方法
|
US4016647A
(en)
*
|
1974-07-22 |
1977-04-12 |
Amp Incorporated |
Method of forming a matrix connector
|
JPS5140095A
(fr)
*
|
1974-09-30 |
1976-04-03 |
Sharp Kk |
|
US4008519A
(en)
*
|
1975-02-11 |
1977-02-22 |
Amp Incorporated |
Elastomeric connector and its method of manufacture
|
US4003621A
(en)
*
|
1975-06-16 |
1977-01-18 |
Technical Wire Products, Inc. |
Electrical connector employing conductive rectilinear elements
|
US4400234A
(en)
*
|
1975-11-13 |
1983-08-23 |
Tektronix, Inc. |
Method of manufacturing electrical connector
|
JPS5265892A
(en)
*
|
1975-11-26 |
1977-05-31 |
Shinetsu Polymer Co |
Nonnisotropic conductiveesheet type composite materials and method of manufacture thereof
|
DE2740195A1
(de)
*
|
1976-09-09 |
1978-03-16 |
Toray Industries |
Anisotrop elektrisch leitfaehiger bogen und verfahren zu dessen herstellung
|
US4067104A
(en)
*
|
1977-02-24 |
1978-01-10 |
Rockwell International Corporation |
Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
|
JPS5915376B2
(ja)
*
|
1977-10-18 |
1984-04-09 |
信越ポリマ−株式会社 |
電子回路部品
|
JPS54158691A
(en)
*
|
1977-10-21 |
1979-12-14 |
Univ Melbourne |
Electrical connector
|
US4257661A
(en)
*
|
1977-10-28 |
1981-03-24 |
Technical Wire Products, Inc. |
Retainer for elastomeric electrical connector
|
US4199209A
(en)
*
|
1978-08-18 |
1980-04-22 |
Amp Incorporated |
Electrical interconnecting device
|
US4344662A
(en)
*
|
1979-04-30 |
1982-08-17 |
Technical Wire Products, Inc. |
Retainer for elastomeric electrical connector
|
JPS568081U
(fr)
*
|
1979-06-29 |
1981-01-23 |
|
|
JPS6038809B2
(ja)
*
|
1979-11-20 |
1985-09-03 |
信越ポリマ−株式会社 |
異方導電性を有するエラスチツク構造体の製造方法
|
JPS5740874A
(en)
*
|
1980-08-22 |
1982-03-06 |
Shinetsu Polymer Co |
Pressure contact holding type connector
|
US4420203A
(en)
*
|
1981-06-04 |
1983-12-13 |
International Business Machines Corporation |
Semiconductor module circuit interconnection system
|
AU553463B2
(en)
*
|
1981-07-06 |
1986-07-17 |
Honeywell Information Systems |
High density connector
|
US4533205A
(en)
*
|
1982-09-30 |
1985-08-06 |
Burndy Corporation |
Collapsible wedge for electrical connector
|
DE3482841D1
(de)
*
|
1983-02-24 |
1990-09-06 |
Westland Group Plc |
Kohlefaserstrukturen.
|
US4518648A
(en)
*
|
1983-03-10 |
1985-05-21 |
Alps Electric Co., Ltd. |
Sheet material and production method thereof
|
US4581679A
(en)
*
|
1983-05-31 |
1986-04-08 |
Trw Inc. |
Multi-element circuit construction
|
GB8330391D0
(en)
*
|
1983-11-15 |
1983-12-21 |
Gen Electric Co Plc |
Electrical interface arrangement
|
GB2153160B
(en)
*
|
1984-01-20 |
1988-03-16 |
Sharp Kk |
Connection between power supply and printed circuit board
|
US4548451A
(en)
*
|
1984-04-27 |
1985-10-22 |
International Business Machines Corporation |
Pinless connector interposer and method for making the same
|
US4593961A
(en)
*
|
1984-12-20 |
1986-06-10 |
Amp Incorporated |
Electrical compression connector
|
US4634199A
(en)
*
|
1985-01-22 |
1987-01-06 |
Itt Corporation |
Connector assembly for making multiple connections in a thin space
|
US5262718A
(en)
*
|
1985-08-05 |
1993-11-16 |
Raychem Limited |
Anisotropically electrically conductive article
|
US5476211A
(en)
*
|
1993-11-16 |
1995-12-19 |
Form Factor, Inc. |
Method of manufacturing electrical contacts, using a sacrificial member
|
US5917707A
(en)
|
1993-11-16 |
1999-06-29 |
Formfactor, Inc. |
Flexible contact structure with an electrically conductive shell
|
US4924353A
(en)
*
|
1985-12-20 |
1990-05-08 |
Hughes Aircraft Company |
Connector system for coupling to an integrated circuit chip
|
US4793814A
(en)
*
|
1986-07-21 |
1988-12-27 |
Rogers Corporation |
Electrical circuit board interconnect
|
US5672062A
(en)
*
|
1991-01-30 |
1997-09-30 |
Labinal Components And Systems, Inc. |
Electrical connectors
|
US4992053A
(en)
*
|
1989-07-05 |
1991-02-12 |
Labinal Components And Systems, Inc. |
Electrical connectors
|
US5597313A
(en)
*
|
1986-06-19 |
1997-01-28 |
Labinal Components And Systems, Inc. |
Electrical connectors
|
US4752231A
(en)
*
|
1986-08-25 |
1988-06-21 |
General Patent Counsel/ Amp Inc. |
Electrical connector for use between spaced apart circuit boards
|
US4814857A
(en)
*
|
1987-02-25 |
1989-03-21 |
International Business Machines Corporation |
Circuit module with separate signal and power connectors
|
US4820376A
(en)
*
|
1987-11-05 |
1989-04-11 |
American Telephone And Telegraph Company At&T Bell Laboratories |
Fabrication of CPI layers
|
US5637925A
(en)
*
|
1988-02-05 |
1997-06-10 |
Raychem Ltd |
Uses of uniaxially electrically conductive articles
|
US4806104A
(en)
*
|
1988-02-09 |
1989-02-21 |
Itt Corporation |
High density connector
|
US4871316A
(en)
*
|
1988-10-17 |
1989-10-03 |
Microelectronics And Computer Technology Corporation |
Printed wire connector
|
US5127837A
(en)
*
|
1989-06-09 |
1992-07-07 |
Labinal Components And Systems, Inc. |
Electrical connectors and IC chip tester embodying same
|
US5485351A
(en)
*
|
1989-06-09 |
1996-01-16 |
Labinal Components And Systems, Inc. |
Socket assembly for integrated circuit chip package
|
US4998886A
(en)
*
|
1989-07-07 |
1991-03-12 |
Teledyne Kinetics |
High density stacking connector
|
US4923404A
(en)
*
|
1989-10-20 |
1990-05-08 |
Amp Incorporated |
Sealed chip carrier
|
US5049084A
(en)
*
|
1989-12-05 |
1991-09-17 |
Rogers Corporation |
Electrical circuit board interconnect
|
US5245751A
(en)
*
|
1990-04-27 |
1993-09-21 |
Circuit Components, Incorporated |
Array connector
|
US5071359A
(en)
*
|
1990-04-27 |
1991-12-10 |
Rogers Corporation |
Array connector
|
US5069627A
(en)
*
|
1990-06-19 |
1991-12-03 |
Amp Incorporated |
Adjustable stacking connector for electrically connecting circuit boards
|
US20010030370A1
(en)
*
|
1990-09-24 |
2001-10-18 |
Khandros Igor Y. |
Microelectronic assembly having encapsulated wire bonding leads
|
US5148265A
(en)
|
1990-09-24 |
1992-09-15 |
Ist Associates, Inc. |
Semiconductor chip assemblies with fan-in leads
|
US5679977A
(en)
*
|
1990-09-24 |
1997-10-21 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
US5148266A
(en)
*
|
1990-09-24 |
1992-09-15 |
Ist Associates, Inc. |
Semiconductor chip assemblies having interposer and flexible lead
|
US5258330A
(en)
*
|
1990-09-24 |
1993-11-02 |
Tessera, Inc. |
Semiconductor chip assemblies with fan-in leads
|
US7198969B1
(en)
*
|
1990-09-24 |
2007-04-03 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
US5388996A
(en)
*
|
1991-01-09 |
1995-02-14 |
Johnson; David A. |
Electrical interconnect contact system
|
US5634801A
(en)
*
|
1991-01-09 |
1997-06-03 |
Johnstech International Corporation |
Electrical interconnect contact system
|
US5367764A
(en)
*
|
1991-12-31 |
1994-11-29 |
Tessera, Inc. |
Method of making a multi-layer circuit assembly
|
US5282312A
(en)
*
|
1991-12-31 |
1994-02-01 |
Tessera, Inc. |
Multi-layer circuit construction methods with customization features
|
US5226823A
(en)
*
|
1992-01-09 |
1993-07-13 |
Teledyne Kinectics |
Indexing mechanism for precision alignment of electrical contacts
|
US5268815A
(en)
*
|
1992-02-14 |
1993-12-07 |
International Business Machines Corporation |
High density, high performance memory circuit package
|
US5299939A
(en)
*
|
1992-03-05 |
1994-04-05 |
International Business Machines Corporation |
Spring array connector
|
US5415559A
(en)
*
|
1992-05-18 |
1995-05-16 |
Japan Aviation Electronics Industry, Ltd. |
Electrical connector having a plurality of contact pin springs
|
US5259767A
(en)
*
|
1992-07-10 |
1993-11-09 |
Teledyne Kinetics |
Connector for a plated or soldered hole
|
JP2545675B2
(ja)
*
|
1992-07-17 |
1996-10-23 |
信越ポリマー株式会社 |
エラスチックコネクタの製造方法
|
US5371654A
(en)
*
|
1992-10-19 |
1994-12-06 |
International Business Machines Corporation |
Three dimensional high performance interconnection package
|
US20050062492A1
(en)
*
|
2001-08-03 |
2005-03-24 |
Beaman Brian Samuel |
High density integrated circuit apparatus, test probe and methods of use thereof
|
US5386344A
(en)
*
|
1993-01-26 |
1995-01-31 |
International Business Machines Corporation |
Flex circuit card elastomeric cable connector assembly
|
US5810607A
(en)
*
|
1995-09-13 |
1998-09-22 |
International Business Machines Corporation |
Interconnector with contact pads having enhanced durability
|
US20030048108A1
(en)
*
|
1993-04-30 |
2003-03-13 |
Beaman Brian Samuel |
Structural design and processes to control probe position accuracy in a wafer test probe assembly
|
US5811982A
(en)
*
|
1995-11-27 |
1998-09-22 |
International Business Machines Corporation |
High density cantilevered probe for electronic devices
|
US5474458A
(en)
*
|
1993-07-13 |
1995-12-12 |
Fujitsu Limited |
Interconnect carriers having high-density vertical connectors and methods for making the same
|
US5378160A
(en)
*
|
1993-10-01 |
1995-01-03 |
Bourns, Inc. |
Compliant stacking connector for printed circuit boards
|
US7084656B1
(en)
|
1993-11-16 |
2006-08-01 |
Formfactor, Inc. |
Probe for semiconductor devices
|
US7200930B2
(en)
*
|
1994-11-15 |
2007-04-10 |
Formfactor, Inc. |
Probe for semiconductor devices
|
US20030199179A1
(en)
*
|
1993-11-16 |
2003-10-23 |
Formfactor, Inc. |
Contact tip structure for microelectronic interconnection elements and method of making same
|
US20020053734A1
(en)
|
1993-11-16 |
2002-05-09 |
Formfactor, Inc. |
Probe card assembly and kit, and methods of making same
|
US5820014A
(en)
*
|
1993-11-16 |
1998-10-13 |
Form Factor, Inc. |
Solder preforms
|
US7073254B2
(en)
|
1993-11-16 |
2006-07-11 |
Formfactor, Inc. |
Method for mounting a plurality of spring contact elements
|
US5455390A
(en)
*
|
1994-02-01 |
1995-10-03 |
Tessera, Inc. |
Microelectronics unit mounting with multiple lead bonding
|
TW381328B
(en)
*
|
1994-03-07 |
2000-02-01 |
Ibm |
Dual substrate package assembly for being electrically coupled to a conducting member
|
JP3578232B2
(ja)
*
|
1994-04-07 |
2004-10-20 |
インターナショナル・ビジネス・マシーンズ・コーポレーション |
電気接点形成方法、該電気接点を含むプローブ構造および装置
|
US6361959B1
(en)
|
1994-07-07 |
2002-03-26 |
Tessera, Inc. |
Microelectronic unit forming methods and materials
|
US6848173B2
(en)
*
|
1994-07-07 |
2005-02-01 |
Tessera, Inc. |
Microelectric packages having deformed bonded leads and methods therefor
|
US5688716A
(en)
|
1994-07-07 |
1997-11-18 |
Tessera, Inc. |
Fan-out semiconductor chip assembly
|
US6828668B2
(en)
*
|
1994-07-07 |
2004-12-07 |
Tessera, Inc. |
Flexible lead structures and methods of making same
|
US5518964A
(en)
*
|
1994-07-07 |
1996-05-21 |
Tessera, Inc. |
Microelectronic mounting with multiple lead deformation and bonding
|
US5830782A
(en)
*
|
1994-07-07 |
1998-11-03 |
Tessera, Inc. |
Microelectronic element bonding with deformation of leads in rows
|
US6429112B1
(en)
*
|
1994-07-07 |
2002-08-06 |
Tessera, Inc. |
Multi-layer substrates and fabrication processes
|
US6117694A
(en)
*
|
1994-07-07 |
2000-09-12 |
Tessera, Inc. |
Flexible lead structures and methods of making same
|
US5798286A
(en)
*
|
1995-09-22 |
1998-08-25 |
Tessera, Inc. |
Connecting multiple microelectronic elements with lead deformation
|
US5590460A
(en)
*
|
1994-07-19 |
1997-01-07 |
Tessera, Inc. |
Method of making multilayer circuit
|
US5915170A
(en)
*
|
1994-09-20 |
1999-06-22 |
Tessera, Inc. |
Multiple part compliant interface for packaging of a semiconductor chip and method therefor
|
KR20030096425A
(ko)
*
|
1994-11-15 |
2003-12-31 |
폼팩터, 인크. |
인터포저
|
US7276919B1
(en)
*
|
1995-04-20 |
2007-10-02 |
International Business Machines Corporation |
High density integral test probe
|
US20100065963A1
(en)
*
|
1995-05-26 |
2010-03-18 |
Formfactor, Inc. |
Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
|
US5785538A
(en)
*
|
1995-11-27 |
1998-07-28 |
International Business Machines Corporation |
High density test probe with rigid surface structure
|
US5994152A
(en)
*
|
1996-02-21 |
1999-11-30 |
Formfactor, Inc. |
Fabricating interconnects and tips using sacrificial substrates
|
US8033838B2
(en)
|
1996-02-21 |
2011-10-11 |
Formfactor, Inc. |
Microelectronic contact structure
|
US6403226B1
(en)
|
1996-05-17 |
2002-06-11 |
3M Innovative Properties Company |
Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
|
US5890915A
(en)
*
|
1996-05-17 |
1999-04-06 |
Minnesota Mining And Manufacturing Company |
Electrical and thermal conducting structure with resilient conducting paths
|
US6030856A
(en)
*
|
1996-06-10 |
2000-02-29 |
Tessera, Inc. |
Bondable compliant pads for packaging of a semiconductor chip and method therefor
|
US6247228B1
(en)
|
1996-08-12 |
2001-06-19 |
Tessera, Inc. |
Electrical connection with inwardly deformable contacts
|
US5859472A
(en)
*
|
1996-09-12 |
1999-01-12 |
Tessera, Inc. |
Curved lead configurations
|
US7282945B1
(en)
*
|
1996-09-13 |
2007-10-16 |
International Business Machines Corporation |
Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
|
US6686015B2
(en)
|
1996-12-13 |
2004-02-03 |
Tessera, Inc. |
Transferable resilient element for packaging of a semiconductor chip and method therefor
|
US6820330B1
(en)
|
1996-12-13 |
2004-11-23 |
Tessera, Inc. |
Method for forming a multi-layer circuit assembly
|
US5937276A
(en)
*
|
1996-12-13 |
1999-08-10 |
Tessera, Inc. |
Bonding lead structure with enhanced encapsulation
|
US6133072A
(en)
*
|
1996-12-13 |
2000-10-17 |
Tessera, Inc. |
Microelectronic connector with planar elastomer sockets
|
US6525551B1
(en)
*
|
1997-05-22 |
2003-02-25 |
International Business Machines Corporation |
Probe structures for testing electrical interconnections to integrated circuit electronic devices
|
US6188028B1
(en)
|
1997-06-09 |
2001-02-13 |
Tessera, Inc. |
Multilayer structure with interlocking protrusions
|
US6028498A
(en)
*
|
1997-09-05 |
2000-02-22 |
Hewlett-Packard Company |
Low inductance interconnect having a comb-like resilient structure
|
JP3063839B2
(ja)
*
|
1997-11-18 |
2000-07-12 |
日本電気株式会社 |
実装部品の実装構造および実装方法
|
US6703640B1
(en)
|
1998-01-20 |
2004-03-09 |
Micron Technology, Inc. |
Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching
|
US6456100B1
(en)
*
|
1998-01-20 |
2002-09-24 |
Micron Technology, Inc. |
Apparatus for attaching to a semiconductor
|
US6078500A
(en)
*
|
1998-05-12 |
2000-06-20 |
International Business Machines Inc. |
Pluggable chip scale package
|
DE19856083A1
(de)
*
|
1998-12-04 |
2000-06-21 |
Siemens Ag |
Verbindungsanordnung
|
JP3328596B2
(ja)
|
1999-01-22 |
2002-09-24 |
信越ポリマー株式会社 |
圧接型コネクタ及びその製造方法
|
US6434817B1
(en)
|
1999-12-03 |
2002-08-20 |
Delphi Technologies, Inc. |
Method for joining an integrated circuit
|
US6444921B1
(en)
|
2000-02-03 |
2002-09-03 |
Fujitsu Limited |
Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like
|
JP2001236073A
(ja)
*
|
2000-02-23 |
2001-08-31 |
Citizen Electronics Co Ltd |
接点バネを有する発音体
|
US7262611B2
(en)
*
|
2000-03-17 |
2007-08-28 |
Formfactor, Inc. |
Apparatuses and methods for planarizing a semiconductor contactor
|
US6426638B1
(en)
*
|
2000-05-02 |
2002-07-30 |
Decision Track Llc |
Compliant probe apparatus
|
US7254889B1
(en)
*
|
2000-09-08 |
2007-08-14 |
Gabe Cherian |
Interconnection devices
|
US6846115B1
(en)
*
|
2001-01-29 |
2005-01-25 |
Jds Uniphase Corporation |
Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor
|
US6604950B2
(en)
|
2001-04-26 |
2003-08-12 |
Teledyne Technologies Incorporated |
Low pitch, high density connector
|
US6586684B2
(en)
*
|
2001-06-29 |
2003-07-01 |
Intel Corporation |
Circuit housing clamp and method of manufacture therefor
|
US6729019B2
(en)
*
|
2001-07-11 |
2004-05-04 |
Formfactor, Inc. |
Method of manufacturing a probe card
|
JP4139385B2
(ja)
*
|
2002-05-28 |
2008-08-27 |
モレックス インコーポレーテッド |
コネクタ搬送組立体
|
US20040105244A1
(en)
*
|
2002-08-06 |
2004-06-03 |
Ilyas Mohammed |
Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
|
DE10324450A1
(de)
*
|
2003-05-28 |
2005-01-05 |
Infineon Technologies Ag |
Kontaktierungsvorrichtung für elektronische Schaltungseinheiten und Herstellungsverfahren
|
US6945791B2
(en)
*
|
2004-02-10 |
2005-09-20 |
International Business Machines Corporation |
Integrated circuit redistribution package
|
JP5592055B2
(ja)
*
|
2004-11-03 |
2014-09-17 |
テッセラ,インコーポレイテッド |
積層パッケージングの改良
|
DE102004061853A1
(de)
*
|
2004-12-22 |
2006-03-02 |
Infineon Technologies Ag |
Trägervorrichtung zum Aufnehmen von Halbleiterbauelementen und Verfahren zur Herstellung einer entsprechenden Trägervorrichtung
|
US20070040565A1
(en)
*
|
2005-08-19 |
2007-02-22 |
National University of Singapore, Agency For Science, Technology and Research |
Compliant probes and test methodology for fine pitch wafer level devices and interconnects
|
US20070075717A1
(en)
*
|
2005-09-14 |
2007-04-05 |
Touchdown Technologies, Inc. |
Lateral interposer contact design and probe card assembly
|
US8058101B2
(en)
|
2005-12-23 |
2011-11-15 |
Tessera, Inc. |
Microelectronic packages and methods therefor
|
FR2896914B1
(fr)
*
|
2006-01-30 |
2008-07-04 |
Valeo Electronique Sys Liaison |
Module electronique et procede d'assemblage d'un tel module
|
ITMI20060478A1
(it)
*
|
2006-03-16 |
2007-09-17 |
Eles Semiconductor Equipment Spa |
Sistema per contattare dispositivim elettronici e relativo metodo di produzione basato su filo conduttore annegato in materiale isolante
|
FR2917236B1
(fr)
*
|
2007-06-07 |
2009-10-23 |
Commissariat Energie Atomique |
Procede de realisation de via dans un substrat reconstitue.
|
US7982305B1
(en)
|
2008-10-20 |
2011-07-19 |
Maxim Integrated Products, Inc. |
Integrated circuit package including a three-dimensional fan-out / fan-in signal routing
|
CN101826467B
(zh)
*
|
2009-03-02 |
2012-01-25 |
清华大学 |
热界面材料的制备方法
|
JP2010251319A
(ja)
|
2009-04-15 |
2010-11-04 |
Chou Hsien Tsai |
双方向電気的連接が可能なソケット構造
|
US8519527B2
(en)
*
|
2009-09-29 |
2013-08-27 |
Bae Systems Information And Electronic Systems Integration Inc. |
Isostress grid array and method of fabrication thereof
|
US8407888B2
(en)
*
|
2010-05-07 |
2013-04-02 |
Oracle International Corporation |
Method of assembling a circuit board assembly
|
CN103081252B
(zh)
|
2010-05-28 |
2016-04-13 |
苹果公司 |
D形连接器
|
CN103140995B
(zh)
|
2010-05-28 |
2016-03-30 |
苹果公司 |
具有外部接触点的双定向连接器
|
CN102934296B
(zh)
|
2010-06-09 |
2015-06-24 |
苹果公司 |
柔性trs连接器
|
CN103069654A
(zh)
*
|
2010-06-18 |
2013-04-24 |
苹果公司 |
具有侧面接触点的双向连接器
|
US8911260B2
(en)
|
2010-06-21 |
2014-12-16 |
Apple Inc. |
External contact plug connector
|
TWI492463B
(zh)
|
2010-06-21 |
2015-07-11 |
Apple Inc |
外部接觸插頭連接器
|
US9159708B2
(en)
|
2010-07-19 |
2015-10-13 |
Tessera, Inc. |
Stackable molded microelectronic packages with area array unit connectors
|
US8482111B2
(en)
|
2010-07-19 |
2013-07-09 |
Tessera, Inc. |
Stackable molded microelectronic packages
|
KR101075241B1
(ko)
|
2010-11-15 |
2011-11-01 |
테세라, 인코포레이티드 |
유전체 부재에 단자를 구비하는 마이크로전자 패키지
|
US20120146206A1
(en)
|
2010-12-13 |
2012-06-14 |
Tessera Research Llc |
Pin attachment
|
US8618659B2
(en)
|
2011-05-03 |
2013-12-31 |
Tessera, Inc. |
Package-on-package assembly with wire bonds to encapsulation surface
|
KR101128063B1
(ko)
|
2011-05-03 |
2012-04-23 |
테세라, 인코포레이티드 |
캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
|
US8836136B2
(en)
|
2011-10-17 |
2014-09-16 |
Invensas Corporation |
Package-on-package assembly with wire bond vias
|
US8708745B2
(en)
|
2011-11-07 |
2014-04-29 |
Apple Inc. |
Dual orientation electronic connector
|
US9112327B2
(en)
|
2011-11-30 |
2015-08-18 |
Apple Inc. |
Audio/video connector for an electronic device
|
US8946757B2
(en)
|
2012-02-17 |
2015-02-03 |
Invensas Corporation |
Heat spreading substrate with embedded interconnects
|
US8372741B1
(en)
|
2012-02-24 |
2013-02-12 |
Invensas Corporation |
Method for package-on-package assembly with wire bonds to encapsulation surface
|
US9349706B2
(en)
|
2012-02-24 |
2016-05-24 |
Invensas Corporation |
Method for package-on-package assembly with wire bonds to encapsulation surface
|
US8835228B2
(en)
|
2012-05-22 |
2014-09-16 |
Invensas Corporation |
Substrate-less stackable package with wire-bond interconnect
|
US9391008B2
(en)
|
2012-07-31 |
2016-07-12 |
Invensas Corporation |
Reconstituted wafer-level package DRAM
|
US9502390B2
(en)
|
2012-08-03 |
2016-11-22 |
Invensas Corporation |
BVA interposer
|
US9093803B2
(en)
|
2012-09-07 |
2015-07-28 |
Apple Inc. |
Plug connector
|
US8777666B2
(en)
|
2012-09-07 |
2014-07-15 |
Apple Inc. |
Plug connector modules
|
US9160129B2
(en)
*
|
2012-09-11 |
2015-10-13 |
Apple Inc. |
Connectors and methods for manufacturing connectors
|
WO2014040231A1
(fr)
|
2012-09-11 |
2014-03-20 |
Apple Inc. |
Connecteurs et procédés pour fabriquer des connecteurs
|
US9059531B2
(en)
|
2012-09-11 |
2015-06-16 |
Apple Inc. |
Connectors and methods for manufacturing connectors
|
US8975738B2
(en)
|
2012-11-12 |
2015-03-10 |
Invensas Corporation |
Structure for microelectronic packaging with terminals on dielectric mass
|
US9325097B2
(en)
|
2012-11-16 |
2016-04-26 |
Apple Inc. |
Connector contacts with thermally conductive polymer
|
US8878353B2
(en)
|
2012-12-20 |
2014-11-04 |
Invensas Corporation |
Structure for microelectronic packaging with bond elements to encapsulation surface
|
US20140206209A1
(en)
|
2013-01-24 |
2014-07-24 |
Apple Inc. |
Reversible usb connector
|
US9136254B2
(en)
|
2013-02-01 |
2015-09-15 |
Invensas Corporation |
Microelectronic package having wire bond vias and stiffening layer
|
US8883563B1
(en)
|
2013-07-15 |
2014-11-11 |
Invensas Corporation |
Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
|
US9034696B2
(en)
|
2013-07-15 |
2015-05-19 |
Invensas Corporation |
Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
|
US9023691B2
(en)
|
2013-07-15 |
2015-05-05 |
Invensas Corporation |
Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
|
US9167710B2
(en)
|
2013-08-07 |
2015-10-20 |
Invensas Corporation |
Embedded packaging with preformed vias
|
US9685365B2
(en)
|
2013-08-08 |
2017-06-20 |
Invensas Corporation |
Method of forming a wire bond having a free end
|
US20150076714A1
(en)
|
2013-09-16 |
2015-03-19 |
Invensas Corporation |
Microelectronic element with bond elements to encapsulation surface
|
US9082753B2
(en)
|
2013-11-12 |
2015-07-14 |
Invensas Corporation |
Severing bond wire by kinking and twisting
|
US9087815B2
(en)
|
2013-11-12 |
2015-07-21 |
Invensas Corporation |
Off substrate kinking of bond wire
|
US9263394B2
(en)
|
2013-11-22 |
2016-02-16 |
Invensas Corporation |
Multiple bond via arrays of different wire heights on a same substrate
|
US9583456B2
(en)
|
2013-11-22 |
2017-02-28 |
Invensas Corporation |
Multiple bond via arrays of different wire heights on a same substrate
|
US9379074B2
(en)
|
2013-11-22 |
2016-06-28 |
Invensas Corporation |
Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
|
US9583411B2
(en)
|
2014-01-17 |
2017-02-28 |
Invensas Corporation |
Fine pitch BVA using reconstituted wafer with area array accessible for testing
|
US9484699B2
(en)
*
|
2014-03-13 |
2016-11-01 |
Apple Inc. |
Elastomeric connectors
|
US9214454B2
(en)
|
2014-03-31 |
2015-12-15 |
Invensas Corporation |
Batch process fabrication of package-on-package microelectronic assemblies
|
JP2015207433A
(ja)
*
|
2014-04-18 |
2015-11-19 |
矢崎総業株式会社 |
導電性弾性部材及びコネクタ
|
US10381326B2
(en)
|
2014-05-28 |
2019-08-13 |
Invensas Corporation |
Structure and method for integrated circuits packaging with increased density
|
US9646917B2
(en)
|
2014-05-29 |
2017-05-09 |
Invensas Corporation |
Low CTE component with wire bond interconnects
|
US9412714B2
(en)
|
2014-05-30 |
2016-08-09 |
Invensas Corporation |
Wire bond support structure and microelectronic package including wire bonds therefrom
|
US9735084B2
(en)
|
2014-12-11 |
2017-08-15 |
Invensas Corporation |
Bond via array for thermal conductivity
|
US9888579B2
(en)
|
2015-03-05 |
2018-02-06 |
Invensas Corporation |
Pressing of wire bond wire tips to provide bent-over tips
|
US9502372B1
(en)
|
2015-04-30 |
2016-11-22 |
Invensas Corporation |
Wafer-level packaging using wire bond wires in place of a redistribution layer
|
US9761554B2
(en)
|
2015-05-07 |
2017-09-12 |
Invensas Corporation |
Ball bonding metal wire bond wires to metal pads
|
US9490222B1
(en)
|
2015-10-12 |
2016-11-08 |
Invensas Corporation |
Wire bond wires for interference shielding
|
US10490528B2
(en)
|
2015-10-12 |
2019-11-26 |
Invensas Corporation |
Embedded wire bond wires
|
US10332854B2
(en)
|
2015-10-23 |
2019-06-25 |
Invensas Corporation |
Anchoring structure of fine pitch bva
|
US10181457B2
(en)
|
2015-10-26 |
2019-01-15 |
Invensas Corporation |
Microelectronic package for wafer-level chip scale packaging with fan-out
|
US10043779B2
(en)
|
2015-11-17 |
2018-08-07 |
Invensas Corporation |
Packaged microelectronic device for a package-on-package device
|
US9659848B1
(en)
|
2015-11-18 |
2017-05-23 |
Invensas Corporation |
Stiffened wires for offset BVA
|
US9984992B2
(en)
|
2015-12-30 |
2018-05-29 |
Invensas Corporation |
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
|
US10392033B2
(en)
*
|
2016-07-12 |
2019-08-27 |
Amsted Rail Company, Inc. |
Railway truck with improved bearing adapter
|
US9935075B2
(en)
|
2016-07-29 |
2018-04-03 |
Invensas Corporation |
Wire bonding method and apparatus for electromagnetic interference shielding
|
US10299368B2
(en)
|
2016-12-21 |
2019-05-21 |
Invensas Corporation |
Surface integrated waveguides and circuit structures therefor
|
WO2018182719A1
(fr)
*
|
2017-03-31 |
2018-10-04 |
Intel Corporation |
Transformateur spatial à très faible coût, à faible délai de mise en œuvre et à haute densité pour des applications du type à petit pas
|
WO2018212277A1
(fr)
*
|
2017-05-18 |
2018-11-22 |
信越ポリマー株式会社 |
Connecteur électrique et son procédé de production
|
US10600739B1
(en)
*
|
2017-09-28 |
2020-03-24 |
Hrl Laboratories, Llc |
Interposer with interconnects and methods of manufacturing the same
|
CN113453418A
(zh)
*
|
2021-06-28 |
2021-09-28 |
浙江挚领科技有限公司 |
导热装置及其制造方法
|