FR1521440A - Connecteurs décalqués et méthodes pour établir des connexions décalquées sur des dispositifs semi-conducteurs - Google Patents

Connecteurs décalqués et méthodes pour établir des connexions décalquées sur des dispositifs semi-conducteurs

Info

Publication number
FR1521440A
FR1521440A FR8355A FR06008355A FR1521440A FR 1521440 A FR1521440 A FR 1521440A FR 8355 A FR8355 A FR 8355A FR 06008355 A FR06008355 A FR 06008355A FR 1521440 A FR1521440 A FR 1521440A
Authority
FR
France
Prior art keywords
staggered
methods
semiconductor devices
connectors
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8355A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1521440A publication Critical patent/FR1521440A/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR8355A 1966-03-09 1967-02-14 Connecteurs décalqués et méthodes pour établir des connexions décalquées sur des dispositifs semi-conducteurs Expired FR1521440A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53307366A 1966-03-09 1966-03-09

Publications (1)

Publication Number Publication Date
FR1521440A true FR1521440A (fr) 1968-04-19

Family

ID=24124356

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8355A Expired FR1521440A (fr) 1966-03-09 1967-02-14 Connecteurs décalqués et méthodes pour établir des connexions décalquées sur des dispositifs semi-conducteurs

Country Status (7)

Country Link
US (1) US3614832A (https=)
CH (1) CH448198A (https=)
DE (1) DE1591186B1 (https=)
FR (1) FR1521440A (https=)
GB (1) GB1162184A (https=)
NL (1) NL149674B (https=)
SE (1) SE345343B (https=)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2057126C3 (de) * 1970-05-14 1975-11-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
FR2150214A1 (https=) * 1971-08-20 1973-04-06 Thomson Csf
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
JPS49131863U (https=) * 1973-03-10 1974-11-13
JPS5429239B2 (https=) * 1974-12-04 1979-09-21
US4062107A (en) * 1976-07-14 1977-12-13 U.S. Philips Corporation Method of manufacturing infra-red detector
CH645208A5 (de) * 1978-10-31 1984-09-14 Bbc Brown Boveri & Cie Verfahren zur herstellung von elektrischen kontakten an halbleiterbauelementen.
EP0015100B1 (en) * 1979-02-26 1983-08-17 National Research Development Corporation Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
DE3005662C2 (de) * 1980-02-15 1983-10-27 G. Rau GmbH & Co, 7530 Pforzheim Verfahren zur Herstellung eines Kontaktelementes
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
US4508402A (en) * 1981-02-27 1985-04-02 Sharp Kabushiki Kaisha Integrated circuit package and display panel
US4404453A (en) * 1981-09-10 1983-09-13 Asta, Ltd. Laser bonding of microelectronic circuits
US4635354A (en) * 1982-07-22 1987-01-13 Texas Instruments Incorporated Low cost electronic apparatus construction method
EP0117348B1 (en) * 1982-12-06 1987-03-11 The Welding Institute Bonding leads to semiconductor devices
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
US4531044A (en) * 1983-01-24 1985-07-23 Ford Motor Company Method of laser soldering
JPS60500204A (ja) * 1983-01-24 1985-02-21 フオ−ド　モ−タ−　カンパニ− レ−ザはんだ付け法
US4527330A (en) * 1983-08-08 1985-07-09 Motorola, Inc. Method for coupling an electronic device into an electrical circuit
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component
US4645114A (en) * 1985-06-17 1987-02-24 Northern Telecom Limited Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads
DE3534502A1 (de) * 1985-09-27 1987-04-09 Licentia Gmbh Verfahren zum herstellen einer klebekontaktierung
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS62169434A (ja) * 1986-01-22 1987-07-25 Sharp Corp Ｌｓｉ搭載方式
US4780795A (en) * 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
GB8620057D0 (en) * 1986-08-18 1986-10-01 Philips Nv Cathode ray tube display device
US4884122A (en) * 1988-08-05 1989-11-28 General Electric Company Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
US4937203A (en) * 1986-09-26 1990-06-26 General Electric Company Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
US4945399A (en) * 1986-09-30 1990-07-31 International Business Machines Corporation Electronic package with integrated distributed decoupling capacitors
US4704304A (en) * 1986-10-27 1987-11-03 International Business Machines Corporation Method for repair of opens in thin film lines on a substrate
US4744008A (en) * 1986-11-18 1988-05-10 International Business Machines Corporation Flexible film chip carrier with decoupling capacitors
DE3641353A1 (de) * 1986-12-03 1988-06-09 Schoeller & Co Elektrotech Einrichtung zur kontaktierung von anschluessen
US4766670A (en) * 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
US4855867A (en) * 1987-02-02 1989-08-08 International Business Machines Corporation Full panel electronic packaging structure
US4755866A (en) * 1987-02-27 1988-07-05 United Technologies Corporation Electronic circuit module
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
US4892245A (en) * 1988-11-21 1990-01-09 Honeywell Inc. Controlled compression furnace bonding
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5170029A (en) * 1990-04-19 1992-12-08 Matsushita Electric Works, Ltd. Energy-beam welding method
GB2244374B (en) * 1990-05-22 1994-10-05 Stc Plc Improvements in hybrid circuits
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
IT1242420B (it) * 1990-09-03 1994-03-04 Ri Co Srl Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
US5444300A (en) * 1991-08-09 1995-08-22 Sharp Kabushiki Kaisha Semiconductor apparatus with heat sink
JP2702839B2 (ja) * 1991-11-20 1998-01-26 シャープ株式会社 配線基板の電極構造
EP0547807A3 (en) * 1991-12-16 1993-09-22 General Electric Company Packaged electronic system
US5240166A (en) * 1992-05-15 1993-08-31 International Business Machines Corporation Device for thermally enhanced ultrasonic bonding with localized heat pulses
US5604831A (en) * 1992-11-16 1997-02-18 International Business Machines Corporation Optical module with fluxless laser reflow soldered joints
US5289632A (en) * 1992-11-25 1994-03-01 International Business Machines Corporation Applying conductive lines to integrated circuits
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
US5457878A (en) * 1993-10-12 1995-10-17 Lsi Logic Corporation Method for mounting integrated circuit chips on a mini-board
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5904868A (en) * 1994-06-16 1999-05-18 International Business Machines Corporation Mounting and/or removing of components using optical fiber tools
US5567648A (en) * 1994-08-29 1996-10-22 Motorola, Inc. Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US5929517A (en) 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6030856A (en) * 1996-06-10 2000-02-29 Tessera, Inc. Bondable compliant pads for packaging of a semiconductor chip and method therefor
KR0185570B1 (ko) * 1996-07-15 1999-03-20 김광호 칩 스케일 패키지의 제조 방법
US6075711A (en) * 1996-10-21 2000-06-13 Alpine Microsystems, Inc. System and method for routing connections of integrated circuits
US6686015B2 (en) 1996-12-13 2004-02-03 Tessera, Inc. Transferable resilient element for packaging of a semiconductor chip and method therefor
US5937276A (en) * 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US5877555A (en) * 1996-12-20 1999-03-02 Ericsson, Inc. Direct contact die attach
US6294407B1 (en) 1998-05-06 2001-09-25 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
US6510606B2 (en) 1998-06-15 2003-01-28 Lockheed Martin Corporation Multichip module
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
SE517944C2 (sv) * 2000-04-06 2002-08-06 Ericsson Telefon Ab L M Förfarande och styrelement för fastsättning av ett mönsterkort på ett element
SE518778C2 (sv) * 2000-04-19 2002-11-19 Ericsson Telefon Ab L M Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
DE10297316T5 (de) * 2001-10-09 2004-12-09 Tessera, Inc., San Jose Gestapelte Baugruppen
US7335995B2 (en) 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US6977440B2 (en) 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US20040152242A1 (en) * 2003-01-30 2004-08-05 Wong Chun Kit Device package utilizing interconnect strips to make connections between package and die
US7288472B2 (en) * 2004-12-21 2007-10-30 Intel Corporation Method and system for performing die attach using a flame
KR100651563B1 (ko) * 2005-07-07 2006-11-29 삼성전기주식회사 전자부품이 내장된 배선기판의 제조방법
WO2011129130A1 (ja) * 2010-04-15 2011-10-20 古河電気工業株式会社 基板および基板の製造方法
WO2015043495A1 (zh) * 2013-09-30 2015-04-02 南通富士通微电子股份有限公司 晶圆封装结构和封装方法
US9296056B2 (en) * 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
US10507541B2 (en) * 2017-02-14 2019-12-17 John Nelson Soldering jig assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156457B (de) * 1961-07-08 1963-10-31 Telefunken Patent Verfahren zur Herstellung einer integrierten Schaltungsanordnung
GB1044689A (en) * 1962-09-21 1966-10-05 Standard Telephones Cables Ltd Improvements in or relating to mountings for semi-conductor devices
DE1931563U (de) * 1965-10-29 1966-01-27 Bbc Brown Boveri & Cie Modulleiste fuer ein aufbausystem fuer integrierte schaltungen.

Also Published As

Publication number Publication date
SE345343B (https=) 1972-05-23
US3614832A (en) 1971-10-26
GB1162184A (en) 1969-08-20
NL149674B (nl) 1976-05-17
DE1591186B1 (de) 1971-01-14
CH448198A (de) 1967-12-15
NL6703605A (https=) 1967-09-11

Similar Documents

Publication Publication Date Title
FR1521440A (fr) Connecteurs décalqués et méthodes pour établir des connexions décalquées sur des dispositifs semi-conducteurs
FR1533862A (fr) Boîtiers de connecteurs électriques
CH435458A (fr) Procédé pour établir des connexions sur des dispositifs semi-conducteurs
CH474851A (de) Halbleiteranordnung
CH464309A (de) Elektrische Steckverbindungseinrichtung
FR1497548A (fr) Dispositif semi-conducteur bistable pour courants forts
FI44643C (fi) Sähköliitin
GB1120073A (en) Semiconductor device
CH438497A (de) Halbleiteranordnung
FR1517116A (fr) Dispositif pour la production de champs électriques
FR1444297A (fr) Circuits et dispositifs semi-conducteurs, et procédés pour améliorer les caractéristiques électriques de ces derniers
FR1471497A (fr) Goulotte perfectionnée pour câbles
CH469357A (de) Halbleiteranordnung
AT286947B (de) Agglomeriervorrichtung
FR1508317A (fr) Dispositif de contact pour connecteurs électriques
AT273317B (de) Elektrodurchführung
CH474861A (de) Steuerbare bistabile Halbleiteranordnung
GB1117299A (en) Semiconductor devices
FR1545115A (fr) Boîtier isolant pour connecteur
FR1529360A (fr) Dispositifs semi-conducteurs
FR1510111A (fr) Conducteur pour cryotransformateur
FR1494458A (fr) Appareil perfectionné pour installations électriques
CH484520A (de) Halbleitervorrichtung
AU406230B2 (en) Electrical apparatus having semiconductor devices therein
AU1916167A (en) Electrical apparatus having semiconductor devices therein