FR1549386A - - Google Patents
Info
- Publication number
- FR1549386A FR1549386A FR1549386DA FR1549386A FR 1549386 A FR1549386 A FR 1549386A FR 1549386D A FR1549386D A FR 1549386DA FR 1549386 A FR1549386 A FR 1549386A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
- H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0635—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors and diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL666614016A NL153374B (nl) | 1966-10-05 | 1966-10-05 | Werkwijze ter vervaardiging van een halfgeleiderinrichting voorzien van een oxydelaag en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1549386A true FR1549386A (fr) | 1968-12-13 |
Family
ID=19797850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1549386D Expired FR1549386A (fr) | 1966-10-05 | 1967-10-05 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US3970486A (fr) |
| JP (8) | JPS5631893B1 (fr) |
| AT (1) | AT280349B (fr) |
| BE (1) | BE704674A (fr) |
| CH (1) | CH469358A (fr) |
| DE (1) | DE1614283C3 (fr) |
| DK (1) | DK121913B (fr) |
| ES (1) | ES345702A1 (fr) |
| FR (1) | FR1549386A (fr) |
| GB (1) | GB1208574A (fr) |
| NL (1) | NL153374B (fr) |
| NO (1) | NO125653B (fr) |
| SE (1) | SE335177B (fr) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2058385A1 (en) * | 1969-08-20 | 1971-05-28 | Ibm | Diode with schottky barrier |
| FR2080769A1 (fr) * | 1970-02-26 | 1971-11-19 | North American Rockwell | |
| FR2095258A1 (fr) * | 1970-06-15 | 1972-02-11 | Hitachi Ltd | |
| FR2098319A1 (fr) * | 1970-07-10 | 1972-03-10 | Philips Nv | |
| FR2098325A1 (fr) * | 1970-07-10 | 1972-03-10 | Philips Nv | |
| FR2124295A1 (fr) * | 1971-02-02 | 1972-09-22 | Fairchild Camera Instr Co | |
| JPS498183A (fr) * | 1972-05-10 | 1974-01-24 | ||
| FR2191270A1 (fr) * | 1972-06-30 | 1974-02-01 | Ibm | |
| JPS4960684A (fr) * | 1972-10-12 | 1974-06-12 | ||
| JPS5031804A (fr) * | 1973-07-19 | 1975-03-28 | ||
| JPS514756B1 (fr) * | 1970-10-05 | 1976-02-14 | ||
| JPS52109882A (en) * | 1976-07-31 | 1977-09-14 | Tdk Corp | Manufacture for semiconductor device |
| FR2449332A1 (fr) * | 1979-02-13 | 1980-09-12 | Itt | Methode de protection de zones de contact sur des dispositifs a semi-conducteurs |
| FR2485261A1 (fr) * | 1980-06-18 | 1981-12-24 | Philips Nv | Fabrication mos auto-alignee |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6979877B1 (en) | 1965-09-28 | 2005-12-27 | Li Chou H | Solid-state device |
| US7038290B1 (en) | 1965-09-28 | 2006-05-02 | Li Chou H | Integrated circuit device |
| US6849918B1 (en) * | 1965-09-28 | 2005-02-01 | Chou H. Li | Miniaturized dielectrically isolated solid state device |
| US5696402A (en) * | 1965-09-28 | 1997-12-09 | Li; Chou H. | Integrated circuit device |
| NL7010208A (fr) * | 1966-10-05 | 1972-01-12 | Philips Nv | |
| NL159817B (nl) * | 1966-10-05 | 1979-03-15 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
| USRE31580E (en) * | 1967-06-08 | 1984-05-01 | U.S. Philips Corporation | Insulated gate field-effect transistor comprising a mesa channel and a thicker surrounding oxide |
| USRE28653E (en) * | 1968-04-23 | 1975-12-16 | Method of fabricating semiconductor devices | |
| BE753245A (fr) * | 1969-08-04 | 1970-12-16 | Rca Corp | Procede pour la fabrication de dispositifs semiconducteurs |
| DE1952636C3 (de) * | 1969-10-18 | 1981-04-30 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen einer Halbleiteranordnung mit einem Schottky-Kontakt |
| GB1332931A (en) * | 1970-01-15 | 1973-10-10 | Mullard Ltd | Methods of manufacturing a semiconductor device |
| FR2188304B1 (fr) * | 1972-06-15 | 1977-07-22 | Commissariat Energie Atomique | |
| JPS5159853U (fr) * | 1974-11-06 | 1976-05-11 | ||
| EP0002107A3 (fr) * | 1977-11-17 | 1979-09-05 | Rca Corporation | Procédé pour la fabrication d'un dispositif à semiconducteur planaire |
| US4441941A (en) * | 1980-03-06 | 1984-04-10 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a semiconductor device employing element isolation using insulating materials |
| US4274909A (en) * | 1980-03-17 | 1981-06-23 | International Business Machines Corporation | Method for forming ultra fine deep dielectric isolation |
| US4506435A (en) * | 1981-07-27 | 1985-03-26 | International Business Machines Corporation | Method for forming recessed isolated regions |
| US4454646A (en) * | 1981-08-27 | 1984-06-19 | International Business Machines Corporation | Isolation for high density integrated circuits |
| US4454647A (en) * | 1981-08-27 | 1984-06-19 | International Business Machines Corporation | Isolation for high density integrated circuits |
| JPS5873163A (ja) * | 1981-10-27 | 1983-05-02 | Toshiba Corp | Ｍｏｓ型半導体装置 |
| US4508757A (en) * | 1982-12-20 | 1985-04-02 | International Business Machines Corporation | Method of manufacturing a minimum bird's beak recessed oxide isolation structure |
| GB2151844A (en) * | 1983-12-20 | 1985-07-24 | Philips Electronic Associated | Semiconductor devices |
| JPS60115416U (ja) * | 1984-01-12 | 1985-08-05 | 三菱電機株式会社 | フラツトキ−型操作ボ−ド |
| JPS6133323U (ja) * | 1984-07-31 | 1986-02-28 | 武夫 大坪 | キ−ボ−ド表示板 |
| JPS61126696U (fr) * | 1985-01-28 | 1986-08-08 | ||
| US4630356A (en) * | 1985-09-19 | 1986-12-23 | International Business Machines Corporation | Method of forming recessed oxide isolation with reduced steepness of the birds' neck |
| US5019526A (en) * | 1988-09-26 | 1991-05-28 | Nippondenso Co., Ltd. | Method of manufacturing a semiconductor device having a plurality of elements |
| US5077235A (en) * | 1989-01-24 | 1991-12-31 | Ricoh Comany, Ltd. | Method of manufacturing a semiconductor integrated circuit device having SOI structure |
| US4968641A (en) * | 1989-06-22 | 1990-11-06 | Alexander Kalnitsky | Method for formation of an isolating oxide layer |
| US4987099A (en) * | 1989-12-29 | 1991-01-22 | North American Philips Corp. | Method for selectively filling contacts or vias or various depths with CVD tungsten |
| JP3111500B2 (ja) * | 1991-05-09 | 2000-11-20 | 富士電機株式会社 | 誘電体分離ウエハの製造方法 |
| JPH05283710A (ja) * | 1991-12-06 | 1993-10-29 | Intel Corp | 高電圧ｍｏｓトランジスタ及びその製造方法 |
| US5418176A (en) * | 1994-02-17 | 1995-05-23 | United Microelectronics Corporation | Process for producing memory devices having narrow buried N+ lines |
| US5661053A (en) * | 1994-05-25 | 1997-08-26 | Sandisk Corporation | Method of making dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field oxide with the use of spacers |
| US5756385A (en) * | 1994-03-30 | 1998-05-26 | Sandisk Corporation | Dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field oxide with the use of spacers |
| US5814875A (en) * | 1995-01-31 | 1998-09-29 | Nippon Steel Corporation | Semiconductor device and method of manufacturing the same apparatus and method for providing semiconductor devices having a field shield element between devices |
| US20040144999A1 (en) * | 1995-06-07 | 2004-07-29 | Li Chou H. | Integrated circuit device |
| US5747357A (en) * | 1995-09-27 | 1998-05-05 | Mosel Vitelic, Inc. | Modified poly-buffered isolation |
| US5883566A (en) * | 1997-02-24 | 1999-03-16 | International Business Machines Corporation | Noise-isolated buried resistor |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2981877A (en) * | 1959-07-30 | 1961-04-25 | Fairchild Semiconductor | Semiconductor device-and-lead structure |
| US3212162A (en) * | 1962-01-05 | 1965-10-19 | Fairchild Camera Instr Co | Fabricating semiconductor devices |
| US3165430A (en) * | 1963-01-21 | 1965-01-12 | Siliconix Inc | Method of ultra-fine semiconductor manufacture |
| US3279963A (en) * | 1963-07-23 | 1966-10-18 | Ibm | Fabrication of semiconductor devices |
| DE1439737B2 (de) * | 1964-10-31 | 1970-05-06 | Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm | Verfahren zum Herstellen einer Halblei teranordnung |
| US3484313A (en) * | 1965-03-25 | 1969-12-16 | Hitachi Ltd | Method of manufacturing semiconductor devices |
| US3442011A (en) * | 1965-06-30 | 1969-05-06 | Texas Instruments Inc | Method for isolating individual devices in an integrated circuit monolithic bar |
| US3479237A (en) * | 1966-04-08 | 1969-11-18 | Bell Telephone Labor Inc | Etch masks on semiconductor surfaces |
| US3649386A (en) * | 1968-04-23 | 1972-03-14 | Bell Telephone Labor Inc | Method of fabricating semiconductor devices |
| US3550292A (en) * | 1968-08-23 | 1970-12-29 | Nippon Electric Co | Semiconductor device and method of manufacturing the same |
| JPS4917069A (fr) * | 1972-06-10 | 1974-02-15 | ||
| JPS5232803B2 (fr) * | 1972-08-15 | 1977-08-24 |
-
1966
- 1966-10-05 NL NL666614016A patent/NL153374B/xx not_active IP Right Cessation
-
1967
- 1967-09-29 DE DE1614283A patent/DE1614283C3/de not_active Expired
- 1967-10-02 NO NO169941A patent/NO125653B/no unknown
- 1967-10-02 CH CH1372567A patent/CH469358A/de unknown
- 1967-10-02 GB GB44763/67A patent/GB1208574A/en not_active Expired
- 1967-10-02 DK DK488667AA patent/DK121913B/da not_active IP Right Cessation
- 1967-10-03 AT AT895167A patent/AT280349B/de not_active IP Right Cessation
- 1967-10-04 SE SE13610/67A patent/SE335177B/xx unknown
- 1967-10-04 BE BE704674D patent/BE704674A/xx not_active IP Right Cessation
- 1967-10-05 JP JP6388367A patent/JPS5631893B1/ja active Pending
- 1967-10-05 FR FR1549386D patent/FR1549386A/fr not_active Expired
- 1967-10-30 ES ES345702A patent/ES345702A1/es not_active Expired
-
1972
- 1972-10-19 JP JP47104047A patent/JPS4939308B1/ja active Pending
- 1972-10-19 JP JP47104048A patent/JPS4939309B1/ja active Pending
-
1973
- 1973-05-10 JP JP48051237A patent/JPS4923071B1/ja active Pending
-
1974
- 1974-08-06 JP JP8957074A patent/JPS5434596B1/ja active Pending
-
1975
- 1975-02-14 US US05/549,936 patent/US3970486A/en not_active Expired - Lifetime
- 1975-04-18 JP JP50046613A patent/JPS5134274B1/ja active Pending
- 1975-06-06 JP JP50067701A patent/JPS5838937B1/ja active Pending
-
1977
- 1977-09-19 JP JP11170477A patent/JPS5435071B1/ja active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2058385A1 (en) * | 1969-08-20 | 1971-05-28 | Ibm | Diode with schottky barrier |
| FR2080769A1 (fr) * | 1970-02-26 | 1971-11-19 | North American Rockwell | |
| FR2095258A1 (fr) * | 1970-06-15 | 1972-02-11 | Hitachi Ltd | |
| FR2098319A1 (fr) * | 1970-07-10 | 1972-03-10 | Philips Nv | |
| FR2098325A1 (fr) * | 1970-07-10 | 1972-03-10 | Philips Nv | |
| JPS514756B1 (fr) * | 1970-10-05 | 1976-02-14 | ||
| FR2124295A1 (fr) * | 1971-02-02 | 1972-09-22 | Fairchild Camera Instr Co | |
| US6093620A (en) * | 1971-02-02 | 2000-07-25 | National Semiconductor Corporation | Method of fabricating integrated circuits with oxidized isolation |
| JPS498183A (fr) * | 1972-05-10 | 1974-01-24 | ||
| FR2191270A1 (fr) * | 1972-06-30 | 1974-02-01 | Ibm | |
| JPS4960684A (fr) * | 1972-10-12 | 1974-06-12 | ||
| JPS5617734B2 (fr) * | 1973-07-19 | 1981-04-24 | ||
| JPS5031804A (fr) * | 1973-07-19 | 1975-03-28 | ||
| JPS52109882A (en) * | 1976-07-31 | 1977-09-14 | Tdk Corp | Manufacture for semiconductor device |
| JPS5938741B2 (ja) * | 1976-07-31 | 1984-09-19 | ティーディーケイ株式会社 | 半導体装置およびその作製方法 |
| FR2449332A1 (fr) * | 1979-02-13 | 1980-09-12 | Itt | Methode de protection de zones de contact sur des dispositifs a semi-conducteurs |
| FR2485261A1 (fr) * | 1980-06-18 | 1981-12-24 | Philips Nv | Fabrication mos auto-alignee |
Also Published As
| Publication number | Publication date |
|---|---|
| ES345702A1 (es) | 1969-02-01 |
| JPS4939308B1 (fr) | 1974-10-24 |
| JPS4923071B1 (fr) | 1974-06-13 |
| NL6614016A (fr) | 1968-04-08 |
| US3970486A (en) | 1976-07-20 |
| JPS5434596B1 (fr) | 1979-10-27 |
| JPS5435071B1 (fr) | 1979-10-31 |
| NL153374B (nl) | 1977-05-16 |
| DK121913B (da) | 1971-12-20 |
| JPS5838937B1 (fr) | 1983-08-26 |
| NO125653B (fr) | 1972-10-09 |
| JPS4939309B1 (fr) | 1974-10-24 |
| JPS5631893B1 (fr) | 1981-07-24 |
| JPS5134274B1 (fr) | 1976-09-25 |
| DE1614283A1 (de) | 1970-05-27 |
| DE1614283C3 (de) | 1983-03-10 |
| SE335177B (fr) | 1971-05-17 |
| DE1614283B2 (de) | 1975-06-05 |
| CH469358A (de) | 1969-02-28 |
| AT280349B (de) | 1970-04-10 |
| GB1208574A (en) | 1970-10-14 |
| BE704674A (fr) | 1968-04-04 |